Vishay Siliconix SI6463BDQ-T1-E3
- Part Number:
- SI6463BDQ-T1-E3
- Manufacturer:
- Vishay Siliconix
- Ventron No:
- 2490247-SI6463BDQ-T1-E3
- Description:
- MOSFET P-CH 20V 6.2A 8-TSSOP
- Datasheet:
- SI6463BDQ-T1-E3
Vishay Siliconix SI6463BDQ-T1-E3 technical specifications, attributes, parameters and parts with similar specifications to Vishay Siliconix SI6463BDQ-T1-E3.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case8-TSSOP (0.173, 4.40mm Width)
- Number of Pins8
- PackagingCut Tape (CT)
- SeriesTrenchFET®
- Published2008
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- ECCN CodeEAR99
- Resistance15mOhm
- Terminal FinishMatte Tin (Sn)
- Max Operating Temperature150°C
- Min Operating Temperature-55°C
- SubcategoryOther Transistors
- Max Power Dissipation1.05W
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)260
- Time@Peak Reflow Temperature-Max (s)30
- Pin Count8
- Number of Elements1
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Power Dissipation1.05W
- Turn On Delay Time35 ns
- FET TypeP-Channel
- Rds On (Max) @ Id, Vgs15m Ω @ 7.4A, 4.5V
- Vgs(th) (Max) @ Id800mV @ 250μA
- Current - Continuous Drain (Id) @ 25°C6.2A Ta
- Gate Charge (Qg) (Max) @ Vgs60nC @ 5V
- Rise Time40ns
- Drain to Source Voltage (Vdss)20V
- Fall Time (Typ)40 ns
- Turn-Off Delay Time190 ns
- Continuous Drain Current (ID)-7.4A
- Gate to Source Voltage (Vgs)8V
- Drain Current-Max (Abs) (ID)6.2A
- Drain to Source Breakdown Voltage-20V
- Height1.0414mm
- Length4.4958mm
- Width3.0988mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
SI6463BDQ-T1-E3 Overview
This device conducts a continuous drain current (ID) of -7.4A, which is the maximum continuous current transistor can conduct.Using VGS=-20V and a specified value of ID, the drain-source breakdown voltage is VDS at which a specified value of ID flows. This device has a drain-source breakdown voltage of -20V (that is, no charge flow from drain to source).The drain current is the maximum continuous current this device can conduct, which is 6.2A.When the device is turned off, a turn-off delay time of 190 ns occurs as the input capacitance charges before drain current conduction commences.Before drain current conduction can begin, the device's turning-on delay time takes time to charge its input capacitance. This delay time is 35 ns.Voltage at the gate-source terminal of a FET transistor, called the gate-source voltage, or VGS, can be 8V.This transistor requires a drain-source voltage (Vdss) of 20V.
SI6463BDQ-T1-E3 Features
a continuous drain current (ID) of -7.4A
a drain-to-source breakdown voltage of -20V voltage
the turn-off delay time is 190 ns
a 20V drain to source voltage (Vdss)
SI6463BDQ-T1-E3 Applications
There are a lot of Vishay Siliconix
SI6463BDQ-T1-E3 applications of single MOSFETs transistors.
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
This device conducts a continuous drain current (ID) of -7.4A, which is the maximum continuous current transistor can conduct.Using VGS=-20V and a specified value of ID, the drain-source breakdown voltage is VDS at which a specified value of ID flows. This device has a drain-source breakdown voltage of -20V (that is, no charge flow from drain to source).The drain current is the maximum continuous current this device can conduct, which is 6.2A.When the device is turned off, a turn-off delay time of 190 ns occurs as the input capacitance charges before drain current conduction commences.Before drain current conduction can begin, the device's turning-on delay time takes time to charge its input capacitance. This delay time is 35 ns.Voltage at the gate-source terminal of a FET transistor, called the gate-source voltage, or VGS, can be 8V.This transistor requires a drain-source voltage (Vdss) of 20V.
SI6463BDQ-T1-E3 Features
a continuous drain current (ID) of -7.4A
a drain-to-source breakdown voltage of -20V voltage
the turn-off delay time is 190 ns
a 20V drain to source voltage (Vdss)
SI6463BDQ-T1-E3 Applications
There are a lot of Vishay Siliconix
SI6463BDQ-T1-E3 applications of single MOSFETs transistors.
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
SI6463BDQ-T1-E3 More Descriptions
P-CH MOSFET TSSOP-8 20V 15MOHM @ 4.5V | Siliconix / Vishay SI6463BDQ-T1-E3
Trans MOSFET P-CH 20V 6.2A 8-Pin TSSOP T/R
P-Channel MOSFETs 20V 7.5A 1.5W
Trans MOSFET P-CH 20V 6.2A 8-Pin TSSOP T/R
P-Channel MOSFETs 20V 7.5A 1.5W
The three parts on the right have similar specifications to SI6463BDQ-T1-E3.
-
ImagePart NumberManufacturerMountMounting TypePackage / CaseNumber of PinsPackagingSeriesPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeResistanceTerminal FinishMax Operating TemperatureMin Operating TemperatureSubcategoryMax Power DissipationTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Pin CountNumber of ElementsElement ConfigurationOperating ModePower DissipationTurn On Delay TimeFET TypeRds On (Max) @ Id, VgsVgs(th) (Max) @ IdCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrain to Source Voltage (Vdss)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Gate to Source Voltage (Vgs)Drain Current-Max (Abs) (ID)Drain to Source Breakdown VoltageHeightLengthWidthRadiation HardeningRoHS StatusLead FreeSupplier Device PackageWeightOperating TemperatureNumber of ChannelsPower Dissipation-MaxDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Drain to Source ResistanceRds On MaxNominal VgsREACH SVHCTransistor Element MaterialThreshold VoltageView Compare
-
SI6463BDQ-T1-E3Surface MountSurface Mount8-TSSOP (0.173, 4.40mm Width)8Cut Tape (CT)TrenchFET®2008e3yesObsolete1 (Unlimited)8EAR9915mOhmMatte Tin (Sn)150°C-55°COther Transistors1.05WMOSFET (Metal Oxide)DUALGULL WING2603081SingleENHANCEMENT MODE1.05W35 nsP-Channel15m Ω @ 7.4A, 4.5V800mV @ 250μA6.2A Ta60nC @ 5V40ns20V40 ns190 ns-7.4A8V6.2A-20V1.0414mm4.4958mm3.0988mmNoROHS3 CompliantLead Free--------------
-
Surface MountSurface Mount8-TSSOP (0.173, 4.40mm Width)8Tape & Reel (TR)TrenchFET®2011--Obsolete1 (Unlimited)----150°C-55°C--MOSFET (Metal Oxide)-----1Single-1.08W35 nsN-Channel9mOhm @ 11A, 10V600mV @ 250μA8.6A Ta48nC @ 4.5V35ns30V35 ns100 ns8.6A12V-30V1mm3mm4.4mm-ROHS3 Compliant-8-TSSOP157.991892mg-55°C~150°C TJ11.08W Ta2.5V 10V±12V9mOhm9 mΩ600 mVUnknown--
-
Surface MountSurface Mount8-TSSOP (0.173, 4.40mm Width)8Tape & Reel (TR)-2011e3yesObsolete1 (Unlimited)8EAR9940mOhmMatte Tin (Sn)--Other Transistors-MOSFET (Metal Oxide)DUALGULL WING2604081SingleENHANCEMENT MODE-45 nsP-Channel40m Ω @ 4.8A, 4.5V1.5V @ 250μA4A Ta15nC @ 4.5V60ns12V60 ns70 ns-4.8A8V4A----NoROHS3 CompliantLead Free---55°C~150°C TJ-1.05W Ta2.5V 4.5V±8V---600 mVUnknownSILICON-
-
Surface MountSurface Mount8-TSSOP (0.173, 4.40mm Width)8Tape & Reel (TR)-2016e3yesObsolete1 (Unlimited)8EAR9940MOhmMATTE TIN--Other Transistors-MOSFET (Metal Oxide)DUALGULL WING2604081SingleENHANCEMENT MODE1.05W45 nsP-Channel40m Ω @ 4.8A, 4.5V1.5V @ 250μA4A Ta15nC @ 4.5V60ns-60 ns70 ns-4.8A8V4A12V---NoROHS3 CompliantLead Free---55°C~150°C TJ-1.05W Ta2.5V 4.5V±8V---1.5 VUnknownSILICON-1.5V
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
29 March 2024
STM32H743VIT6 Specifications, Characteristics, Pinout and Market Situation
Ⅰ. Description of STM32H743VIT6Ⅱ. Specifications of STM32H743VIT6Ⅲ. Characteristics of STM32H743VIT6Ⅳ. How to use STM32H743VIT6?Ⅴ. STM32H743VIT6 pinoutⅥ. Low-power strategy of STM32H743VIT6Ⅶ. Market situation of STM32H743VIT6Ⅰ. Description of STM32H743VIT6The STM32H743VIT6... -
01 April 2024
XCF32PFSG48C Symbol, Manufacturer, Specifications and Programming
Ⅰ. Overview of XCF32PFSG48CⅡ. Symbol, footprint and 3D model of XCF32PFSG48CⅢ. Manufacturer of XCF32PFSG48CⅣ. Reset and power-on reset activationⅤ. Specifications of XCF32PFSG48CⅥ. Programming of XCF32PFSG48CⅦ. In which emerging... -
01 April 2024
M24C16-RMN6TP Structure, Advantages, Package and Other Details
Ⅰ. M24C16-RMN6TP descriptionⅡ. Basic structure and working principle of M24C16-RMN6TPⅢ. Technical parameters of M24C16-RMN6TPⅣ. What are the market competitive advantages of M24C16-RMN6TP?Ⅴ. Package of M24C16-RMN6TPⅥ. Data transmission process... -
02 April 2024
TPS54202DDCR Alternatives, Characteristics, Layout and TPS54202DDCR vs TPS54202DDCT
Ⅰ. What is TPS54202DDCR?Ⅱ. Functional modes of TPS54202DDCRⅢ. Characteristics of TPS54202DDCRⅣ. How to reduce the noise of TPS54202DDCR?Ⅴ. Comparison between TPS54202DDCR and TPS54202DDCTⅥ. Layout of TPS54202DDCRⅦ. How to...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.