Vishay Siliconix SI5461EDC-T1-E3
- Part Number:
- SI5461EDC-T1-E3
- Manufacturer:
- Vishay Siliconix
- Ventron No:
- 3554558-SI5461EDC-T1-E3
- Description:
- MOSFET P-CH 20V 4.5A CHIPFET
- Datasheet:
- SI5461EDC-T1-E3
Vishay Siliconix SI5461EDC-T1-E3 technical specifications, attributes, parameters and parts with similar specifications to Vishay Siliconix SI5461EDC-T1-E3.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case8-SMD, Flat Lead
- Number of Pins8
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~150°C TJ
- PackagingTape & Reel (TR)
- Published2009
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- ECCN CodeEAR99
- Resistance45mOhm
- Terminal FinishMATTE TIN
- SubcategoryOther Transistors
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionDUAL
- Terminal FormC BEND
- Peak Reflow Temperature (Cel)260
- Time@Peak Reflow Temperature-Max (s)40
- Pin Count8
- Number of Elements1
- Power Dissipation-Max1.3W Ta
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Power Dissipation1.3W
- Turn On Delay Time2.5 μs
- FET TypeP-Channel
- Rds On (Max) @ Id, Vgs45m Ω @ 5A, 4.5V
- Vgs(th) (Max) @ Id450mV @ 250μA (Min)
- Current - Continuous Drain (Id) @ 25°C4.5A Ta
- Gate Charge (Qg) (Max) @ Vgs20nC @ 4.5V
- Rise Time4.5μs
- Drain to Source Voltage (Vdss)20V
- Drive Voltage (Max Rds On,Min Rds On)1.8V 4.5V
- Vgs (Max)±12V
- Fall Time (Typ)4.5 μs
- Turn-Off Delay Time27 μs
- Continuous Drain Current (ID)-6.2A
- Gate to Source Voltage (Vgs)12V
- Drain Current-Max (Abs) (ID)4.5A
- Drain to Source Breakdown Voltage-20V
- Height1.0922mm
- Length3.0988mm
- Width1.7018mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
SI5461EDC-T1-E3 Overview
This device conducts a continuous drain current (ID) of -6.2A, which is the maximum continuous current transistor can conduct.Using VGS=-20V and a specified value of ID, the drain-source breakdown voltage is VDS at which a specified value of ID flows. This device has a drain-source breakdown voltage of -20V (that is, no charge flow from drain to source).The drain current is the maximum continuous current this device can conduct, which is 4.5A.When the device is turned off, a turn-off delay time of 27 μs occurs as the input capacitance charges before drain current conduction commences.Before drain current conduction can begin, the device's turning-on delay time takes time to charge its input capacitance. This delay time is 2.5 μs.Voltage at the gate-source terminal of a FET transistor, called the gate-source voltage, or VGS, can be 12V.This transistor requires a drain-source voltage (Vdss) of 20V.In order to reduce power consumption, this device uses a drive voltage of 1.8V 4.5V volts (1.8V 4.5V).
SI5461EDC-T1-E3 Features
a continuous drain current (ID) of -6.2A
a drain-to-source breakdown voltage of -20V voltage
the turn-off delay time is 27 μs
a 20V drain to source voltage (Vdss)
SI5461EDC-T1-E3 Applications
There are a lot of Vishay Siliconix
SI5461EDC-T1-E3 applications of single MOSFETs transistors.
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
This device conducts a continuous drain current (ID) of -6.2A, which is the maximum continuous current transistor can conduct.Using VGS=-20V and a specified value of ID, the drain-source breakdown voltage is VDS at which a specified value of ID flows. This device has a drain-source breakdown voltage of -20V (that is, no charge flow from drain to source).The drain current is the maximum continuous current this device can conduct, which is 4.5A.When the device is turned off, a turn-off delay time of 27 μs occurs as the input capacitance charges before drain current conduction commences.Before drain current conduction can begin, the device's turning-on delay time takes time to charge its input capacitance. This delay time is 2.5 μs.Voltage at the gate-source terminal of a FET transistor, called the gate-source voltage, or VGS, can be 12V.This transistor requires a drain-source voltage (Vdss) of 20V.In order to reduce power consumption, this device uses a drive voltage of 1.8V 4.5V volts (1.8V 4.5V).
SI5461EDC-T1-E3 Features
a continuous drain current (ID) of -6.2A
a drain-to-source breakdown voltage of -20V voltage
the turn-off delay time is 27 μs
a 20V drain to source voltage (Vdss)
SI5461EDC-T1-E3 Applications
There are a lot of Vishay Siliconix
SI5461EDC-T1-E3 applications of single MOSFETs transistors.
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
SI5461EDC-T1-E3 More Descriptions
MOSFET; P-CH, 20V(D-S) 45MOHM CHIPFET | Siliconix / Vishay SI5461EDC-T1-E3
Trans MOSFET P-CH 20V 4.5A 8-Pin Chip FET T/R
P-Channel MOSFETs 20V 6.2A 2.5W
MOSFET; Transistor Type:MOSFET; Transistor Polarity:P Channel; Drain Source Voltage, Vds:-20V; Continuous Drain Current, Id:-6.2A; On Resistance, Rds(on):45mohm; Rds(on) Test Voltage, Vgs:-4.5V; Package/Case:1206-8 ChipFET ;RoHS Compliant: Yes
Trans MOSFET P-CH 20V 4.5A 8-Pin Chip FET T/R
P-Channel MOSFETs 20V 6.2A 2.5W
MOSFET; Transistor Type:MOSFET; Transistor Polarity:P Channel; Drain Source Voltage, Vds:-20V; Continuous Drain Current, Id:-6.2A; On Resistance, Rds(on):45mohm; Rds(on) Test Voltage, Vgs:-4.5V; Package/Case:1206-8 ChipFET ;RoHS Compliant: Yes
The three parts on the right have similar specifications to SI5461EDC-T1-E3.
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ImagePart NumberManufacturerMountMounting TypePackage / CaseNumber of PinsTransistor Element MaterialOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeResistanceTerminal FinishSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Pin CountNumber of ElementsPower Dissipation-MaxElement ConfigurationOperating ModePower DissipationTurn On Delay TimeFET TypeRds On (Max) @ Id, VgsVgs(th) (Max) @ IdCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrain to Source Voltage (Vdss)Drive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Gate to Source Voltage (Vgs)Drain Current-Max (Abs) (ID)Drain to Source Breakdown VoltageHeightLengthWidthRadiation HardeningRoHS StatusLead FreeSeriesVoltageCurrentInput Capacitance (Ciss) (Max) @ VdsFactory Lead TimeTransistor ApplicationDrain-source On Resistance-MaxPulsed Drain Current-Max (IDM)Supplier Device PackageWeightMax Operating TemperatureMin Operating TemperatureNumber of ChannelsDrain to Source ResistanceRds On MaxView Compare
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SI5461EDC-T1-E3Surface MountSurface Mount8-SMD, Flat Lead8SILICON-55°C~150°C TJTape & Reel (TR)2009e3yesObsolete1 (Unlimited)8EAR9945mOhmMATTE TINOther TransistorsMOSFET (Metal Oxide)DUALC BEND26040811.3W TaSingleENHANCEMENT MODE1.3W2.5 μsP-Channel45m Ω @ 5A, 4.5V450mV @ 250μA (Min)4.5A Ta20nC @ 4.5V4.5μs20V1.8V 4.5V±12V4.5 μs27 μs-6.2A12V4.5A-20V1.0922mm3.0988mm1.7018mmNoROHS3 CompliantLead Free----------------
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Surface MountSurface Mount8-SMD, Flat Lead8SILICON-55°C~150°C TJTape & Reel (TR)2009e3-Obsolete1 (Unlimited)8EAR9928mOhmMATTE TIN-MOSFET (Metal Oxide)DUALC BEND26040812.5W Ta 6.3W TcSingleENHANCEMENT MODE2.5W10 nsP-Channel28m Ω @ 5.6A, 4.5V1V @ 250μA6A Ta40nC @ 8V15ns-1.8V 4.5V±8V72 ns65 ns7.7A8V-12V1.0922mm3.0988mm1.7018mmNoROHS3 CompliantLead FreeTrenchFET®12V6A1400pF @ 6V-----------
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Surface MountSurface Mount8-SMD, Flat Lead8SILICON-55°C~150°C TJTape & Reel (TR)2013e3yesActive1 (Unlimited)8EAR99-MATTE TINFET General Purpose PowerMOSFET (Metal Oxide)DUALC BEND26040812.5W Ta 6.25W TcSingleENHANCEMENT MODE2.5W-N-Channel24m Ω @ 4.8A, 10V2.3V @ 250μA6A Tc32nC @ 10V38ns-4.5V 10V±25V9 ns26 ns6A25V6A30V---NoROHS3 Compliant-TrenchFET®--950pF @ 15V21 WeeksSWITCHING0.024Ohm40A-------
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Surface MountSurface Mount8-SMD, Flat Lead8--55°C~150°C TJTape & Reel (TR)2013--Obsolete1 (Unlimited)--27mOhm--MOSFET (Metal Oxide)------1.3W TaSingle--25 nsP-Channel27mOhm @ 5.9A, 4.5V1V @ 250μA5.9A Ta32nC @ 4.5V50ns12V1.8V 4.5V±8V90 ns145 ns5.9A8V--12V1.1mm3.05mm1.65mm-ROHS3 Compliant-TrenchFET®-------1206-8 ChipFET™84.99187mg150°C-55°C127mOhm27 mΩ
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