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MK64FN1M0CAJ12R

NXP USA Inc. MK64FN1M0CAJ12R

Part Number:
MK64FN1M0CAJ12R
Manufacturer:
NXP USA Inc.
Ventron No:
3151180-MK64FN1M0CAJ12R
Description:
IC MCU 32BIT 1MB FLASH 142WLCSP
ECAD Model:
Datasheet:
MK64FN1M0CAJ12R

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Specifications
NXP USA Inc. MK64FN1M0CAJ12R technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK64FN1M0CAJ12R.
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    142-UFBGA, WLCSP
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2014
  • Series
    Kinetis K60
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    142
  • ECCN Code
    3A991.A.2
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    0.4mm
  • Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PBGA-B142
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Oscillator Type
    Internal
  • Number of I/O
    100
  • Speed
    120MHz
  • RAM Size
    256K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LVD, POR, PWM, WDT
  • Clock Frequency
    50MHz
  • Program Memory Type
    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    1MB 1M x 8
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Bit Size
    32
  • Data Converter
    A/D 41x16b; D/A 2x12b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • Length
    5.58mm
  • Width
    4.84mm
  • RoHS Status
    ROHS3 Compliant
Description
MK64FN1M0CAJ12R Description
This product features a Surface Mount design, making it suitable for a variety of applications. It is packaged in Tape & Reel (TR), ensuring safe and efficient handling during transportation and storage. With an Active part status, customers can be assured of its availability and reliability. This product has 142 terminations, providing ample connectivity options. It operates at a Supply Voltage of 3.3V, making it suitable for low power applications. The JESD-30 Code for this product is R-PBGA-B142, indicating its compliance with industry standards. It has a Voltage - Supply (Vcc/Vdd) range of 1.71V~3.6V, providing flexibility in power supply options. Additionally, it features an ADC for accurate data conversion. With a compact size of 5.58mm x 4.84mm, this product offers high performance in a small form factor.

MK64FN1M0CAJ12R Features
SRAM memory
Easy development
Multiple peripherals
ARM Cortex-M4 core
Advanced security features
Power management features
Dual-panel flash memory support


MK64FN1M0CAJ12R Applications
Medical devices
Automotive systems
Smart energy systems
Consumer electronics
Networking and telecommunication
Industrial automation and control systems

MK64FN1M0CAJ12R More Descriptions
Kinetis K64: 120MHz Cortex-M4F MCU, 1MB Flash, 256KB SRAM, Full-Speed USB, Ethernet, 142-WLCSP,
MCU 32-Bit K64 ARM Cortex M4 RISC 1MB Flash 1.8V/2.5V/3.3V 142-Pin WLCSP T/R
RISC Microcontroller, FLASH, 120MHz, CMOS, PBGA142
ARM Microcontrollers - MCU 1MB Flash 120MHz WLCSP 142
IC MCU 32BIT 1MB FLASH 142WLCSP
Product Comparison
The three parts on the right have similar specifications to MK64FN1M0CAJ12R.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Clock Frequency
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Bit Size
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    DAC Channels
    Length
    Width
    RoHS Status
    JESD-609 Code
    Terminal Finish
    EEPROM Size
    View Compare
  • MK64FN1M0CAJ12R
    MK64FN1M0CAJ12R
    NXP USA Inc.
    16 Weeks
    Surface Mount
    142-UFBGA, WLCSP
    YES
    -40°C~85°C TA
    Tape & Reel (TR)
    2014
    Kinetis K60
    Active
    1 (Unlimited)
    142
    3A991.A.2
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    0.4mm
    40
    R-PBGA-B142
    3.6V
    1.71V
    Internal
    100
    120MHz
    256K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    1MB 1M x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    32
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    5.58mm
    4.84mm
    ROHS3 Compliant
    -
    -
    -
    -
  • MK64FX512VLL12
    MK64FX512VLL12
    NXP USA Inc.
    13 Weeks
    Surface Mount
    100-LQFP
    YES
    -40°C~105°C TA
    Tray
    2002
    Kinetis K60
    Active
    3 (168 Hours)
    100
    3A991.A.2
    8542.31.00.01
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    40
    S-PQFP-G100
    3.6V
    1.71V
    Internal
    66
    120MHz
    192K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    -
    A/D 32x16b; D/A 1x12b
    YES
    YES
    YES
    YES
    14mm
    14mm
    ROHS3 Compliant
    e3
    Matte Tin (Sn)
    4K x 8
    MK64FN1M0CAJ12R vs MK64FX512VLL12
  • MK64FX512VLQ12
    MK64FX512VLQ12
    NXP USA Inc.
    13 Weeks
    Surface Mount
    144-LQFP
    YES
    -40°C~105°C TA
    Tray
    2011
    Kinetis K60
    Active
    3 (168 Hours)
    144
    3A991.A.2
    8542.31.00.01
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    40
    S-PQFP-G144
    3.6V
    1.71V
    Internal
    100
    120MHz
    192K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    -
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    20mm
    20mm
    ROHS3 Compliant
    e3
    Matte Tin (Sn)
    4K x 8
    MK64FN1M0CAJ12R vs MK64FX512VLQ12
  • MK64FN1M0VLQ12
    MK64FN1M0VLQ12
    NXP USA Inc.
    13 Weeks
    Surface Mount
    144-LQFP
    YES
    -40°C~105°C TA
    Tray
    2012
    Kinetis K60
    Active
    3 (168 Hours)
    144
    3A991.A.2
    8542.31.00.01
    CMOS
    QUAD
    GULL WING
    NOT SPECIFIED
    3.3V
    0.5mm
    NOT SPECIFIED
    S-PQFP-G144
    3.6V
    1.71V
    Internal
    100
    120MHz
    256K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    1MB 1M x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    -
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    20mm
    20mm
    ROHS3 Compliant
    -
    -
    -
    MK64FN1M0CAJ12R vs MK64FN1M0VLQ12
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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