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NXP USA Inc. PK10N512VMD100

Part Number:

PK10N512VMD100

Manufacturer:

NXP USA Inc.

Ventron No:

8572212-PK10N512VMD100

Description:

512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller Kinetis K10 Series PK10N512 144-LBGA

ECAD Model:

Datasheet:

PK10N512VMD100

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Delivery:

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Specifications

NXP USA Inc. PK10N512VMD100 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. PK10N512VMD100.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    144-LBGA
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~105°C TA
  • Packaging
    Tray
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    Kinetis K10
  • Published
    2012
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Base Part Number
    PK10N512
  • Oscillator Type
    Internal
  • Number of I/O
    104
  • Speed

    Speed, in the context of electronic components, refers to the rate at which the component can process or transmit data. It is typically measured in units of bits per second (bps), megabits per second (Mbps), or gigabits per second (Gbps). The speed of a component is determined by its internal design and the technology used to manufacture it. Faster components can handle more data in a given amount of time, which can improve the overall performance of a system.

    100MHz
  • RAM Size
    128K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • Core Processor

    Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LVD, POR, PWM, WDT
  • Program Memory Type
    FLASH
  • Core Size

    Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

    32-Bit
  • Program Memory Size
    512KB 512K x 8
  • Connectivity

    Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

    CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
  • Data Converter
    A/D 37x16b; D/A 2x12b
  • RoHS Status
    ROHS3 Compliant

Description

PK10N512VMD100 Overview
The package is 144-LBGA-shaped. There are 104 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~105°C TA are operated by this Microcontroller. It is part of the Kinetis K10 series of electrical components. Having a size of 512KB 512K x 8, Microcontroller has a program memory of X bytes. A ARM® Cortex®-M4 Core Processor is at the core of this Microcontroller. Using the base part number PK10N512, you will be able to find alternatives for the part.

PK10N512VMD100 Features
144-LBGA package
Mounting type of Surface Mount


PK10N512VMD100 Applications
There are a lot of NXP USA Inc.
PK10N512VMD100 Microcontroller applications.


Instrument control
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
PK10N512VMD100 More Descriptions
MCU 32-Bit/64-Bit K10 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray
IC, 32BIT MCU, KINETIS K10, 100MHz, 144-MAPBGA; Controller Family/Series:(ARM Cortex); Core Size:32 bit; No. of I/O's:104; Program Memory Size:512KB; RAM Memory Size:128KB; CPU Speed:100MHz; Oscillator Type:External, Internal ;RoHS Compliant: Yes
MCU, KINETIS, K10, CORTEX M4, 144MAP; Controller Family/Series:(ARM Cortex - M4) Kinetis K10; Core Size:32bit; No. of I/O's:104; Supply Voltage Range:1.71V to 3.6V; Digital IC Case Style:MAPBGA; No. of Pins:121; Program Memory Size:512KB; RAM Memory Size:128KB; CPU Speed:100MHz; Oscillator Type:External, Internal; No. of Timers:3; Peripherals:ADC, Comparator, DAC, DMA, PWM, Timer; Embedded Interface Type:CAN, I2C, I2S, SPI, UART; Operating Temperature Range:-40°C to 105°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012)

Product Comparison

The three parts on the right have similar specifications to PK10N512VMD100.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Series
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Base Part Number
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    Core Processor
    Peripherals
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Data Converter
    RoHS Status
    View Compare
  • PK10N512VMD100
    PK10N512VMD100
    Surface Mount
    144-LBGA
    -40°C~105°C TA
    Tray
    Kinetis K10
    2012
    Obsolete
    3 (168 Hours)
    PK10N512
    Internal
    104
    100MHz
    128K x 8
    1.71V~3.6V
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
    A/D 37x16b; D/A 2x12b
    ROHS3 Compliant
    -
  • PK10N512VLL100
    Surface Mount
    100-LQFP
    -40°C~105°C TA
    Tray
    Kinetis K10
    2012
    Obsolete
    3 (168 Hours)
    PK10N512
    Internal
    70
    100MHz
    128K x 8
    1.71V~3.6V
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
    A/D 29x16b; D/A 1x12b
    ROHS3 Compliant
  • PK10N512VLK100
    Surface Mount
    80-LQFP
    -40°C~105°C TA
    Tray
    Kinetis K10
    2012
    Obsolete
    3 (168 Hours)
    PK10N512
    Internal
    56
    100MHz
    128K x 8
    1.71V~3.6V
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
    A/D 27x16b; D/A 1x12b
    ROHS3 Compliant
  • PK10N512VLQ100
    Surface Mount
    144-LQFP
    -40°C~105°C TA
    Tray
    Kinetis K10
    2012
    Obsolete
    3 (168 Hours)
    PK10N512
    Internal
    104
    100MHz
    128K x 8
    1.71V~3.6V
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
    A/D 37x16b; D/A 2x12b
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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