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NXP USA Inc. P89LPC921FDH,518

Part Number:

P89LPC921FDH,518

Manufacturer:

NXP USA Inc.

Ventron No:

8572220-P89LPC921FDH,518

Description:

4KB 4K x 8 FLASH 8051 8-Bit Microcontroller LPC900 Series P89LPC92* 20-TSSOP (0.173, 4.40mm Width)

ECAD Model:

Datasheet:

P89LPC921FDH,518

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Delivery:

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Specifications

NXP USA Inc. P89LPC921FDH,518 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. P89LPC921FDH,518.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    20-TSSOP (0.173, 4.40mm Width)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    LPC900
  • Published
    2003
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    2 (1 Year)
  • Base Part Number
    P89LPC92*
  • Pin Count
    20
  • Oscillator Type
    Internal
  • Number of I/O
    18
  • Speed

    Speed, in the context of electronic components, refers to the rate at which the component can process or transmit data. It is typically measured in units of bits per second (bps), megabits per second (Mbps), or gigabits per second (Gbps). The speed of a component is determined by its internal design and the technology used to manufacture it. Faster components can handle more data in a given amount of time, which can improve the overall performance of a system.

    18MHz
  • RAM Size
    256 x 8
  • Voltage - Supply (Vcc/Vdd)
    2.4V~3.6V
  • Core Processor

    Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

    8051
  • Peripherals
    Brown-out Detect/Reset, LED, POR, PWM, WDT
  • Program Memory Type
    FLASH
  • Core Size

    Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

    8-Bit
  • Program Memory Size
    4KB 4K x 8
  • Connectivity

    Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

    I2C, UART/USART
  • Source Url Status Check Date
    2013-06-14 00:00:00
  • RoHS Status
    ROHS3 Compliant

Description

P89LPC921FDH,518 Overview
In a 20-TSSOP (0.173, 4.40mm Width) package, the MCU is available. 18 I/Os are available. The Microcontroller has a mounting type of Surface Mount, which indicates that it is mounted conveniently. The 8-Bit core is the core of the MCU. There is a FLASH type of memory for its program. There is a temperature range of -40°C~85°C TA that is operated by this Microcontroller. LPC900 series components make up this electrical component. 4KB 4K x 8 is the size of its program memory. A 8051 Core processor is used to power the device. The base part number P89LPC92* can be used to find alternatives. There are 20 pins on it.

P89LPC921FDH,518 Features
20-TSSOP (0.173, 4.40mm Width) package
Mounting type of Surface Mount


P89LPC921FDH,518 Applications
There are a lot of NXP USA Inc.
P89LPC921FDH,518 Microcontroller applications.


Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio
Entertainment products
P89LPC921FDH,518 More Descriptions
MCU 8-bit P89 80C51 CISC 4KB Flash 2.5V/3.3V 20-Pin TSSOP T/R
IC 80C51 MCU 4KB FLASH 20TSSOP
IC OP AMP PREC 2 CIRC 8SOIC

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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