MK64FX512VLQ12

NXP USA Inc. MK64FX512VLQ12

Part Number:
MK64FX512VLQ12
Manufacturer:
NXP USA Inc.
Ventron No:
3140577-MK64FX512VLQ12
Description:
IC MCU 32BIT 512KB FLASH 144LQFP
ECAD Model:
Datasheet:
MK64FX512VLQ12

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Specifications
NXP USA Inc. MK64FX512VLQ12 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK64FX512VLQ12.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LQFP
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    2011
  • Series
    Kinetis K60
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Matte Tin (Sn)
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    S-PQFP-G144
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Oscillator Type
    Internal
  • Number of I/O
    100
  • Speed
    120MHz
  • RAM Size
    192K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LVD, POR, PWM, WDT
  • Clock Frequency
    50MHz
  • Program Memory Type
    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    512KB 512K x 8
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Data Converter
    A/D 41x16b; D/A 2x12b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • EEPROM Size
    4K x 8
  • Length
    20mm
  • Width
    20mm
  • RoHS Status
    ROHS3 Compliant
Description
MK64FX512VLQ12            Description     K64 product family members are optimized for cost-sensitive applications that require low power consumption, USB/ Ethernet connectivity, and up to 256 KB embedded SRAM. These devices have the full support and scalability of the Kinetis series. The product provides: running power consumption as low as 250MHzA/ μ. The static power consumption is reduced to 5.80 μ A, full state holding and 5 μ wake-up. The lowest static mode is as low as 339 nA ·USB LS/FS OTG 2.0.It supports embedded 3.3V and 120mA LDO VREG, supports 10 Mbit/s 100 Mbit/s Ethernet MAC without crystal operation for USB devices, and supports MII and RMII interfaces.  
The manufacturer of this component is NXP USA Inc. It is a type of microcontroller chip designed for embedded systems, specifically in the category of embedded microcontrollers. The package or case for this chip is 144-LQFP, and it belongs to the Kinetis K60 series. It has a total of 144 terminations, and the peak reflow temperature for this chip is 260 degrees Celsius. The terminal pitch, or distance between each terminal, is 0.5mm. This chip falls under the category of microcontroller, RISC, and has a 32-bit core size. It also includes a data converter with A/D (analog-to-digital) capabilities of 41x16 bits and D/A (digital-to-analog) capabilities of 2x12 bits. Additionally, this chip has YES for DAC (digital-to-analog converter) channels and an EEPROM (electrically erasable programmable read-only memory) size of 4K x 8.
Performance ? Up to 120 MHz ARM? Cortex?-M4 core with DSP instructions and floating point unit Memories and memory interfaces ? Up to 1 MB program flash memory and 256 KB RAM ? Upto 128 KB FlexNVM and 4 KB FlexRAM on devices with FlexMemory ? FlexBus external bus interface System peripherals ? Multiple low-power modes, low-leakage wake-up unit ? Memory protection unit with multi-master protection ? 16-channel DMA controller ? External watchdog monitor and software watchdog Security and integrity modules ? Hardware CRC module ? Hardware random-number generator ? Hardware encryption supporting DES, 3DES, AES, MD5, SHA-1, and SHA-256 algorithms ? 128-bit unique identification (ID) number per chip Analog modules ? Two 16-bit SAR ADCs ? Two 12-bit DACs ? Three analog comparators (CMP) ? Voltage reference  
MK64FX512VLQ12                 Applications System modules  
MK64FX512VLQ12 More Descriptions
MCU 32-bit K64 ARM Cortex M4 RISC 512KB Flash 2.5V/3.3V 144-Pin LQFP Tray
Kinetis K64 Series 512 kB Flash 192 kB RAM 32-Bit SMT Microcontroller - LQFP-144
KINETIS K 32-BIT MCU, ARM CORTEX-M4 CORE, 512KB FLASH, 120MH
IC,MCU,3.6V,flash 512 KB, 256KB SRAM, max 120MHz,LQFP-144
MCU, 32BIT, ARM CORTEX-M4, 120MHZ, LQFP; Product Range:Kinetis K Family K6x Series Microcontrollers; Architecture:ARM Cortex-M4; No. of Bits:32bit;
MCU, 32BIT, ARM CORTEX-M4, 120MHZ, LQFP; Product Range: Kinetis K Family K6x Series Microcontrollers; Architecture: ARM Cortex-M4; No. of Bits: 32bit; CPU Speed: 120MHz; Program Memory Size: 512KB; RAM Memory Size: 256KB; No. of Pins: 144Pins; MCU Case Style: LQFP; No. of I/O's: 100I/O's; Embedded Interface Type: CAN, Ethernet, I2C, I2S, SDHC, SPI, UART, USB; Supply Voltage Min: 1.71V; Supply Voltage Max: 3.6V; MCU Family: Kinetis K; MCU Series: K6x; MSL: MSL 3 - 168 hours; SVHC: No SVHC (15-Jan-2019)
Device Core = ARM® Cortex® M4 / Data Bus Width Bit = 32 / Instruction Set Architecture = RISC / Family Name = Kinetis / Clock Frequency Max. MHz = 120 / Program Memory Type = Flash / Program Memory Size KB = 512 / RAM Memory Size KB = 256 / Interfaces = Ethernet / Interfaces = USB / Interfaces = CAN / Interfaces = I²C / Interfaces = SPI / Interfaces = UART / Interfaces = I²S / Interfaces = SDHC / ADC Resolution Bit = 16 / DAC Resolution Bit = 12 / Number of Programmable I/Os = 100 / Number of Timers/Counters = 8 / Comparators = 3 / Supply Voltage Min. V = 1.71 / Supply Voltage Max. V = 3.6 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = LQFP / Pins = 144 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 20 / Width mm = 20 / Height mm = 1.4 / Reflow Temperature Max. °C = 260
Product Comparison
The three parts on the right have similar specifications to MK64FX512VLQ12.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Clock Frequency
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    DAC Channels
    EEPROM Size
    Length
    Width
    RoHS Status
    View Compare
  • MK64FX512VLQ12
    MK64FX512VLQ12
    13 Weeks
    Surface Mount
    144-LQFP
    YES
    -40°C~105°C TA
    Tray
    2011
    Kinetis K60
    e3
    Active
    3 (168 Hours)
    144
    3A991.A.2
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    40
    S-PQFP-G144
    3.6V
    1.71V
    Internal
    100
    120MHz
    192K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    4K x 8
    20mm
    20mm
    ROHS3 Compliant
    -
  • MK64FX512VLL12
    13 Weeks
    Surface Mount
    100-LQFP
    YES
    -40°C~105°C TA
    Tray
    2002
    Kinetis K60
    e3
    Active
    3 (168 Hours)
    100
    3A991.A.2
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    40
    S-PQFP-G100
    3.6V
    1.71V
    Internal
    66
    120MHz
    192K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 32x16b; D/A 1x12b
    YES
    YES
    YES
    YES
    4K x 8
    14mm
    14mm
    ROHS3 Compliant
  • MK64FN1M0VDC12
    13 Weeks
    Surface Mount
    121-XFBGA
    YES
    -40°C~105°C TA
    Tray
    2002
    Kinetis K60
    e1
    Active
    3 (168 Hours)
    121
    3A991.A.2
    TIN SILVER COPPER
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    -
    40
    S-PBGA-B121
    3.6V
    1.71V
    Internal
    83
    120MHz
    256K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    1MB 1M x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 37x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    -
    -
    -
    ROHS3 Compliant
  • MK64FN1M0VMD12
    13 Weeks
    Surface Mount
    144-LBGA
    YES
    -40°C~105°C TA
    Tray
    2002
    Kinetis K60
    e1
    Active
    3 (168 Hours)
    144
    3A991.A.2
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    0.5mm
    40
    S-PBGA-B144
    3.6V
    1.71V
    Internal
    100
    120MHz
    256K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    1MB 1M x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    -
    13mm
    13mm
    ROHS3 Compliant
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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