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MK64FN1M0VMD12

NXP USA Inc. MK64FN1M0VMD12

Part Number:
MK64FN1M0VMD12
Manufacturer:
NXP USA Inc.
Ventron No:
3135741-MK64FN1M0VMD12
Description:
IC MCU 32BIT 1MB FLASH 144MAPBGA
ECAD Model:
Datasheet:
MK64FN1M0VMD12

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Specifications
NXP USA Inc. MK64FN1M0VMD12 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK64FN1M0VMD12.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    2002
  • Series
    Kinetis K60
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    S-PBGA-B144
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Oscillator Type
    Internal
  • Number of I/O
    100
  • Speed
    120MHz
  • RAM Size
    256K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LVD, POR, PWM, WDT
  • Clock Frequency
    50MHz
  • Program Memory Type
    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    1MB 1M x 8
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Data Converter
    A/D 41x16b; D/A 2x12b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • Length
    13mm
  • Width
    13mm
  • RoHS Status
    ROHS3 Compliant
Description
MK64FN1M0VMD12 MCU Description


The MK64FN1M0VMD12 offers high memory densities, low power consumption, and optimum integration in an ultra-small package. It shares the Kinetis family's comprehensive enablement and scalability. The MK64FN1M0VMD12 which contains 256 KB SRAM and 1 MB of Flash, is best-in-class for low-power applications, with a power mode of 340 nA.


MK64FN1M0VMD12 MCU Features


Up to 1 MB program flash memory and 256 KB RAM
FlexBus external bus interface
16-channel DMA controller
Multiple low-power modes, low-leakage wakeup unit
3 to 32 MHz and 32 kHz crystal oscillator
48 MHz internal reference
Hardware CRC module
Ethernet controller with MII and RMII interface
Two 16-bit SAR ADCs
Voltage range: 1.71 to 3.6 V
Temperature range (ambient): –40 to 85°C
Two 8-channel FlexTimers (PWM/Motor Control)
Two 2-channel FlexTimer (Quad Decoder/PWM)


MK64FN1M0VMD12 MCU Applications


Consumer
Gaming systems
Wearables
Smart phone/tablet accessories
Connected meters
Smart-grid concentrators
Building and home automation
Connected security and access control
Smart thermostats
Point-of-sale and secure applications
Factory automation
Portable instrumentation
MK64FN1M0VMD12 More Descriptions
Kinetis K64: 120MHz Cortex-M4F MCU, 1MB Flash, 256KB SRAM, Full-Speed USB, Ethernet, 144-MAPBGA
Kinetis K 32-bit MCU, ARM Cortex-M4 core, 1MB Flash, 120MHz, Ethernet, MAPBGA 14
MCU 32-bit K64 ARM Cortex M4 RISC 1024KB Flash 2.5V/3.3V 144-Pin MAP-BGA Tray
Kinetis K64 Series 1 MB Flash 256 kB RAM SMT 32-Bit Microcontroller - MAPBGA-144
MCU, 32BIT, CORTEX-M4, 120MHZ, MAPBGA144
IC MCU 32BIT 1MB FLASH 144MAPBGA / Kinetis K64F Sub-Family
MCU, 32BIT, CORTEX-M4, 120MHZ, MAPBGA144; Product Range: Kinetis K Family K6x Series Microcontrollers; Architecture: ARM Cortex-M4; No. of Bits: 32bit; CPU Speed: 120MHz; Program Memory Size: 1MB; RAM Memory Size: 256KB; No. of Pins: 144Pins; MCU Case Style: MAPBGA; No. of I/O's: 100I/O's; Embedded Interface Type: CAN, I2C, I2S, SPI, UART, USB; Supply Voltage Min: 1.71V; Supply Voltage Max: 3.6V; MCU Family: Kinetis K; MCU Series: K6x; RoHS Phthalates Compliant: Yes; MSL: MSL 3 - 168 hours; SVHC: No SVHC (27-Jun-2018)
Device Core = ARM® Cortex® M4 / Data Bus Width Bit = 32 / Instruction Set Architecture = RISC / Family Name = Kinetis / Clock Frequency Max. MHz = 120 / Program Memory Type = Flash / Program Memory Size MB = 1 / RAM Memory Size KB = 256 / Interfaces = Ethernet / Interfaces = USB / Interfaces = CAN / Interfaces = I²C / Interfaces = SPI / Interfaces = UART / Interfaces = I²S / Interfaces = SDHC / ADC Resolution Bit = 16 / DAC Resolution Bit = 12 / Number of Programmable I/Os = 100 / Number of Timers/Counters = 8 / Comparators = 3 / Supply Voltage Min. V = 1.71 / Supply Voltage Max. V = 3.6 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = LBGA / Pins = 144 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 13 / Width mm = 13 / Height mm = 1.7 / Reflow Temperature Max. °C = 260
Product Comparison
The three parts on the right have similar specifications to MK64FN1M0VMD12.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Clock Frequency
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    DAC Channels
    Length
    Width
    RoHS Status
    EEPROM Size
    Bit Size
    View Compare
  • MK64FN1M0VMD12
    MK64FN1M0VMD12
    NXP USA Inc.
    13 Weeks
    Surface Mount
    144-LBGA
    YES
    -40°C~105°C TA
    Tray
    2002
    Kinetis K60
    e1
    Active
    3 (168 Hours)
    144
    3A991.A.2
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    0.5mm
    40
    S-PBGA-B144
    3.6V
    1.71V
    Internal
    100
    120MHz
    256K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    1MB 1M x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    13mm
    13mm
    ROHS3 Compliant
    -
    -
    -
  • MK64FN1M0VLL12
    MK64FN1M0VLL12
    NXP USA Inc.
    13 Weeks
    Surface Mount
    100-LQFP
    YES
    -40°C~105°C TA
    Tray
    2012
    Kinetis K60
    -
    Active
    3 (168 Hours)
    100
    3A991.A.2
    -
    8542.31.00.01
    CMOS
    QUAD
    GULL WING
    NOT SPECIFIED
    3.3V
    0.5mm
    NOT SPECIFIED
    S-PQFP-G100
    3.6V
    1.71V
    Internal
    66
    120MHz
    256K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    1MB 1M x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 32x16b; D/A 1x12b
    YES
    YES
    YES
    YES
    14mm
    14mm
    ROHS3 Compliant
    -
    -
    MK64FN1M0VMD12 vs MK64FN1M0VLL12
  • MK64FX512VLL12
    MK64FX512VLL12
    NXP USA Inc.
    13 Weeks
    Surface Mount
    100-LQFP
    YES
    -40°C~105°C TA
    Tray
    2002
    Kinetis K60
    e3
    Active
    3 (168 Hours)
    100
    3A991.A.2
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    40
    S-PQFP-G100
    3.6V
    1.71V
    Internal
    66
    120MHz
    192K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 32x16b; D/A 1x12b
    YES
    YES
    YES
    YES
    14mm
    14mm
    ROHS3 Compliant
    4K x 8
    -
    MK64FN1M0VMD12 vs MK64FX512VLL12
  • MK64FN1M0CAJ12R
    MK64FN1M0CAJ12R
    NXP USA Inc.
    16 Weeks
    Surface Mount
    142-UFBGA, WLCSP
    YES
    -40°C~85°C TA
    Tape & Reel (TR)
    2014
    Kinetis K60
    -
    Active
    1 (Unlimited)
    142
    3A991.A.2
    -
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    0.4mm
    40
    R-PBGA-B142
    3.6V
    1.71V
    Internal
    100
    120MHz
    256K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    1MB 1M x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    5.58mm
    4.84mm
    ROHS3 Compliant
    -
    32
    MK64FN1M0VMD12 vs MK64FN1M0CAJ12R
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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