LPC3152FET208,551

NXP USA Inc. LPC3152FET208,551

Part Number:
LPC3152FET208,551
Manufacturer:
NXP USA Inc.
Ventron No:
8572211-LPC3152FET208,551
Description:
ROMless ARM9® 16/32-Bit Microcontroller LPC3100 Series LPC315* 1.2V 208-TFBGA
ECAD Model:
Datasheet:
LPC3152,54

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Specifications
NXP USA Inc. LPC3152FET208,551 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. LPC3152FET208,551.
  • Mounting Type
    Surface Mount
  • Package / Case
    208-TFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Series
    LPC3100
  • Published
    2010
  • JESD-609 Code
    e1
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    208
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.65mm
  • Base Part Number
    LPC315*
  • Pin Count
    208
  • JESD-30 Code
    S-PBGA-B208
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.3V
  • Power Supplies
    1.21.8/3.3V
  • Supply Voltage-Min (Vsup)
    1.1V
  • Oscillator Type
    External
  • Number of I/O
    10
  • Speed
    180MHz
  • RAM Size
    192K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.1V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM9®
  • Peripherals
    DMA, I2S, LCD, PWM, WDT
  • Clock Frequency
    25MHz
  • Program Memory Type
    ROMless
  • Core Size
    16/32-Bit
  • Connectivity
    EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
  • Bit Size
    32
  • Data Converter
    A/D 3x10b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • ROM (words)
    0
  • ROM Programmability
    FLASH
  • Length
    12mm
  • Height Seated (Max)
    1.15mm
  • Width
    12mm
  • RoHS Status
    ROHS3 Compliant
Description
LPC3152FET208,551 Overview
This Microcontroller comes in a 208-TFBGA package. This Microcontroller has 10 I/Os. The Mounting Type of the Microcontroller is Surface Mount. The MCU is based on the 16/32-Bit core. This Microcontroller's program memory type is ROMless. The Microcontroller runs in -40°C~85°C TA Operating Temperature. Microcontroller runs in LPC3100 Series. MCU is powered by ARM9® Core Processor. The device belongs to MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs Type. The MCU has a number of 208 terminals. Microcontroller comes with 32 bit size. The component always operates in 1.2V supply voltage. MCU chip has YES DMA channels. You can find alternatives through the base part number LPC315*. The device works in YES PWM channels. It counts 208 pins. It is at 25MHz clock frequency.

LPC3152FET208,551 Features
208-TFBGA package
Mounting type of Surface Mount
Microcontrollers subcategory


LPC3152FET208,551 Applications
There are a lot of NXP USA Inc.
LPC3152FET208,551 Microcontroller applications.


Automatic control
Equipment control
Instrument control
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
LPC3152FET208,551 More Descriptions
MCU 16-bit/32-bit LPC3100 ARM926EJ-S RISC ROMLess 1.2V 208-Pin TFBGA Tray
ROHS3Compliant BALL BOTTOM CMOS Microcontroller 1.21.8/3.3V -40C~85C TA 25MHz 1.15mm
MCU, ARM926EJ-S, 180MHZ, TFBGA-208
IC MCU 16/32BIT ROMLESS 208TFBGA
French Electronic Distributor since 1988
IC REG LINEAR -12V 100MA 8SOIC
MCU, 32BIT, ARM9, 180MHZ, TFBGA-208; Product Range: LPC ARM9 Microcontrollers; Architecture: ARM9; No. of Bits: 32bit; CPU Speed: 180MHz; Program Memory Size: -; RAM Memory Size: 192KB; No. of Pins: 208Pins; MCU Case Style: TFBGA; No. of I/O's: 77I/O's; Embedded Interface Type: I2C, I2S, SPI, UART, USB; Supply Voltage Min: 1.8V; Supply Voltage Max: 3.3V; MSL: -; SVHC: No SVHC (27-Jun-2018); Controller Family/Series: LPC31xx; MPU Core Size: 32bit; Operating Temperature Max: 85°C; Operating Temperature Min: -40°C; Peripherals: ADC, DMA, PWM, RTC, Timer
Product Comparison
The three parts on the right have similar specifications to LPC3152FET208,551.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    Terminal Pitch
    Base Part Number
    Pin Count
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Clock Frequency
    Program Memory Type
    Core Size
    Connectivity
    Bit Size
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    DAC Channels
    ROM (words)
    ROM Programmability
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Factory Lead Time
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Reach Compliance Code
    View Compare
  • LPC3152FET208,551
    LPC3152FET208,551
    Surface Mount
    208-TFBGA
    YES
    -40°C~85°C TA
    Tray
    LPC3100
    2010
    e1
    Obsolete
    3 (168 Hours)
    208
    Tin/Silver/Copper (Sn/Ag/Cu)
    Microcontrollers
    CMOS
    BOTTOM
    BALL
    1.2V
    0.65mm
    LPC315*
    208
    S-PBGA-B208
    Not Qualified
    1.3V
    1.21.8/3.3V
    1.1V
    External
    10
    180MHz
    192K x 8
    1.1V~3.6V
    MICROCONTROLLER, RISC
    ARM9®
    DMA, I2S, LCD, PWM, WDT
    25MHz
    ROMless
    16/32-Bit
    EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
    32
    A/D 3x10b
    YES
    YES
    YES
    YES
    0
    FLASH
    12mm
    1.15mm
    12mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
  • LPC3143FET180,551
    Surface Mount
    180-TFBGA
    YES
    -40°C~85°C TA
    Tray
    LPC3100
    2009
    e1
    Not For New Designs
    3 (168 Hours)
    180
    Tin/Silver/Copper (Sn/Ag/Cu)
    Microcontrollers
    CMOS
    BOTTOM
    BALL
    1.2V
    0.8mm
    LPC314*
    180
    S-PBGA-B180
    Not Qualified
    1.3V
    1.21.8/3.3V
    1.1V
    External
    20
    270MHz
    192K x 8
    1.1V~3.6V
    MICROCONTROLLER, RISC
    ARM926EJ-S
    DMA, I2S, LCD, PWM, WDT
    25MHz
    ROMless
    16/32-Bit
    EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
    32
    A/D 4x10b
    YES
    YES
    YES
    NO
    0
    FLASH
    12mm
    1.2mm
    12mm
    ROHS3 Compliant
    12 Weeks
    NOT SPECIFIED
    NOT SPECIFIED
    -
  • LPC3154FET208,551
    Surface Mount
    208-TFBGA
    YES
    -40°C~85°C TA
    Tray
    LPC3100
    2009
    e1
    Obsolete
    3 (168 Hours)
    208
    Tin/Silver/Copper (Sn/Ag/Cu)
    Microcontrollers
    CMOS
    BOTTOM
    BALL
    1.2V
    0.65mm
    LPC315*
    208
    S-PBGA-B208
    Not Qualified
    1.3V
    1.21.8/3.3V
    1.1V
    External
    10
    180MHz
    192K x 8
    1.1V~3.6V
    MICROCONTROLLER, RISC
    ARM9®
    DMA, I2S, LCD, PWM, WDT
    25MHz
    ROMless
    16/32-Bit
    EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
    32
    A/D 3x10b
    YES
    YES
    YES
    YES
    0
    FLASH
    12mm
    1.15mm
    12mm
    ROHS3 Compliant
    -
    NOT SPECIFIED
    NOT SPECIFIED
    -
  • LPC3230FET296/01,5
    Surface Mount
    296-TFBGA
    -
    -40°C~85°C TA
    Tray
    LPC3200
    2009
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    LPC32*0
    296
    -
    -
    -
    -
    -
    Internal
    51
    266MHz
    256K x 8
    0.9V~3.6V
    -
    ARM926EJ-S
    DMA, I2S, LCD, Motor Control PWM, PWM, WDT
    -
    ROMless
    16/32-Bit
    EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
    -
    A/D 3x10b
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    unknown
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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