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NXP USA Inc. PK51X256CLK100

Part Number:

PK51X256CLK100

Manufacturer:

NXP USA Inc.

Ventron No:

8572217-PK51X256CLK100

Description:

256KB 256K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller Kinetis K50 Series PK51X256 80-LQFP

ECAD Model:

Datasheet:

PK51X256CLK100

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Delivery:

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Specifications

NXP USA Inc. PK51X256CLK100 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. PK51X256CLK100.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    80-LQFP
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tray
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    Kinetis K50
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Base Part Number
    PK51X256
  • Oscillator Type
    Internal
  • Number of I/O
    39
  • Speed

    Speed, in the context of electronic components, refers to the rate at which the component can process or transmit data. It is typically measured in units of bits per second (bps), megabits per second (Mbps), or gigabits per second (Gbps). The speed of a component is determined by its internal design and the technology used to manufacture it. Faster components can handle more data in a given amount of time, which can improve the overall performance of a system.

    100MHz
  • RAM Size
    64K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • Core Processor

    Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Program Memory Type
    FLASH
  • Core Size

    Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

    32-Bit
  • Program Memory Size
    256KB 256K x 8
  • Connectivity

    Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

    I2C, IrDA, SPI, UART/USART, USB, USB OTG
  • Data Converter
    A/D 23x16b; D/A 2x12b
  • EEPROM Size
    4K x 8
  • RoHS Status
    ROHS3 Compliant

Description

PK51X256CLK100 Overview
In a 80-LQFP package, the MCU is available. 39 I/Os are available. The Microcontroller has a mounting type of Surface Mount, which indicates that it is mounted conveniently. The 32-Bit core is the core of the MCU. There is a FLASH type of memory for its program. There is a temperature range of -40°C~85°C TA that is operated by this Microcontroller. Kinetis K50 series components make up this electrical component. 256KB 256K x 8 is the size of its program memory. A ARM® Cortex®-M4 Core processor is used to power the device. The base part number PK51X256 can be used to find alternatives.

PK51X256CLK100 Features
80-LQFP package
Mounting type of Surface Mount


PK51X256CLK100 Applications
There are a lot of NXP USA Inc.
PK51X256CLK100 Microcontroller applications.


Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio
Entertainment products
PK51X256CLK100 More Descriptions
IC MCU ARM 256KB FLASH 80LQFP
Contact for details
KINETIS 256K USB

Product Comparison

The three parts on the right have similar specifications to PK51X256CLK100.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Base Part Number
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    Core Processor
    Peripherals
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Data Converter
    EEPROM Size
    RoHS Status
    View Compare
  • PK51X256CLK100
    PK51X256CLK100
    Surface Mount
    80-LQFP
    -40°C~85°C TA
    Tray
    Kinetis K50
    Obsolete
    3 (168 Hours)
    PK51X256
    Internal
    39
    100MHz
    64K x 8
    1.71V~3.6V
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    256KB 256K x 8
    I2C, IrDA, SPI, UART/USART, USB, USB OTG
    A/D 23x16b; D/A 2x12b
    4K x 8
    ROHS3 Compliant
    -
  • PK51N512CLQ100
    Surface Mount
    144-LQFP
    -40°C~85°C TA
    Tray
    Kinetis K50
    Obsolete
    3 (168 Hours)
    PK51N512
    Internal
    94
    100MHz
    128K x 8
    1.71V~3.6V
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    512KB 512K x 8
    EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 25x16b; D/A 2x12b
    -
    ROHS3 Compliant
  • PK51N256CLQ100
    Surface Mount
    144-LQFP
    -40°C~85°C TA
    Tray
    Kinetis K50
    Obsolete
    3 (168 Hours)
    PK51N256
    Internal
    94
    100MHz
    64K x 8
    1.71V~3.6V
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    256KB 256K x 8
    EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 25x16b; D/A 2x12b
    -
    ROHS3 Compliant
  • PK51N512CLL100
    Surface Mount
    100-LQFP
    -40°C~85°C TA
    Tray
    Kinetis K50
    Obsolete
    3 (168 Hours)
    PK51N512
    Internal
    59
    100MHz
    128K x 8
    1.71V~3.6V
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    512KB 512K x 8
    I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    A/D 18x16b; D/A 2x12b
    -
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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