Microsemi Corporation M2S150TS-FC1152I
- Part Number:
- M2S150TS-FC1152I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3669468-M2S150TS-FC1152I
- Description:
- IC FPGA SOC 150K LUTS
- Datasheet:
- M2S150TS-FC1152I
Microsemi Corporation M2S150TS-FC1152I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150TS-FC1152I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case1152-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesSmartFusion®2
- JESD-609 Codee0
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Terminal FinishTin/Lead (Sn/Pb)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B1152
- Number of Outputs574
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O574
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs574
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 150K Logic Modules
- Number of Logic Cells146124
- Flash Size512KB
- Height Seated (Max)2.9mm
- Length35mm
- Width35mm
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
Microsemi Corporation is a well-known brand in the technology industry, known for its high-quality and innovative products. One of their latest offerings is the Embedded - System On Chip (SoC) chip, which falls under the category of Embedded - System On Chip (SoC). This chip is designed to be surface mounted, making it compact and easy to integrate into various electronic devices. The part is currently in an active status, meaning it is readily available for purchase and use. One of the key features of this chip is its terminal finish, which is made of Tin/Lead (Sn/Pb). This material is known for its durability and ability to withstand harsh environments, making it ideal for long-term use in electronic devices. The terminal position of the chip is at the bottom, allowing for easy and efficient placement on circuit boards. In terms of power supply, the Microsemi Corporation chip operates at a voltage of 1.2V, with a minimum supply voltage of 1.14V. This ensures stable and reliable performance, even under varying voltage conditions. The terminal pitch of the chip is 1mm, providing a compact and efficient layout on circuit boards. The Embedded - System On Chip (SoC) chip boasts an impressive 574 I/O (input/output) ports, making it versatile and capable of handling a wide range of tasks. It is also a FIELD PROGRAMMABLE GATE ARRAY (FPGA), meaning it can be programmed and reconfigured to suit specific applications. This flexibility makes it a popular choice among electronic designers and engineers. Furthermore, the chip has a large number of logic cells, with a total of 146124. This allows for complex and advanced functions to be performed, making it suitable for a variety of applications such as telecommunications, industrial automation, and consumer electronics. In conclusion, the Microsemi Corporation Embedded - System On Chip (SoC) chip is a highly advanced and versatile component that offers a range of features and capabilities. Its surface mount design, durable terminal finish, and reliable power supply make it a top choice for electronic devices. With its large number of I/O ports and logic cells, it is suitable for a wide range of applications, making it a valuable addition to any electronic design.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S150TS-FC1152I System On Chip (SoC) applications.
Self-aware system-on-chip (SoC)
ARM support modules
Special Issue Editors
Microcontroller based SoC ( RISC-V, ARM)
Cyber security for critical applications in the aerospace
Published Paper
RISC-V
Measurement testers
Efficient hardware for inference of neural networks
Transmitters
Microsemi Corporation is a well-known brand in the technology industry, known for its high-quality and innovative products. One of their latest offerings is the Embedded - System On Chip (SoC) chip, which falls under the category of Embedded - System On Chip (SoC). This chip is designed to be surface mounted, making it compact and easy to integrate into various electronic devices. The part is currently in an active status, meaning it is readily available for purchase and use. One of the key features of this chip is its terminal finish, which is made of Tin/Lead (Sn/Pb). This material is known for its durability and ability to withstand harsh environments, making it ideal for long-term use in electronic devices. The terminal position of the chip is at the bottom, allowing for easy and efficient placement on circuit boards. In terms of power supply, the Microsemi Corporation chip operates at a voltage of 1.2V, with a minimum supply voltage of 1.14V. This ensures stable and reliable performance, even under varying voltage conditions. The terminal pitch of the chip is 1mm, providing a compact and efficient layout on circuit boards. The Embedded - System On Chip (SoC) chip boasts an impressive 574 I/O (input/output) ports, making it versatile and capable of handling a wide range of tasks. It is also a FIELD PROGRAMMABLE GATE ARRAY (FPGA), meaning it can be programmed and reconfigured to suit specific applications. This flexibility makes it a popular choice among electronic designers and engineers. Furthermore, the chip has a large number of logic cells, with a total of 146124. This allows for complex and advanced functions to be performed, making it suitable for a variety of applications such as telecommunications, industrial automation, and consumer electronics. In conclusion, the Microsemi Corporation Embedded - System On Chip (SoC) chip is a highly advanced and versatile component that offers a range of features and capabilities. Its surface mount design, durable terminal finish, and reliable power supply make it a top choice for electronic devices. With its large number of I/O ports and logic cells, it is suitable for a wide range of applications, making it a valuable addition to any electronic design.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S150TS-FC1152I System On Chip (SoC) applications.
Self-aware system-on-chip (SoC)
ARM support modules
Special Issue Editors
Microcontroller based SoC ( RISC-V, ARM)
Cyber security for critical applications in the aerospace
Published Paper
RISC-V
Measurement testers
Efficient hardware for inference of neural networks
Transmitters
M2S150TS-FC1152I More Descriptions
M2S150Ts-Fc1152I 1152 Bga 35X35X2.90Mm Tray Rohs Compliant: Yes |Microchip M2S150TS-FC1152I
Field Programmable Gate Array, 146124-Cell, CMOS, PBGA1152
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 1152BGA
Field Programmable Gate Array, 146124-Cell, CMOS, PBGA1152
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 1152BGA
The three parts on the right have similar specifications to M2S150TS-FC1152I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Terminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPublishedNumber of TerminationsFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S150TS-FC1152I10 WeeksIN PRODUCTION (Last Updated: 1 month ago)1152-BBGA, FCBGAYES-40°C~100°C TJTraySmartFusion®2e0Active3 (168 Hours)Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmnot_compliantNOT SPECIFIEDS-PBGA-B1152574Not Qualified1.26V1.2V1.14V574166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA574FIELD PROGRAMMABLE GATE ARRAYFPGA - 150K Logic Modules146124512KB2.9mm35mm35mmNon-RoHS Compliant-------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)536-LFBGA, CSPBGAYES0°C~85°C TJTraySmartFusion®2e0Active3 (168 Hours)Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V--NOT SPECIFIEDS-PBGA-B536293Not Qualified1.26V1.2V1.14V293166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA293FIELD PROGRAMMABLE GATE ARRAYFPGA - 150K Logic Modules146124512KB---RoHS Compliant2015536----
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)1152-BBGA, FCBGAYES-40°C~100°C TJTraySmartFusion®2e0Active3 (168 Hours)Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmnot_compliantNOT SPECIFIEDS-PBGA-B1152574Not Qualified1.26V1.2V1.14V574-64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA574FIELD PROGRAMMABLE GATE ARRAYFPGA - 150K Logic Modules146124512KB2.9mm35mm35mmNon-RoHS Compliant2009-166MHzM2S150TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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--1152-BBGA, FCBGAYES0°C~85°C TJTraySmartFusion®2-Obsolete3 (168 Hours)--Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm-NOT SPECIFIEDS-PBGA-B1152574Not Qualified1.26V1.2V1.14V574-64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA574FIELD PROGRAMMABLE GATE ARRAYFPGA - 100K Logic Modules99512512KB2.9mm35mm35mmRoHS Compliant2009-166MHzM2S100CAN, Ethernet, I2C, SPI, UART, USART, USBARM
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