M2S150TS-FC1152I

Microsemi Corporation M2S150TS-FC1152I

Part Number:
M2S150TS-FC1152I
Manufacturer:
Microsemi Corporation
Ventron No:
3669468-M2S150TS-FC1152I
Description:
IC FPGA SOC 150K LUTS
ECAD Model:
Datasheet:
M2S150TS-FC1152I

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Specifications
Microsemi Corporation M2S150TS-FC1152I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150TS-FC1152I.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Package / Case
    1152-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B1152
  • Number of Outputs
    574
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    574
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    574
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 150K Logic Modules
  • Number of Logic Cells
    146124
  • Flash Size
    512KB
  • Height Seated (Max)
    2.9mm
  • Length
    35mm
  • Width
    35mm
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
Microsemi Corporation is a well-known brand in the technology industry, known for its high-quality and innovative products. One of their latest offerings is the Embedded - System On Chip (SoC) chip, which falls under the category of Embedded - System On Chip (SoC). This chip is designed to be surface mounted, making it compact and easy to integrate into various electronic devices. The part is currently in an active status, meaning it is readily available for purchase and use. One of the key features of this chip is its terminal finish, which is made of Tin/Lead (Sn/Pb). This material is known for its durability and ability to withstand harsh environments, making it ideal for long-term use in electronic devices. The terminal position of the chip is at the bottom, allowing for easy and efficient placement on circuit boards. In terms of power supply, the Microsemi Corporation chip operates at a voltage of 1.2V, with a minimum supply voltage of 1.14V. This ensures stable and reliable performance, even under varying voltage conditions. The terminal pitch of the chip is 1mm, providing a compact and efficient layout on circuit boards. The Embedded - System On Chip (SoC) chip boasts an impressive 574 I/O (input/output) ports, making it versatile and capable of handling a wide range of tasks. It is also a FIELD PROGRAMMABLE GATE ARRAY (FPGA), meaning it can be programmed and reconfigured to suit specific applications. This flexibility makes it a popular choice among electronic designers and engineers. Furthermore, the chip has a large number of logic cells, with a total of 146124. This allows for complex and advanced functions to be performed, making it suitable for a variety of applications such as telecommunications, industrial automation, and consumer electronics. In conclusion, the Microsemi Corporation Embedded - System On Chip (SoC) chip is a highly advanced and versatile component that offers a range of features and capabilities. Its surface mount design, durable terminal finish, and reliable power supply make it a top choice for electronic devices. With its large number of I/O ports and logic cells, it is suitable for a wide range of applications, making it a valuable addition to any electronic design.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S150TS-FC1152I System On Chip (SoC) applications.

Self-aware system-on-chip (SoC)
ARM support modules
Special Issue Editors
Microcontroller based SoC ( RISC-V, ARM)
Cyber security for critical applications in the aerospace
Published Paper
RISC-V
Measurement testers
Efficient hardware for inference of neural networks
Transmitters
M2S150TS-FC1152I More Descriptions
M2S150Ts-Fc1152I 1152 Bga 35X35X2.90Mm Tray Rohs Compliant: Yes |Microchip M2S150TS-FC1152I
Field Programmable Gate Array, 146124-Cell, CMOS, PBGA1152
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 1152BGA
Product Comparison
The three parts on the right have similar specifications to M2S150TS-FC1152I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Published
    Number of Terminations
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S150TS-FC1152I
    M2S150TS-FC1152I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    not_compliant
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    2.9mm
    35mm
    35mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
  • M2S150T-FCSG536
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    536-LFBGA, CSPBGA
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    -
    -
    NOT SPECIFIED
    S-PBGA-B536
    293
    Not Qualified
    1.26V
    1.2V
    1.14V
    293
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    293
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    -
    -
    -
    RoHS Compliant
    2015
    536
    -
    -
    -
    -
  • M2S150T-1FC1152I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    not_compliant
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    -
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    2.9mm
    35mm
    35mm
    Non-RoHS Compliant
    2009
    -
    166MHz
    M2S150T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
  • M2S100-1FCG1152
    -
    -
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    -
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    -
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 100K Logic Modules
    99512
    512KB
    2.9mm
    35mm
    35mm
    RoHS Compliant
    2009
    -
    166MHz
    M2S100
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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