Microsemi Corporation M2S100-1FCG1152
- Part Number:
- M2S100-1FCG1152
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3828009-M2S100-1FCG1152
- Description:
- IC FPGA SOC 100K LUTS 1152FCBGA
- ECAD Model:
-
Microsemi Corporation M2S100-1FCG1152 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S100-1FCG1152.
- Package / Case1152-BBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®2
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Frequency166MHz
- Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberM2S100
- JESD-30 CodeS-PBGA-B1152
- Number of Outputs574
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O574
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs574
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Core ArchitectureARM
- Primary AttributesFPGA - 100K Logic Modules
- Number of Logic Cells99512
- Flash Size512KB
- Height Seated (Max)2.9mm
- Length35mm
- Width35mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
Microsemi Corporation offers a highly versatile and efficient solution with their Embedded - System On Chip (SoC) chip, specifically designed for the Embedded - System On Chip (SoC) category. This chip comes in Tray packaging and has a Moisture Sensitivity Level (MSL) of 3 (168 Hours). The technology used in this chip is CMOS, with a frequency of 166MHz and a NOT SPECIFIED Reflow Temperature-Max (s). The base part number for this chip is M2S100 and it currently has a Not Qualified qualification status. With peripherals such as DDR, PCIe, and SERDES, this chip also boasts a large number of inputs at 574 and utilizes FIELD PROGRAMMABLE GATE ARRAY as its programmable logic type.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S100-1FCG1152 System On Chip (SoC) applications.
Self-aware system-on-chip (SoC)
DC-input BLDC motor drive
Vending machines
CNC control
Multiprocessor system-on-chips (MPSoCs)
Industrial automation devices
Medical
Smartphones
Smart appliances
Functional safety for critical applications in the aerospace
Microsemi Corporation offers a highly versatile and efficient solution with their Embedded - System On Chip (SoC) chip, specifically designed for the Embedded - System On Chip (SoC) category. This chip comes in Tray packaging and has a Moisture Sensitivity Level (MSL) of 3 (168 Hours). The technology used in this chip is CMOS, with a frequency of 166MHz and a NOT SPECIFIED Reflow Temperature-Max (s). The base part number for this chip is M2S100 and it currently has a Not Qualified qualification status. With peripherals such as DDR, PCIe, and SERDES, this chip also boasts a large number of inputs at 574 and utilizes FIELD PROGRAMMABLE GATE ARRAY as its programmable logic type.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S100-1FCG1152 System On Chip (SoC) applications.
Self-aware system-on-chip (SoC)
DC-input BLDC motor drive
Vending machines
CNC control
Multiprocessor system-on-chips (MPSoCs)
Industrial automation devices
Medical
Smartphones
Smart appliances
Functional safety for critical applications in the aerospace
M2S100-1FCG1152 More Descriptions
IC SOC CORTEX-M3 166MHZ 1152BGA
IC FPGA SOC 100K LUTS 1152FCBGA
SMARTFUSION2 SOC FPGA
IC FPGA SOC 100K LUTS 1152FCBGA
SMARTFUSION2 SOC FPGA
The three parts on the right have similar specifications to M2S100-1FCG1152.
-
ImagePart NumberManufacturerPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)SubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypeCore ArchitecturePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusFactory Lead TimeLifecycle StatusJESD-609 CodeNumber of TerminationsTerminal FinishHTS CodeSpeedReach Compliance CodeView Compare
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M2S100-1FCG11521152-BBGA, FCBGAYES0°C~85°C TJTray2009SmartFusion®2Obsolete3 (168 Hours)Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm166MHzNOT SPECIFIEDM2S100S-PBGA-B1152574Not Qualified1.26V1.2V1.14VCAN, Ethernet, I2C, SPI, UART, USART, USB57464KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA574FIELD PROGRAMMABLE GATE ARRAYARMFPGA - 100K Logic Modules99512512KB2.9mm35mm35mmRoHS Compliant--------- -
536-LFBGA, CSPBGAYES0°C~85°C TJTray2015SmartFusion®2Active3 (168 Hours)Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V--NOT SPECIFIED-S-PBGA-B536293Not Qualified1.26V1.2V1.14V-29364KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA293FIELD PROGRAMMABLE GATE ARRAY-FPGA - 150K Logic Modules146124512KB---RoHS Compliant10 WeeksIN PRODUCTION (Last Updated: 1 month ago)e0536Tin/Lead (Sn/Pb)8542.39.00.01166MHz-
-
1152-BBGA, FCBGAYES-40°C~100°C TJTray-SmartFusion®2Active3 (168 Hours)Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm-NOT SPECIFIED-S-PBGA-B1152574Not Qualified1.26V1.2V1.14V-57464KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA574FIELD PROGRAMMABLE GATE ARRAY-FPGA - 150K Logic Modules146124512KB2.9mm35mm35mmNon-RoHS Compliant10 WeeksIN PRODUCTION (Last Updated: 1 month ago)e0-Tin/Lead (Sn/Pb)8542.39.00.01166MHznot_compliant
-
1152-BBGA, FCBGAYES0°C~85°C TJTray2015SmartFusion®2Active3 (168 Hours)Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm-NOT SPECIFIED-S-PBGA-B1152574Not Qualified1.26V1.2V1.14V-57464KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA574FIELD PROGRAMMABLE GATE ARRAY-FPGA - 150K Logic Modules146124512KB2.9mm35mm35mmRoHS Compliant10 WeeksIN PRODUCTION (Last Updated: 1 month ago)e3-MATTE TIN8542.39.00.01166MHz-
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