M2S150TS-1FCG1152

Microsemi Corporation M2S150TS-1FCG1152

Part Number:
M2S150TS-1FCG1152
Manufacturer:
Microsemi Corporation
Ventron No:
3669414-M2S150TS-1FCG1152
Description:
IC FPGA SOC 150K LUTS 1152FCBGA
ECAD Model:
Datasheet:
M2S150TS-1FCG1152

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Specifications
Microsemi Corporation M2S150TS-1FCG1152 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150TS-1FCG1152.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Package / Case
    1152-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B1152
  • Number of Outputs
    574
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    574
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    574
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 150K Logic Modules
  • Number of Logic Cells
    146124
  • Flash Size
    512KB
  • Height Seated (Max)
    2.9mm
  • Length
    35mm
  • Width
    35mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The JESD-609 Code for this product is e3, indicating its compliance with industry standards. The Part Status is Active, ensuring its availability for current and future projects. The Terminal Form is BALL, providing a secure and reliable connection. With a Supply Voltage of 1.2V, this product offers efficient power consumption. The Reflow Temperature-Max (s) is NOT SPECIFIED, allowing for flexibility in temperature requirements. It is equipped with 1.2V Power Supplies and has a RAM Size of 64KB. The Core Processor is ARM® Cortex®-M3, providing high performance and reliability. This product is designed with an MCU, FPGA Architecture, and has a Flash Size of 512KB, making it suitable for a variety of applications.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S150TS-1FCG1152 System On Chip (SoC) applications.

Keyboard
Smart appliances
RISC-V
Samsung galaxy gear
ARM processors
Deep learning hardware
Three phase UPS
Networked Media Encode/Decode
Central inverter
Digital Signal Processing
M2S150TS-1FCG1152 More Descriptions
FPGA SmartFusion2 Family 146124 Cells 65nm Technology 1.2V 1152-Pin FCBGA Tray
M2S150Ts-1Fcg1152 1152 Bga 35X35X2.90Mm Tray Rohs Compliant: Yes |Microchip M2S150TS-1FCG1152
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 1152BGA
IC FPGA SOC 150K LUTS 1152FCBGA
Product Comparison
The three parts on the right have similar specifications to M2S150TS-1FCG1152.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Number of Terminations
    Reach Compliance Code
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S150TS-1FCG1152
    M2S150TS-1FCG1152
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    2.9mm
    35mm
    35mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
  • M2S150T-FCSG536I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    536-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    -
    NOT SPECIFIED
    S-PBGA-B536
    293
    Not Qualified
    1.26V
    1.2V
    1.14V
    293
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    293
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    -
    -
    -
    RoHS Compliant
    536
    -
    -
    -
    -
    -
  • M2S150T-1FC1152I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    -
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    2.9mm
    35mm
    35mm
    Non-RoHS Compliant
    -
    not_compliant
    166MHz
    M2S150T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
  • M2S100-1FCG1152
    -
    -
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    -
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 100K Logic Modules
    99512
    512KB
    2.9mm
    35mm
    35mm
    RoHS Compliant
    -
    -
    166MHz
    M2S100
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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