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M2S150T-FCSG536

Microsemi Corporation M2S150T-FCSG536

Part Number:
M2S150T-FCSG536
Manufacturer:
Microsemi Corporation
Ventron No:
3828196-M2S150T-FCSG536
Description:
IC FPGA SOC 150K LUTS
ECAD Model:
Datasheet:
M2S150T-FCSG536

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Specifications
Microsemi Corporation M2S150T-FCSG536 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150T-FCSG536.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Package / Case
    536-LFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    536
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B536
  • Number of Outputs
    293
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    293
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    293
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 150K Logic Modules
  • Number of Logic Cells
    146124
  • Flash Size
    512KB
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
This chip is produced by Microsemi Corporation. It is an Embedded - System On Chip (SoC) chip. The primary attributes of this chip include FPGA - 150K Logic Modules. The JESD-609 Code for this chip is e0 and the technology used is CMOS. The peak reflow temperature and reflow temperature-max for this chip are not specified. The chip has a total of 293 outputs and the maximum supply voltage is 1.26V. The operating speed of this chip is 166MHz and it has a RAM size of 64KB. Additionally, this chip is RoHS compliant.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S150T-FCSG536 System On Chip (SoC) applications.

Remote control
Measurement testers
PC peripherals
Functional safety for critical applications in the automotive
Functional safety for critical applications in the aerospace
Defense
Efficient hardware for inference of neural networks
Special Issue Editors
Smart appliances
Microprocessors
M2S150T-FCSG536 More Descriptions
M2S150T-Fcsg536 536 Lfbga 16X16X1.45Mm Tray Rohs Compliant: Yes |Microchip M2S150T-FCSG536
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 536BGA
Product Comparison
The three parts on the right have similar specifications to M2S150T-FCSG536.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    RoHS Status
    Terminal Pitch
    Reach Compliance Code
    Frequency
    Base Part Number
    Interface
    Core Architecture
    Height Seated (Max)
    Length
    Width
    Additional Feature
    View Compare
  • M2S150T-FCSG536
    M2S150T-FCSG536
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    536-LFBGA, CSPBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    536
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    NOT SPECIFIED
    S-PBGA-B536
    293
    Not Qualified
    1.26V
    1.2V
    1.14V
    293
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    293
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S150T-1FC1152I
    M2S150T-1FC1152I
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    -
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    Non-RoHS Compliant
    1mm
    not_compliant
    166MHz
    M2S150T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
    2.9mm
    35mm
    35mm
    -
    M2S150T-FCSG536 vs M2S150T-1FC1152I
  • M2S150TS-FC1152I
    M2S150TS-FC1152I
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    Non-RoHS Compliant
    1mm
    not_compliant
    -
    -
    -
    -
    2.9mm
    35mm
    35mm
    -
    M2S150T-FCSG536 vs M2S150TS-FC1152I
  • M2S150T-1FCVG484
    M2S150T-1FCVG484
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    484-BFBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    484
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    NOT SPECIFIED
    S-PBGA-B484
    273
    Not Qualified
    1.26V
    1.2V
    1.14V
    273
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    273
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    RoHS Compliant
    0.8mm
    -
    -
    -
    -
    -
    3.15mm
    19mm
    19mm
    LG-MIN, WD-MIN
    M2S150T-FCSG536 vs M2S150T-1FCVG484
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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