M2S150T-1FC1152I

Microsemi Corporation M2S150T-1FC1152I

Part Number:
M2S150T-1FC1152I
Manufacturer:
Microsemi Corporation
Ventron No:
3828105-M2S150T-1FC1152I
Description:
IC FPGA SOC 150K LUTS 1152FCBGA
ECAD Model:
Datasheet:
SmartFusion2 Datasheet SmartFusion2 Pin Descriptions

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Specifications
Microsemi Corporation M2S150T-1FC1152I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150T-1FC1152I.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Package / Case
    1152-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Frequency
    166MHz
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    M2S150T
  • JESD-30 Code
    S-PBGA-B1152
  • Number of Outputs
    574
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Interface
    CAN, Ethernet, I2C, SPI, UART, USART, USB
  • Number of I/O
    574
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    574
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Core Architecture
    ARM
  • Primary Attributes
    FPGA - 150K Logic Modules
  • Number of Logic Cells
    146124
  • Flash Size
    512KB
  • Height Seated (Max)
    2.9mm
  • Length
    35mm
  • Width
    35mm
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The packaging for this product is a tray, and it was published in 2009. It follows the JESD-609 code of e0 and has a terminal pitch of 1mm. However, it is important to note that the qualification status for this product is currently not qualified. The RAM size for this device is 64KB, and it offers a variety of connectivity options such as CANbus, Ethernet, I2C, SPI, UART/USART, and USB. In terms of architecture, this product can be categorized as either a MCU or an FPGA. Additionally, it has a total of 574 inputs and utilizes the ARM core architecture. These specifications make this product a versatile and powerful option for various applications.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
M2S150T-1FC1152I System On Chip (SoC) applications.

Communication interfaces ( I2C, SPI )
ARM
Healthcare
AC drive control module
Mobile computing
Published Paper
Special Issue Information
Vending machines
Avionics
Deep learning hardware
M2S150T-1FC1152I More Descriptions
FPGA SmartFusion2 Family 146124 Cells 65nm Technology 1.2V 1152-Pin FCBGA Tray
M2S150T-1Fc1152I 1152 Bga 35X35X2.90Mm Tray Rohs Compliant: Yes |Microchip M2S150T-1FC1152I
ARM Cortex-M3 System On Chip (SOC) IC series FPGA - 150K Logic Modules 166MHz
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 1152BGA
IC FPGA SOC 150K LUTS 1152FCBGA
Product Comparison
The three parts on the right have similar specifications to M2S150T-1FC1152I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Core Architecture
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Number of Terminations
    Speed
    Additional Feature
    View Compare
  • M2S150T-1FC1152I
    M2S150T-1FC1152I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    not_compliant
    166MHz
    NOT SPECIFIED
    M2S150T
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    574
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    ARM
    FPGA - 150K Logic Modules
    146124
    512KB
    2.9mm
    35mm
    35mm
    Non-RoHS Compliant
    -
    -
    -
    -
  • M2S150T-FCSG536I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    536-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    -
    -
    -
    NOT SPECIFIED
    -
    S-PBGA-B536
    293
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    293
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    293
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 150K Logic Modules
    146124
    512KB
    -
    -
    -
    RoHS Compliant
    536
    166MHz
    -
  • M2S100-1FCG1152
    -
    -
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    -
    166MHz
    NOT SPECIFIED
    M2S100
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    574
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    ARM
    FPGA - 100K Logic Modules
    99512
    512KB
    2.9mm
    35mm
    35mm
    RoHS Compliant
    -
    -
    -
  • M2S150T-1FCVG484
    10 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    484-BFBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    0.8mm
    -
    -
    NOT SPECIFIED
    -
    S-PBGA-B484
    273
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    273
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    273
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 150K Logic Modules
    146124
    512KB
    3.15mm
    19mm
    19mm
    RoHS Compliant
    484
    166MHz
    LG-MIN, WD-MIN
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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