M2S150-1FCS536I

Microsemi Corporation M2S150-1FCS536I

Part Number:
M2S150-1FCS536I
Manufacturer:
Microsemi Corporation
Ventron No:
3669289-M2S150-1FCS536I
Description:
IC FPGA SOC 150K LUTS
ECAD Model:
Datasheet:
M2S150-1FCS536I

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Microsemi Corporation M2S150-1FCS536I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150-1FCS536I.
  • Factory Lead Time
    12 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Package / Case
    536-LFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    536
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B536
  • Number of Outputs
    293
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    293
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    293
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 150K Logic Modules
  • Number of Logic Cells
    146124
  • Flash Size
    512KB
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
This particular component is manufactured by Microsemi Corporation and falls under the category of Embedded - System On Chip (SoC) chips. Its current status is active and it has a Moisture Sensitivity Level (MSL) rating of 3, meaning it can withstand exposure to moisture for up to 168 hours. It has a total of 536 terminations and its maximum reflow temperature is not specified. The chip has 293 input/output connections and operates at a speed of 166MHz. Its core processor is ARM® Cortex®-M3 and it also features peripherals such as DDR, PCIe, and SERDES. Its primary attribute is its FPGA - 150K Logic Modules. This component is not compliant with RoHS regulations.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S150-1FCS536I System On Chip (SoC) applications.

Servo drive control module
Healthcare
Industrial transport
Published Paper
AC drive control module
Industrial automation devices
Three phase UPS
System-on-chip (SoC)
Vending machines
Avionics
M2S150-1FCS536I More Descriptions
FPGA SmartFusion2 Family 146124 Cells 65nm Technology 1.2V 536-Pin FCBGA Tray
M2S150-1Fcs536I 536 Lfbga 16X16X1.45Mm Tray Rohs Compliant: Yes |Microchip M2S150-1FCS536I
Field Programmable Gate Array, 146124-Cell, CMOS, PBGA536
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
Product Comparison
The three parts on the right have similar specifications to M2S150-1FCS536I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reach Compliance Code
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    RoHS Status
    Terminal Pitch
    Frequency
    Base Part Number
    Interface
    Core Architecture
    Height Seated (Max)
    Length
    Width
    Additional Feature
    View Compare
  • M2S150-1FCS536I
    M2S150-1FCS536I
    12 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    536-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    536
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    not_compliant
    NOT SPECIFIED
    S-PBGA-B536
    293
    Not Qualified
    1.26V
    1.2V
    1.14V
    293
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    293
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S100-1FCG1152
    -
    -
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    -
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    -
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 100K Logic Modules
    99512
    512KB
    RoHS Compliant
    1mm
    166MHz
    M2S100
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
    2.9mm
    35mm
    35mm
    -
  • M2S150T-1FCVG484
    10 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    484-BFBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    484
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    -
    NOT SPECIFIED
    S-PBGA-B484
    273
    Not Qualified
    1.26V
    1.2V
    1.14V
    273
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    273
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    RoHS Compliant
    0.8mm
    -
    -
    -
    -
    3.15mm
    19mm
    19mm
    LG-MIN, WD-MIN
  • M2S150TS-1FCG1152
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    -
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    -
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    RoHS Compliant
    1mm
    -
    -
    -
    -
    2.9mm
    35mm
    35mm
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.