M2S100T-1FC1152

Microsemi Corporation M2S100T-1FC1152

Part Number:
M2S100T-1FC1152
Manufacturer:
Microsemi Corporation
Ventron No:
3668781-M2S100T-1FC1152
Description:
IC FPGA SOC 100K LUTS 1152FCBGA
ECAD Model:
Datasheet:
SmartFusion2 Datasheet SmartFusion2 Pin Descriptions

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Specifications
Microsemi Corporation M2S100T-1FC1152 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S100T-1FC1152.
  • Package / Case
    1152-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Terminal Finish
    TIN LEAD
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Frequency
    166MHz
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    M2S100T
  • JESD-30 Code
    S-PBGA-B1152
  • Number of Outputs
    574
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Interface
    CAN, Ethernet, I2C, SPI, UART, USART, USB
  • Number of I/O
    574
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    574
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Core Architecture
    ARM
  • Primary Attributes
    FPGA - 100K Logic Modules
  • Number of Logic Cells
    99512
  • Flash Size
    512KB
  • Height Seated (Max)
    2.9mm
  • Length
    35mm
  • Width
    35mm
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The operating temperature range for the M2S100T base part number is 0°C to 85°C, making it suitable for a wide range of environments. This technology utilizes CMOS, ensuring low power consumption and high performance. The packaging for this component is in tray form, providing ease of handling and protection during transportation. The peak reflow temperature is not specified, giving flexibility for different manufacturing processes. With a terminal pitch of 1mm, this base part number can be easily integrated into various circuit designs. The M2S100T also operates on a 1.2V power supply, with a minimum supply voltage of 1.14V. Its ARM core architecture and compact width of 35mm make it a versatile and efficient choice for electronic devices.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
M2S100T-1FC1152 System On Chip (SoC) applications.

Special Issue Information
Smartphones
RISC-V
AC-input BLDC motor drive
Industrial sectors
Digital Signal Processing
Avionics
Optical drive
Smartphone accessories
Communication network-on-Chip (cNoC)
M2S100T-1FC1152 More Descriptions
IC SOC CORTEX-M3 166MHZ 1152BGA
IC FPGA SOC 100K LUTS 1152FCBGA
SMARTFUSION2 SOC FPGA
Product Comparison
The three parts on the right have similar specifications to M2S100T-1FC1152.
  • Image
    Part Number
    Manufacturer
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Core Architecture
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Factory Lead Time
    Lifecycle Status
    Number of Terminations
    HTS Code
    Speed
    View Compare
  • M2S100T-1FC1152
    M2S100T-1FC1152
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    e0
    Obsolete
    3 (168 Hours)
    TIN LEAD
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    166MHz
    NOT SPECIFIED
    M2S100T
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    574
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    ARM
    FPGA - 100K Logic Modules
    99512
    512KB
    2.9mm
    35mm
    35mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
  • M2S150T-FCSG536
    536-LFBGA, CSPBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    -
    -
    NOT SPECIFIED
    -
    S-PBGA-B536
    293
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    293
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    293
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 150K Logic Modules
    146124
    512KB
    -
    -
    -
    RoHS Compliant
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    536
    8542.39.00.01
    166MHz
  • M2S150T-FCSG536I
    536-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    -
    -
    NOT SPECIFIED
    -
    S-PBGA-B536
    293
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    293
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    293
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 150K Logic Modules
    146124
    512KB
    -
    -
    -
    RoHS Compliant
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    536
    8542.39.00.01
    166MHz
  • M2S150TS-1FCG1152
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    MATTE TIN
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    -
    NOT SPECIFIED
    -
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    574
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 150K Logic Modules
    146124
    512KB
    2.9mm
    35mm
    35mm
    RoHS Compliant
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    -
    8542.39.00.01
    166MHz
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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