Microsemi Corporation M2S100S-1FCG1152I
- Part Number:
- M2S100S-1FCG1152I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3668746-M2S100S-1FCG1152I
- Description:
- IC FPGA SOC 100K LUTS 1152FCBGA
- ECAD Model:
-
Microsemi Corporation M2S100S-1FCG1152I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S100S-1FCG1152I.
- Package / Case1152-BBGA, FCBGA
- Supplier Device Package1152-FCBGA (35x35)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®2
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Frequency166MHz
- Base Part NumberM2S100S
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O574
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Primary AttributesFPGA - 100K Logic Modules
- Flash Size512KB
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Supplier Device Package for this particular product is a 1152-FCBGA (35x35). However, it should be noted that the Part Status for this package is currently listed as Obsolete. The Moisture Sensitivity Level (MSL) for this device is rated at 3, meaning it can withstand up to 168 hours of exposure to moisture. Additionally, the Max Operating Temperature for this product is 100°C, making it suitable for use in high-temperature environments. The Frequency of this device is 166MHz, and it has a total of 574 I/Os. The RAM Size for this device is 64KB, and it utilizes an ARM® Cortex®-M3 Core Processor with an ARM Core Architecture. Its Primary Attributes include being an FPGA with 100K Logic Modules. These specifications make this device a versatile and powerful option for a variety of applications.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S100S-1FCG1152I System On Chip (SoC) applications.
Personal Computers
Defense
Industrial sectors
Smartphone accessories
Vending machines
Robotics
Industrial robot
Remote control
Special Issue Editors
Fitness
The Supplier Device Package for this particular product is a 1152-FCBGA (35x35). However, it should be noted that the Part Status for this package is currently listed as Obsolete. The Moisture Sensitivity Level (MSL) for this device is rated at 3, meaning it can withstand up to 168 hours of exposure to moisture. Additionally, the Max Operating Temperature for this product is 100°C, making it suitable for use in high-temperature environments. The Frequency of this device is 166MHz, and it has a total of 574 I/Os. The RAM Size for this device is 64KB, and it utilizes an ARM® Cortex®-M3 Core Processor with an ARM Core Architecture. Its Primary Attributes include being an FPGA with 100K Logic Modules. These specifications make this device a versatile and powerful option for a variety of applications.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S100S-1FCG1152I System On Chip (SoC) applications.
Personal Computers
Defense
Industrial sectors
Smartphone accessories
Vending machines
Robotics
Industrial robot
Remote control
Special Issue Editors
Fitness
M2S100S-1FCG1152I More Descriptions
IC SOC CORTEX-M3 166MHZ 1152BGA
IC FPGA SOC 100K LUTS 1152FCBGA
SMARTFUSION2 SOC FPGA
IC FPGA SOC 100K LUTS 1152FCBGA
SMARTFUSION2 SOC FPGA
The three parts on the right have similar specifications to M2S100S-1FCG1152I.
-
ImagePart NumberManufacturerPackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitecturePrimary AttributesFlash SizeRoHS StatusFactory Lead TimeLifecycle StatusSurface MountJESD-609 CodeNumber of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of InputsProgrammable Logic TypeNumber of Logic CellsTerminal PitchHeight Seated (Max)LengthWidthReach Compliance CodeView Compare
-
M2S100S-1FCG1152I1152-BBGA, FCBGA1152-FCBGA (35x35)-40°C~100°C TJTray2009SmartFusion®2Obsolete3 (168 Hours)100°C-40°C166MHzM2S100SCAN, Ethernet, I2C, SPI, UART, USART, USB574166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 100K Logic Modules512KBRoHS Compliant----------------------------- -
536-LFBGA, CSPBGA-0°C~85°C TJTray2015SmartFusion®2Active3 (168 Hours)-----293166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 150K Logic Modules512KBRoHS Compliant10 WeeksIN PRODUCTION (Last Updated: 1 month ago)YESe0536Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2VNOT SPECIFIEDS-PBGA-B536293Not Qualified1.26V1.2V1.14V293FIELD PROGRAMMABLE GATE ARRAY146124-----
-
1152-BBGA, FCBGA-0°C~85°C TJTray2009SmartFusion®2Obsolete3 (168 Hours)--166MHzM2S100CAN, Ethernet, I2C, SPI, UART, USART, USB574-64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 100K Logic Modules512KBRoHS Compliant--YES----Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2VNOT SPECIFIEDS-PBGA-B1152574Not Qualified1.26V1.2V1.14V574FIELD PROGRAMMABLE GATE ARRAY995121mm2.9mm35mm35mm-
-
1152-BBGA, FCBGA--40°C~100°C TJTray-SmartFusion®2Active3 (168 Hours)-----574166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 150K Logic Modules512KBNon-RoHS Compliant10 WeeksIN PRODUCTION (Last Updated: 1 month ago)YESe0-Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2VNOT SPECIFIEDS-PBGA-B1152574Not Qualified1.26V1.2V1.14V574FIELD PROGRAMMABLE GATE ARRAY1461241mm2.9mm35mm35mmnot_compliant
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
27 September 2023
BC640 PNP Transistor: Features, Package and Other Details
Ⅰ. Overview of BC640Ⅱ. Symbol and footprint of BC640Ⅲ. Technical parametersⅣ. Features of BC640Ⅴ. Pinout and package of BC640Ⅵ. Application of BC640Ⅶ. How to optimize the performance of... -
27 September 2023
Introduction to the BTS7960B Motor Drive Module
Ⅰ. What is BTS7960B?Ⅱ. BTS7960B symbol, footprint and pin configurationⅢ. Technical parametersⅣ. Features of BTS7960BⅤ. What are the advantages and disadvantages of BTS7960B?Ⅵ. How to optimize the BTS7960B... -
28 September 2023
MPSA56 PNP General Purpose Transistor: Features, Working Principle and Application
Ⅰ. Overview of MPSA56Ⅱ. Symbol and footprint of MPSA56Ⅲ. Technical parametersⅣ. Features of MPSA56Ⅴ. Pinout and package of MPSA56Ⅵ. How does MPSA56 work?Ⅶ. How does the MPSA56 transistor... -
28 September 2023
TIP35C Footprint, Package, Application and Other Details
Ⅰ. Overview of TIP35CⅡ. Symbol and footprint of TIP35CⅢ. Technical parametersⅣ. Features of TIP35CⅤ. Pinout and package of TIP35CⅥ. Working principle of TIP35C audio power amplifierⅦ. Application of...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.