IXYS IXFN64N50P
- Part Number:
- IXFN64N50P
- Manufacturer:
- IXYS
- Ventron No:
- 2483033-IXFN64N50P
- Description:
- MOSFET N-CH 500V 61A SOT-227
- Datasheet:
- IXFN64N50P
IXYS IXFN64N50P technical specifications, attributes, parameters and parts with similar specifications to IXYS IXFN64N50P.
- Factory Lead Time30 Weeks
- MountChassis Mount, Panel, Screw
- Mounting TypeChassis Mount
- Package / CaseSOT-227-4, miniBLOC
- Number of Pins4
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~150°C TJ
- PackagingTube
- SeriesPolarHV™
- Published2003
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations4
- ECCN CodeEAR99
- Resistance85MOhm
- Terminal FinishNickel (Ni)
- Additional FeatureAVALANCHE RATED, UL RECOGNIZED
- SubcategoryFET General Purpose Power
- Voltage - Rated DC500V
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionUPPER
- Terminal FormUNSPECIFIED
- Current Rating64A
- Pin Count4
- Number of Elements1
- Power Dissipation-Max700W Tc
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Power Dissipation700W
- Case ConnectionISOLATED
- Turn On Delay Time30 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs85m Ω @ 32A, 10V
- Vgs(th) (Max) @ Id5.5V @ 8mA
- Input Capacitance (Ciss) (Max) @ Vds8700pF @ 25V
- Current - Continuous Drain (Id) @ 25°C61A Tc
- Gate Charge (Qg) (Max) @ Vgs150nC @ 10V
- Rise Time25ns
- Drive Voltage (Max Rds On,Min Rds On)10V
- Vgs (Max)±30V
- Fall Time (Typ)22 ns
- Turn-Off Delay Time85 ns
- Continuous Drain Current (ID)61A
- Threshold Voltage5.5V
- Gate to Source Voltage (Vgs)30V
- Drain Current-Max (Abs) (ID)50A
- Drain to Source Breakdown Voltage500V
- Avalanche Energy Rating (Eas)2500 mJ
- Height9.6mm
- Length38.23mm
- Width25.42mm
- REACH SVHCNo SVHC
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
IXFN64N50P Overview
This type of breakdown is known as "avalanche breakdown", and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 2500 mJ.The maximum input capacitance of this device is 8700pF @ 25V, because the input capacitance of an op amp is defined as the difference between the input terminals with one input grounded.Continuous drain current (ID) is the maximum continuous current (ID) the device can conduct, and it is 61A.When VGS=500V, and ID flows to VDS at 500VVDS, the drain-source breakdown voltage is 500V in this device.As shown in the table below, the drain current of this device is 50A.Before drain current conduction can begin, the device's turn-off delay time must be charged up to full capacitance. This value is 85 ns.During device turn-on, the input capacitance must be charged for a period of time before drain current conduction can begin, so its delay time is 30 ns seconds.Single MOSFETs transistor is the voltage across the gate-source terminal of a transistor that determines the gate-source voltage, VGS.This transistor's threshold voltage is 5.5V volts, which indicates that a transistor is ready to perform any of its operations at that voltage.Using drive voltage (10V), this device helps reduce its power consumption.
IXFN64N50P Features
the avalanche energy rating (Eas) is 2500 mJ
a continuous drain current (ID) of 61A
a drain-to-source breakdown voltage of 500V voltage
the turn-off delay time is 85 ns
a threshold voltage of 5.5V
IXFN64N50P Applications
There are a lot of IXYS
IXFN64N50P applications of single MOSFETs transistors.
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
This type of breakdown is known as "avalanche breakdown", and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 2500 mJ.The maximum input capacitance of this device is 8700pF @ 25V, because the input capacitance of an op amp is defined as the difference between the input terminals with one input grounded.Continuous drain current (ID) is the maximum continuous current (ID) the device can conduct, and it is 61A.When VGS=500V, and ID flows to VDS at 500VVDS, the drain-source breakdown voltage is 500V in this device.As shown in the table below, the drain current of this device is 50A.Before drain current conduction can begin, the device's turn-off delay time must be charged up to full capacitance. This value is 85 ns.During device turn-on, the input capacitance must be charged for a period of time before drain current conduction can begin, so its delay time is 30 ns seconds.Single MOSFETs transistor is the voltage across the gate-source terminal of a transistor that determines the gate-source voltage, VGS.This transistor's threshold voltage is 5.5V volts, which indicates that a transistor is ready to perform any of its operations at that voltage.Using drive voltage (10V), this device helps reduce its power consumption.
IXFN64N50P Features
the avalanche energy rating (Eas) is 2500 mJ
a continuous drain current (ID) of 61A
a drain-to-source breakdown voltage of 500V voltage
the turn-off delay time is 85 ns
a threshold voltage of 5.5V
IXFN64N50P Applications
There are a lot of IXYS
IXFN64N50P applications of single MOSFETs transistors.
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
IXFN64N50P More Descriptions
Single N-Channel 500 Vds 85 mOhm 700 W Power Mosfet - SOT-227B
Mosfet, N Channel, 500V, 61A, Sot-227B; Transistor Polarity:N Channel; Drain Source Voltage Vds:500V; Continuous Drain Current Id:61A; On Resistance Rds(On):0.085Ohm; Transistor Mounting:Module; Rds(On) Test Voltage Vgs:10V; Msl:- Rohs Compliant: Yes |Ixys Semiconductor IXFN64N50P
Transistor Polarity = N-Channel / Configuration = Single / Continuous Drain Current (Id) A = 61 / Drain-Source Voltage (Vds) V = 500 / ON Resistance (Rds(on)) mOhm = 85 / Gate-Source Threshold Voltage V = 5.5 / Gate-Source Voltage V = 30 / Power Dissipation (Pd) W = 700 / Operating Temperature Min. °C = -55 / Operating Temperature Max. °C = 150 / Fall Time ns = 22 / Rise Time ns = 25 / Turn-OFF Delay Time ns = 85 / Turn-ON Delay Time ns = 30 / Package Type = SOT-227B / Mounting Type = SMD / Packaging = Tube
MOSFET, N, SOT-227B; Transistor Polarity: N Channel; Continuous Drain Current Id: 64A; Drain Source Voltage Vds: 500V; On Resistance Rds(on): 0.085ohm; Rds(on) Test Voltage Vgs: 10V; Threshold Voltage Vgs: 5.5V; Power Dissipation Pd: 700W; Transistor Case Style: ISOTOP; No. of Pins: 4Pins; Operating Temperature Max: 150°C; Product Range: -; Automotive Qualification Standard: -; MSL: -; SVHC: No SVHC (12-Jan-2017); Capacitance Ciss Typ: 8700pF; Current Id Max: 61A; Junction to Case Thermal Resistance A: 0.18°C/W; N-channel Gate Charge: 150nC; Operating Temperature Min: -55°C; Operating Temperature Range: -55°C to 150°C; Reverse Recovery Time trr Max: 200ns; Termination Type: Screw; Voltage Vds Typ: 500V; Voltage Vgs Max: 30V; Voltage Vgs Rds on Measurement: 10V
Mosfet, N Channel, 500V, 61A, Sot-227B; Transistor Polarity:N Channel; Drain Source Voltage Vds:500V; Continuous Drain Current Id:61A; On Resistance Rds(On):0.085Ohm; Transistor Mounting:Module; Rds(On) Test Voltage Vgs:10V; Msl:- Rohs Compliant: Yes |Ixys Semiconductor IXFN64N50P
Transistor Polarity = N-Channel / Configuration = Single / Continuous Drain Current (Id) A = 61 / Drain-Source Voltage (Vds) V = 500 / ON Resistance (Rds(on)) mOhm = 85 / Gate-Source Threshold Voltage V = 5.5 / Gate-Source Voltage V = 30 / Power Dissipation (Pd) W = 700 / Operating Temperature Min. °C = -55 / Operating Temperature Max. °C = 150 / Fall Time ns = 22 / Rise Time ns = 25 / Turn-OFF Delay Time ns = 85 / Turn-ON Delay Time ns = 30 / Package Type = SOT-227B / Mounting Type = SMD / Packaging = Tube
MOSFET, N, SOT-227B; Transistor Polarity: N Channel; Continuous Drain Current Id: 64A; Drain Source Voltage Vds: 500V; On Resistance Rds(on): 0.085ohm; Rds(on) Test Voltage Vgs: 10V; Threshold Voltage Vgs: 5.5V; Power Dissipation Pd: 700W; Transistor Case Style: ISOTOP; No. of Pins: 4Pins; Operating Temperature Max: 150°C; Product Range: -; Automotive Qualification Standard: -; MSL: -; SVHC: No SVHC (12-Jan-2017); Capacitance Ciss Typ: 8700pF; Current Id Max: 61A; Junction to Case Thermal Resistance A: 0.18°C/W; N-channel Gate Charge: 150nC; Operating Temperature Min: -55°C; Operating Temperature Range: -55°C to 150°C; Reverse Recovery Time trr Max: 200ns; Termination Type: Screw; Voltage Vds Typ: 500V; Voltage Vgs Max: 30V; Voltage Vgs Rds on Measurement: 10V
The three parts on the right have similar specifications to IXFN64N50P.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedPbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeResistanceTerminal FinishAdditional FeatureSubcategoryVoltage - Rated DCTechnologyTerminal PositionTerminal FormCurrent RatingPin CountNumber of ElementsPower Dissipation-MaxElement ConfigurationOperating ModePower DissipationCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Threshold VoltageGate to Source Voltage (Vgs)Drain Current-Max (Abs) (ID)Drain to Source Breakdown VoltageAvalanche Energy Rating (Eas)HeightLengthWidthREACH SVHCRadiation HardeningRoHS StatusLead FreeWeightTerminationPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)JESD-30 CodeQualification StatusConfigurationPulsed Drain Current-Max (IDM)Dual Supply VoltageIsolation VoltageNominal VgsDrain to Source Voltage (Vdss)View Compare
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IXFN64N50P30 WeeksChassis Mount, Panel, ScrewChassis MountSOT-227-4, miniBLOC4SILICON-55°C~150°C TJTubePolarHV™2003yesActive1 (Unlimited)4EAR9985MOhmNickel (Ni)AVALANCHE RATED, UL RECOGNIZEDFET General Purpose Power500VMOSFET (Metal Oxide)UPPERUNSPECIFIED64A41700W TcSingleENHANCEMENT MODE700WISOLATED30 nsN-ChannelSWITCHING85m Ω @ 32A, 10V5.5V @ 8mA8700pF @ 25V61A Tc150nC @ 10V25ns10V±30V22 ns85 ns61A5.5V30V50A500V2500 mJ9.6mm38.23mm25.42mmNo SVHCNoROHS3 CompliantLead Free-------------
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-Chassis Mount, ScrewChassis MountSOT-227-4, miniBLOC3SILICON-55°C~150°C TJTubeHiPerFET™2000yesObsolete1 (Unlimited)4EAR9912.5mOhmNickel (Ni)AVALANCHE RATED--MOSFET (Metal Oxide)UPPERUNSPECIFIED-41600W Tc-ENHANCEMENT MODE600WISOLATED50 nsN-ChannelSWITCHING12.5m Ω @ 75A, 10V4V @ 8mA9100pF @ 25V150A Tc360nC @ 10V60ns10V±20V45 ns110 ns150A-20V-150V-9.6mm38.2mm25.07mmNo SVHC-RoHS CompliantLead Free44gScrewNOT SPECIFIEDNOT SPECIFIEDR-PUFM-X4Not QualifiedSINGLE WITH BUILT-IN DIODE600A150V2.5kV4 V-
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30 WeeksChassis MountChassis MountSOT-227-4, miniBLOC4SILICON-55°C~150°C TJBulkHiPerFET™2000yesObsolete1 (Unlimited)4EAR9912mOhmNickel (Ni)AVALANCHE RATEDFET General Purpose Power100VMOSFET (Metal Oxide)UPPERUNSPECIFIED150A41520W Tc-ENHANCEMENT MODE520WDRAIN-N-ChannelSWITCHING12m Ω @ 75A, 10V4V @ 8mA9000pF @ 25V150A Tc360nC @ 10V60ns10V±20V60 ns100 ns150A-20V-100V------Non-RoHS CompliantLead Free--NOT SPECIFIEDNOT SPECIFIED-Not QualifiedSINGLE WITH BUILT-IN DIODE560A----
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30 WeeksChassis MountChassis MountSOT-227-4, miniBLOC4SILICON-55°C~150°C TJTubePolar™2008yesActive1 (Unlimited)4-220MOhmNickel (Ni)AVALANCHE RATED, UL RECOGNIZEDFET General Purpose Power-MOSFET (Metal Oxide)UPPERUNSPECIFIED-41890W Tc-ENHANCEMENT MODE890WISOLATED-N-ChannelSWITCHING220m Ω @ 22A, 10V6.5V @ 1mA19000pF @ 25V37A Tc305nC @ 10V68ns10V±30V54 ns90 ns37A-30V-1kV2000 mJ-----ROHS3 CompliantLead Free--NOT SPECIFIEDNOT SPECIFIED-Not QualifiedSINGLE WITH BUILT-IN DIODE110A---1000V
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