TL074CN Symbol, Features and Package
18 September 2023
Ⅱ. 3D Model and symbol of TL074CN
Ⅷ. How to optimize the package of TL074CN to improve its efficiency?
TL074CN is a power field effect transistor operational amplifier suitable for amplification, filtering and signal processing in electronic circuits. There are four independent operational amplifiers in the TL074CN, each with a feedback-free input (positive input + and negative input -), a feedback input (usually connected to the output), and a power supply pin (positive supply + Vcc and negative supply - Vcc).
It has 14 pins and the package type is PDIP-14. The device features a through-hole mount, low harmonic distortion and low noise, making it ideal for high-fidelity and audio preamplifier applications. In addition, it offers offset adjustment and external compensation options with lower input offset and bias current. Nonetheless, its slew rate is very high, making it excellent at audio signal processing.
Replacement and equivalent：
• TL074CDR
• TL084CN
• TL084BCN
• NTE859
The TLO74CN operational amplifier includes 14 pins, and its pin configuration is shown in the figure below:
Pin1: The output of the first operational amplifier
Pin2: The inverting i/p voltage of the first operational amplifier
Pin3: The non-inverting i/p voltage of the first operational amplifier
Pin4 (Vcc+): Positive voltage power supply pin
Pin5: The second op amp non-inverting i/p voltage
Pin6: The second operational amplifier inverting i/p voltage
Pin7: Output of the second operational amplifier
Pin8: The output of the third operational amplifier
Pin9: The third operational amplifier inverting i/p voltage
Pin10: Non-inverting i/p voltage of the third operational amplifier
Pin11(Vcc-): Negative voltage power supply
Pin12: Non-inverting i/p voltage of the fourth operational amplifier
Pin13: The inverting i/p voltage of the fourth operational amplifier
Pin14: The output of the fourth operational amplifier
• It has low harmonic distortion and is suitable for applications requiring high quality signal amplification.
• It has internal frequency compensation circuitry to improve the bandwidth and stability of the amplifier.
• It has internal current-limiting protection to prevent excessive input signals from damaging the device.
• It has lower input bias current which helps in reducing power consumption and distortion in the circuit.
• It has a wide operating voltage range and is generally used in single-phase or two-phase power supply circuits.
• It provides relatively high input impedance without much loading effect on external circuitry.
• It has relatively low input noise and is suitable for applications requiring a high signal-to-noise ratio, such as audio amplifiers.
• Professional mixer
• Battery testing equipment
• Solar: string and central inverters
• Motor drives: AC and servo drive control and power stage modules
DIP packaging, also known as Dual In-line Package, is a common package method. Its emergence is mainly to meet the storage and physical performance needs of integrated circuits. The biggest feature of this package is that it uses two parallel pins extending outward from both ends of the two pins to ensure the stability of the circuit.
TL074CN is packaged in DIP-14, indicating that it has 14 pins or interfaces. The role of these pins may vary depending on the specific circuit design and application, but they are generally used to provide power, ground, input signals, output signals, etc. to the integrated circuit. In addition to serving as a voltage converter between power and ground, the TL074CN package may also include important elements such as thermal management, mechanical support, and protection circuitry. To ensure the effectiveness of a package, we also need to consider how thermal management materials and structural elements are integrated into the package to effectively dissipate heat and keep the circuit functioning properly.
First, we can optimize the pins. Pins play an important role between the chip and peripheral circuits. Optimizing pin design can effectively improve signal transmission. By adjusting the pin distribution and increasing the number of pins, the transmission path of the system is optimized, thereby improving the receiving performance of the system.
Second, we can use low-stress materials. Using low-stress materials on the package can reduce the impact of the external environment on the chip and prevent the chip from being damaged or performance affected. At the same time, the use of low-stress materials can also improve the reliability of the package. We can also add a metal shielding layer to the packaging shell to improve the electromagnetic shielding performance and prevent external electromagnetic interference from affecting the chip.
Third, we can strengthen mechanical support. In order to ensure the stability and reliability of the TL074CN package, we need to add a mechanical support structure to the package to improve the strength and stability of the entire package.
Fourth, we can optimize the internal circuit design. We can use lower resistance, smaller capacitance and other components to reduce energy consumption and noise interference in the circuit and improve the efficiency of the entire circuit.
Fifth, we can optimize the heat dissipation design. The TL074CN package should be able to effectively dissipate the heat generated by the chip without causing the package itself to become too hot. We can add heat sinks to the package and use natural convection or forced air cooling to reduce the temperature of the package and chip.
Frequently Asked Questions
1. What is the IC equivalent of TL074CN?
The equivalent of TL074CN is TL074CDR, TL084CN, TL084BCN and NTE859.
2. What is the function of TL074CN?
The TL074CN is the next-generation version of the industry-standard TL07x (TL071, TL072, and TL074) devices. The TL074CN provides outstanding value for cost-sensitive applications, with features including low offset (1 mV, typical), high slew rate (20 V/μs), and common-mode input to the positive supply.
