Infineon Technologies IRF7832TR
- Part Number:
- IRF7832TR
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 2492601-IRF7832TR
- Description:
- MOSFET N-CH 30V 20A 8-SOIC
- Datasheet:
- IRF7832TR
Infineon Technologies IRF7832TR technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF7832TR.
- Mounting TypeSurface Mount
- Package / Case8-SOIC (0.154, 3.90mm Width)
- Surface MountYES
- Transistor Element MaterialSILICON
- PackagingCut Tape (CT)
- SeriesHEXFET®
- Published2005
- JESD-609 Codee3
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PDSO-G8
- Qualification StatusNot Qualified
- Number of Elements1
- ConfigurationSINGLE WITH BUILT-IN DIODE
- Operating ModeENHANCEMENT MODE
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs4m Ω @ 20A, 10V
- Vgs(th) (Max) @ Id2.32V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds4310pF @ 15V
- Current - Continuous Drain (Id) @ 25°C20A Ta
- Gate Charge (Qg) (Max) @ Vgs51nC @ 4.5V
- Drain to Source Voltage (Vdss)30V
- JEDEC-95 CodeMS-012AA
- Drain Current-Max (Abs) (ID)20A
- Drain-source On Resistance-Max0.004Ohm
- Pulsed Drain Current-Max (IDM)160A
- DS Breakdown Voltage-Min30V
- Avalanche Energy Rating (Eas)260 mJ
- RoHS StatusNon-RoHS Compliant
IRF7832TR Overview
There is an avalanche breakdown in which energy is applied to the MOSFET to cause it to break down, and this energy is called avalanche energy, and the avalanche energy rating (Eas) is 260 mJ.Op amps with either input grounded have a fixed input capacitance parameter, CI, and this device has a 4310pF @ 15V maximal input capacitance.A device can conduct a maximum continuous current of [20A] according to its drain current.As far as peak drain current is concerned, its maximum pulsed current is 160A.The DS breakdown voltage should be maintained above 30V to maintain normal operation.To operate this transistor, you will need a 30V drain to source voltage (Vdss).
IRF7832TR Features
the avalanche energy rating (Eas) is 260 mJ
based on its rated peak drain current 160A.
a 30V drain to source voltage (Vdss)
IRF7832TR Applications
There are a lot of Infineon Technologies
IRF7832TR applications of single MOSFETs transistors.
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
There is an avalanche breakdown in which energy is applied to the MOSFET to cause it to break down, and this energy is called avalanche energy, and the avalanche energy rating (Eas) is 260 mJ.Op amps with either input grounded have a fixed input capacitance parameter, CI, and this device has a 4310pF @ 15V maximal input capacitance.A device can conduct a maximum continuous current of [20A] according to its drain current.As far as peak drain current is concerned, its maximum pulsed current is 160A.The DS breakdown voltage should be maintained above 30V to maintain normal operation.To operate this transistor, you will need a 30V drain to source voltage (Vdss).
IRF7832TR Features
the avalanche energy rating (Eas) is 260 mJ
based on its rated peak drain current 160A.
a 30V drain to source voltage (Vdss)
IRF7832TR Applications
There are a lot of Infineon Technologies
IRF7832TR applications of single MOSFETs transistors.
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
IRF7832TR More Descriptions
30V Single N-Channel HEXFET Power MOSFET in a SO-8 package
Trans MOSFET N-CH 30V 20A 8-Pin SOIC T/R
Power Field-Effect Transistor, 20A I(D), 30V, 0.004ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA, SOP-8
Trans MOSFET N-CH 30V 20A 8-Pin SOIC T/R
Power Field-Effect Transistor, 20A I(D), 30V, 0.004ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA, SOP-8
The three parts on the right have similar specifications to IRF7832TR.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountTransistor Element MaterialPackagingSeriesPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)JESD-30 CodeQualification StatusNumber of ElementsConfigurationOperating ModeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsDrain to Source Voltage (Vdss)JEDEC-95 CodeDrain Current-Max (Abs) (ID)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)DS Breakdown Voltage-MinAvalanche Energy Rating (Eas)RoHS StatusOperating TemperatureAdditional FeatureHTS CodePower Dissipation-MaxDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)MountSupplier Device PackageMax Power DissipationContinuous Drain Current (ID)Input CapacitanceRds On MaxFactory Lead TimeNumber of PinsResistanceVoltage - Rated DCCurrent RatingElement ConfigurationPower DissipationOutput CurrentTurn On Delay TimeRise TimeFall Time (Typ)Turn-Off Delay TimeThreshold VoltageGate to Source Voltage (Vgs)Drain to Source Breakdown VoltageDual Supply VoltageRecovery TimeNominal VgsHeightLengthWidthREACH SVHCRadiation HardeningLead FreeView Compare
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IRF7832TRSurface Mount8-SOIC (0.154, 3.90mm Width)YESSILICONCut Tape (CT)HEXFET®2005e3Obsolete1 (Unlimited)8EAR99Matte Tin (Sn)MOSFET (Metal Oxide)DUALGULL WINGNOT SPECIFIEDNOT SPECIFIEDR-PDSO-G8Not Qualified1SINGLE WITH BUILT-IN DIODEENHANCEMENT MODEN-ChannelSWITCHING4m Ω @ 20A, 10V2.32V @ 250μA4310pF @ 15V20A Ta51nC @ 4.5V30VMS-012AA20A0.004Ohm160A30V260 mJNon-RoHS Compliant-------------------------------------
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Surface Mount8-SOIC (0.154, 3.90mm Width)YESSILICONTape & Reel (TR)HEXFET®2003-Obsolete1 (Unlimited)8EAR99-MOSFET (Metal Oxide)DUALGULL WINGNOT SPECIFIEDNOT SPECIFIEDR-PDSO-G8Not Qualified1SINGLE WITH BUILT-IN DIODEENHANCEMENT MODEN-ChannelSWITCHING30m Ω @ 7.3A, 10V1V @ 250μA550pF @ 25V7.3A Tc28nC @ 10V30VMS-012AA7.3A0.03Ohm58A30V70 mJNon-RoHS Compliant-55°C~150°C TJLOGIC LEVEL COMPATIBLE8541.29.00.952.5W Tc4.5V 10V±20V------------------------------
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Through HoleTO-262-3 Long Leads, I2Pak, TO-262AA--Tube-2016-Obsolete1 (Unlimited)---MOSFET (Metal Oxide)---------N-Channel-3.6Ohm @ 1.2A, 10V4V @ 250μA170pF @ 25V2A Tc17nC @ 10V400V------Non-RoHS Compliant-55°C~150°C TJ---10V±20VThrough HoleI2PAK3.1W2A170pF3.6 Ω------------------------
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Surface Mount8-SOIC (0.154, 3.90mm Width)-SILICONTape & Reel (TR)HEXFET®1997-Active1 (Unlimited)8--MOSFET (Metal Oxide)DUALGULL WING----1-ENHANCEMENT MODEP-ChannelSWITCHING60m Ω @ 5.3A, 10V2.5V @ 250μA860pF @ 10V5.3A Ta25nC @ 10V20V------ROHS3 Compliant-55°C~150°C TJLOGIC LEVEL COMPATIBLE-2.5W Tc4.5V 10V±12VSurface Mount---5.3A--12 Weeks860mOhm-20V-5.3ASingle2.5W5.3A14 ns26ns68 ns100 ns-2.5V12V-20V-20V100 ns-2.5 V1.4986mm4.9784mm3.9878mmNo SVHCNoContains Lead, Lead Free
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