Infineon Technologies IRF6710S2TRPBF
- Part Number:
- IRF6710S2TRPBF
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 2851830-IRF6710S2TRPBF
- Description:
- MOSFET N-CH 25V 12A DIRECTFET
- Datasheet:
- IRF6710S2TRPBF
Infineon Technologies IRF6710S2TRPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF6710S2TRPBF.
- Factory Lead Time15 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / CaseDirectFET™ Isometric S1
- Number of Pins6
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~175°C TJ
- PackagingTape & Reel (TR)
- SeriesHEXFET®
- Published2008
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations2
- ECCN CodeEAR99
- SubcategoryFET General Purpose Power
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionBOTTOM
- JESD-30 CodeR-XBCC-N2
- Number of Elements1
- ConfigurationSINGLE WITH BUILT-IN DIODE
- Power Dissipation-Max1.8W Ta 15W Tc
- Operating ModeENHANCEMENT MODE
- Power Dissipation15W
- Case ConnectionDRAIN
- Turn On Delay Time7.9 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs5.9m Ω @ 12A, 10V
- Vgs(th) (Max) @ Id2.4V @ 25μA
- Input Capacitance (Ciss) (Max) @ Vds1190pF @ 13V
- Current - Continuous Drain (Id) @ 25°C12A Ta 37A Tc
- Gate Charge (Qg) (Max) @ Vgs13nC @ 4.5V
- Rise Time20ns
- Drive Voltage (Max Rds On,Min Rds On)4.5V 10V
- Vgs (Max)±20V
- Fall Time (Typ)6 ns
- Turn-Off Delay Time5.2 ns
- Continuous Drain Current (ID)12mA
- Gate to Source Voltage (Vgs)20V
- Drain-source On Resistance-Max0.0059Ohm
- Drain to Source Breakdown Voltage25V
- Avalanche Energy Rating (Eas)24 mJ
- Height558.8μm
- Length4.826mm
- Width3.95mm
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
IRF6710S2TRPBF Overview
When a voltage exceeds breakdown voltage of a MOSFET, breakdown phenomena occurs and current flows. It's called “Avalanche break down”, and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 24 mJ.The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 1190pF @ 13V.The drain current is the maximum continuous current the device can conduct, and the continuous drain current (ID) of this device is 12mA. Drain-source breakdown voltage is the VDS at which a specified value of ID flows, with VGS=25V. And this device has 25V drain to source breakdown voltage.Turn-Off delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 5.2 ns.Turn-on delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its delay time is 7.9 ns.The gate-source voltage, VGS, of a FET transistor is the voltage that falls across the gate-source terminal of the transistor and its voltage can be 20V.By using drive voltage (4.5V 10V), this device helps reduce its overall power consumption.
IRF6710S2TRPBF Features
the avalanche energy rating (Eas) is 24 mJ
a continuous drain current (ID) of 12mA
a drain-to-source breakdown voltage of 25V voltage
the turn-off delay time is 5.2 ns
IRF6710S2TRPBF Applications
There are a lot of Infineon Technologies
IRF6710S2TRPBF applications of single MOSFETs transistors.
LCD/LED TV
Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
When a voltage exceeds breakdown voltage of a MOSFET, breakdown phenomena occurs and current flows. It's called “Avalanche break down”, and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 24 mJ.The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 1190pF @ 13V.The drain current is the maximum continuous current the device can conduct, and the continuous drain current (ID) of this device is 12mA. Drain-source breakdown voltage is the VDS at which a specified value of ID flows, with VGS=25V. And this device has 25V drain to source breakdown voltage.Turn-Off delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 5.2 ns.Turn-on delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its delay time is 7.9 ns.The gate-source voltage, VGS, of a FET transistor is the voltage that falls across the gate-source terminal of the transistor and its voltage can be 20V.By using drive voltage (4.5V 10V), this device helps reduce its overall power consumption.
IRF6710S2TRPBF Features
the avalanche energy rating (Eas) is 24 mJ
a continuous drain current (ID) of 12mA
a drain-to-source breakdown voltage of 25V voltage
the turn-off delay time is 5.2 ns
IRF6710S2TRPBF Applications
There are a lot of Infineon Technologies
IRF6710S2TRPBF applications of single MOSFETs transistors.
LCD/LED TV
Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
IRF6710S2TRPBF More Descriptions
Trans MOSFET N-CH 25V 12A 6-Pin Direct-FET S1 T/R
A 25V Single N-Channel HEXFET Power MOSFET in a DirectFET S1 package rated at 12 amperes optimized with low on resistance. Shipped in Tape and Reel only. Part is not available in bulk, TR is implied in part number.
MOSFET Transistor; Transistor Polarity:N Channel; Continuous Drain Current, Id:12mA; Drain Source Voltage, Vds:25V; On Resistance, Rds(on):0.0045ohm; Rds(on) Test Voltage, Vgs:4.5V; Threshold Voltage, Vgs Typ:1.8V ;RoHS Compliant: Yes
Benefits: RoHS Compliant; 100% Rg tested; Low Profile (less than 0.7 mm); Dual Sided Cooling; Optimized for Control FET Applications; Optimized for High Frequency Switching; Low Package Inductance | Target Applications: MultiPhase ControlFET
A 25V Single N-Channel HEXFET Power MOSFET in a DirectFET S1 package rated at 12 amperes optimized with low on resistance. Shipped in Tape and Reel only. Part is not available in bulk, TR is implied in part number.
MOSFET Transistor; Transistor Polarity:N Channel; Continuous Drain Current, Id:12mA; Drain Source Voltage, Vds:25V; On Resistance, Rds(on):0.0045ohm; Rds(on) Test Voltage, Vgs:4.5V; Threshold Voltage, Vgs Typ:1.8V ;RoHS Compliant: Yes
Benefits: RoHS Compliant; 100% Rg tested; Low Profile (less than 0.7 mm); Dual Sided Cooling; Optimized for Control FET Applications; Optimized for High Frequency Switching; Low Package Inductance | Target Applications: MultiPhase ControlFET
The three parts on the right have similar specifications to IRF6710S2TRPBF.
-
ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeSubcategoryTechnologyTerminal PositionJESD-30 CodeNumber of ElementsConfigurationPower Dissipation-MaxOperating ModePower DissipationCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Gate to Source Voltage (Vgs)Drain-source On Resistance-MaxDrain to Source Breakdown VoltageAvalanche Energy Rating (Eas)HeightLengthWidthRadiation HardeningRoHS StatusDrain to Source Voltage (Vdss)Supplier Device PackageWeightMax Operating TemperatureMin Operating TemperatureNumber of ChannelsElement ConfigurationInput CapacitanceDrain to Source ResistanceRds On MaxVgs(th) (Max) @ Id:Technology:Supplier Device Package:Series:Rds On (Max) @ Id, Vgs:Power Dissipation (Max):Packaging:Package / Case:Operating Temperature:Mounting Type:Input Capacitance (Ciss) (Max) @ Vds:Gate Charge (Qg) (Max) @ Vgs:FET Type:FET Feature:Drain to Source Voltage (Vdss):Current - Continuous Drain (Id) @ 25°C:View Compare
-
IRF6710S2TRPBF15 WeeksSurface MountSurface MountDirectFET™ Isometric S16SILICON-55°C~175°C TJTape & Reel (TR)HEXFET®2008Obsolete1 (Unlimited)2EAR99FET General Purpose PowerMOSFET (Metal Oxide)BOTTOMR-XBCC-N21SINGLE WITH BUILT-IN DIODE1.8W Ta 15W TcENHANCEMENT MODE15WDRAIN7.9 nsN-ChannelSWITCHING5.9m Ω @ 12A, 10V2.4V @ 25μA1190pF @ 13V12A Ta 37A Tc13nC @ 4.5V20ns4.5V 10V±20V6 ns5.2 ns12mA20V0.0059Ohm25V24 mJ558.8μm4.826mm3.95mmNoRoHS Compliant---------------------------
-
--Through HoleTO-262-3 Long Leads, I2Pak, TO-262AA---TubeHEXFET®1998Obsolete1 (Unlimited)---MOSFET (Metal Oxide)----3.8W Ta 110W Tc----P-Channel-290m Ω @ 6.6A, 10V4V @ 250μA860pF @ 25V13A Tc66nC @ 10V-10V±20V-----------Non-RoHS Compliant150V-------------------------
-
-Surface MountSurface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB3--55°C~175°C TJTube-2009Obsolete1 (Unlimited)---MOSFET (Metal Oxide)----3.8W Ta 88W Tc---8.4 nsN-Channel-435mOhm @ 4.8A, 10V4V @ 250μA620pF @ 25V8A Tc34nC @ 10V16ns10V±20V15 ns28 ns8A20V---4.83mm10.67mm9.65mm-ROHS3 Compliant250VD2PAK1.437803g175°C-55°C1Single620pF435mOhm435 mΩ----------------
-
---------------------------------------------------------4V @ 250µAMOSFET (Metal Oxide)TO-220AB-450 mOhm @ 5.1A, 10V74W (Tc)TubeTO-220-3-55°C ~ 150°C (TJ)Through Hole770pF @ 25V41nC @ 10VN-Channel-250V8.1A (Tc)
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
27 March 2024
STM32F030K6T6 Microcontroller Symbol, Characteristics, Specifications and Other Details
Ⅰ. Description of STM32F030K6T6Ⅱ. Functional characteristics of STM32F030K6T6Ⅲ. STM32F030K6T6 specificationsⅣ. Structure of STM32F030K6T6Ⅴ. STM32F030K6T6 symbol, footprint and pin configurationⅥ. STM32F030K6T6 development tools and ecosystemⅦ. Application cases of STM32F030K6T6STM32F030K6T6... -
28 March 2024
An Introduction to TPS54302DDCR Synchronous Buck Converter
Ⅰ. What is TPS54302DDCR?Ⅱ. Characteristics of TPS54302DDCRⅢ. Simplified schematic of TPS54302DDCRⅣ. What are the advantages of TPS54302DDCR?Ⅴ. Technical parameters of TPS54302DDCRⅥ. Pin configuration and functions of TPS54302DDCRⅦ. Protection... -
28 March 2024
UCC27517DBVR Gate Driver: Replacements, Advantages, Application and Package
Ⅰ. UCC27517DBVR overviewⅡ. Technical parameters of UCC27517DBVRⅢ. UCC27517DBVR's typical characteristicsⅣ. What are the advantages of UCC27517DBVR compared with other gate driver ICs?Ⅴ. What applications is the UCC27517DBVR typically... -
29 March 2024
TLP2362 Optocoupler Characteristics, Specifications, Working Principle and More
Ⅰ. Overview of TLP2362Ⅱ. Characteristics of TLP2362Ⅲ. Specifications of TLP2362Ⅳ. Recommended operating conditions of TLP2362Ⅴ. How does TLP2362 work?Ⅵ. Internal equivalent circuit of TLP2362Ⅶ. Storage and soldering of...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.