TLP2362 Optocoupler Characteristics, Specifications, Working Principle and More
29 March 2024
Ⅳ. Recommended operating conditions of TLP2362
Ⅵ. Internal equivalent circuit of TLP2362
Ⅶ. Storage and soldering of TLP2362
Ⅷ. What precautions should be taken when using TLP2362 in the circuit?
TLP2362 is an optocoupler produced by Toshiba, which is suitable for direct connection with the digital pins of MCU. This coupler can be controlled and communicated via logic levels (high or low). This article will comprehensively introduce all the contents of TLP2362, including its characteristics, specifications, working principle, storage and soldering methods, as well as precautions when using it. So, let's get started.
TLP2362 is an optocoupler chip used to isolate and transmit electrical signals. Electrical isolation is achieved through optical coupling between input and output. This means that the signal transmission between the input and output circuits is by light rather than direct current transmission. The isolating nature of optocouplers helps provide electrical isolation and noise suppression, thereby enhancing system stability and security. It consists of a high-output infrared LED with integrated high-gain, high-speed photodetector. The TLP2362 has an internal Faraday shield that guarantees ±20 kV/μs common-mode transient immunity.
Alternatives and equivalents:
• CYTLP2362(TP)
• FODM8061
The following lists some of the characteristics of TLP2362:
1. High noise rejection: TLP2362 has low common mode conducted noise, which can effectively suppress electromagnetic interference.
2. Fast switching time: TLP2362 has low transmission delay and high bandwidth, suitable for high-speed signal transmission.
3. Wide operating voltage range: TLP2362 can work normally under DC24V power signal, which is very suitable for direct integration with DC24V circuit.
4. High isolation voltage: TLP2362 can provide isolation voltage up to 5000Vrms, which can effectively isolate the input and output circuits to ensure system safety.
• Package: SO-6
• Packaging: Tape & Reel (TR)
• Rise/Fall Time: 30 ns
• Isolation Voltage: 3750 Vrms
• Mounting Style: Surface Mount
• Supply Voltage: 2.7 V to 5.5 V
• Operating Temperature: -40°C to 125°C
Note: The recommended operating conditions given are design guidelines necessary to obtain the expected performance of the equipment. Each parameter is an independent value. When designing a system using this device, the electrical characteristics specified in this data sheet should also be considered.
Note: A ceramic capacitor (0.1µF) should be connected between pin 4 and pin 6 to stabilize the operation of a high-gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin.
Note 1: The rise and fall times of the input on-current should be less than 0.5µs.
Note 2: Denotes the operating range, not the recommended operating condition.
The working principle of TLP2362 is divided into two parts, which are the input side and the output side.
1. Input terminal
The input of the TLP2362 consists of an infrared light emitting diode (LED). When the input signal is high, the TLP2362's LED conducts and the LED generates an infrared light signal. When the input signal is low, the TIR2362's LED turns off and no infrared light signal is generated.
2. Output terminal
The output of the TLP2362 consists of a Phototransistor. The Phototransistor has a built-in light-sensitive structure. When the light-sensitive structure is exposed to the infrared light emitted by the LED, the Phototransistor is able to sense the light signal. When the LED is on, the infrared light signal is fed into the photodiode, triggering a current to flow through the circuit between the collector and the emitter of the photodiode to produce an output signal. Conversely, when the LED is off, the infrared light signal is no longer fed into the photodiode, which results in current ceasing to flow through the circuit between the collector and emitter of the photodiode, resulting in no output signal.
Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4.
1. Precautions for general storage
(1) When restoring devices after removal from their packing, use anti-static containers.
(2) Follow the precautions printed on the packing label of the device for transportation and storage.
(3) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
(4) Do not allow loads to be applied directly to devices while they are in storage.
(5) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions.
(6) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45 percent to 75 percent, respectively.
(7) If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use.
(8) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads.
2. Precautions for soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used.
(1) When using soldering Iron
• Complete soldering within 10 seconds for lead temperature not exceeding 260°C or within 3 seconds not exceeding 350°C
• Heating by soldering iron must be done only once per lead.
(2) When using soldering reflow
• The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.)
• Reflow soldering must be performed once or twice.
• The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
(3) When using soldering flow
• Preheat the device at a temperature of 150°C (package surface temperature) for 60 to 120 seconds.
• Mounting condition of 260°C within 10 seconds is recommended.
• Flow soldering must be performed once.
1. Operating temperature range: We need to consider the operating temperature range of TLP2362 to ensure reliable operation under the expected ambient conditions. As a photocoupler, TLP2362's material properties and internal structure determine its optimal operating temperature and the temperature limit it can withstand. If the operating ambient temperature exceeds its design range, it may result in degraded performance, reduced stability or even damage.
2. Forward current and voltage requirements: When selecting TLP2362, we need to carefully consider the forward current and voltage ratings of the LEDs according to the specific application scenarios and requirements. This includes, but is not limited to, consideration of signal speed, accuracy, transmission distance, and system power consumption and heat dissipation.
3. Isolation voltage: We must strictly screen and validate the TLP2362 optocoupler according to the application requirements and equipment operating environment. The validation process should cover several aspects. Firstly, we have to consult the technical manual of the device to obtain its typical isolation voltage parameters. Next, we measure and confirm the isolation voltage values of the TLP2362 by simulating actual operating conditions through laboratory test methods. Next, we need to compare the measurement results with the maximum operating voltage requirements in real-world application scenarios. If the isolation voltage of TLP2362 meets the requirements, then we can use it without worry; if not we need to consider replacing the model or taking other protection measures, such as adding additional isolation protection devices.
Frequently Asked Questions
1. What is the TLP2362?
The TLP2362 is a photocoupler (optocoupler) device manufactured by Toshiba. It is specifically designed for high-speed communication applications.
2. In what circuits can I use the TLP2362?
TLP2362 is suitable for circuits that require digital signal isolation, such as line drivers, logic gate outputs, and switching outputs.
3. What is optocoupler used for?
Optocouplers can either be used on their own as a switching device or with other electronic devices to provide isolation between low and high-voltage circuits. You'll typically find these devices being used for: Microprocessor input/output switching. DC and AC power control.
