IRF6635TRPBF

Infineon Technologies IRF6635TRPBF

Part Number:
IRF6635TRPBF
Manufacturer:
Infineon Technologies
Ventron No:
2482965-IRF6635TRPBF
Description:
MOSFET N-CH 30V 32A DIRECTFET
ECAD Model:
Datasheet:
IRF6635(TR)PbF

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Specifications
Infineon Technologies IRF6635TRPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF6635TRPBF.
  • Factory Lead Time
    13 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    DirectFET™ Isometric MX
  • Number of Pins
    5
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -40°C~150°C TJ
  • Packaging
    Tape & Reel (TR)
  • Series
    HEXFET®
  • Published
    2006
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    3
  • ECCN Code
    EAR99
  • Resistance
    1.8MOhm
  • Subcategory
    FET General Purpose Power
  • Voltage - Rated DC
    30V
  • Technology
    MOSFET (Metal Oxide)
  • Terminal Position
    BOTTOM
  • Current Rating
    32A
  • JESD-30 Code
    R-XBCC-N3
  • Number of Elements
    1
  • Configuration
    SINGLE WITH BUILT-IN DIODE
  • Power Dissipation-Max
    2.8W Ta 89W Tc
  • Operating Mode
    ENHANCEMENT MODE
  • Power Dissipation
    89W
  • Case Connection
    DRAIN
  • Turn On Delay Time
    21 ns
  • FET Type
    N-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    1.8m Ω @ 32A, 10V
  • Vgs(th) (Max) @ Id
    2.35V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    5970pF @ 15V
  • Current - Continuous Drain (Id) @ 25°C
    32A Ta 180A Tc
  • Gate Charge (Qg) (Max) @ Vgs
    71nC @ 4.5V
  • Rise Time
    13ns
  • Drive Voltage (Max Rds On,Min Rds On)
    4.5V 10V
  • Vgs (Max)
    ±20V
  • Fall Time (Typ)
    8.3 ns
  • Turn-Off Delay Time
    33 ns
  • Continuous Drain Current (ID)
    32mA
  • Threshold Voltage
    1.8V
  • Gate to Source Voltage (Vgs)
    20V
  • Drain to Source Breakdown Voltage
    30V
  • Avalanche Energy Rating (Eas)
    200 mJ
  • Nominal Vgs
    1.8 V
  • Height
    506μm
  • Length
    6.35mm
  • Width
    5.05mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening
    No
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
IRF6635TRPBF Overview
As a result of avalanche breakdown, energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating is 200 mJ.CI refers to the capacitance between two input terminals on an op amp with either input grounded, and this device's maximum input capacitance is 5970pF @ 15V.In this device, the drain current (ID) is equal to the continuous current transistor can conduct.This device has 30V drain-to-source breakdown voltage, where VDS corresponds to the ID at which a specified value of ID flows and VGS equals 30V.As a result of its turn-off delay time, which is 33 ns, the device has taken time to charge its input capacitance before drain current conduction begins.Input capacitance charge delays drain current conduction until the time it takes to charge input capacitance reaches 21 ns.Gate-source voltages (VGS) are voltages that fall across the gate-source terminal of FET transistors. VGS is sometimes 20VV.The threshold voltage is the point at which an electrical device activates any one of its operations, which for this transistor is 1.8V.In addition to reducing power consumption, this device uses drive voltage (4.5V 10V).

IRF6635TRPBF Features
the avalanche energy rating (Eas) is 200 mJ
a continuous drain current (ID) of 32mA
a drain-to-source breakdown voltage of 30V voltage
the turn-off delay time is 33 ns
a threshold voltage of 1.8V


IRF6635TRPBF Applications
There are a lot of Infineon Technologies
IRF6635TRPBF applications of single MOSFETs transistors.


DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
Lighting, Server, Telecom and UPS.
IRF6635TRPBF More Descriptions
MOSFET N-CH 30V 32A DIRECTFET / Trans MOSFET N-CH Si 30V 32A 7-Pin Direct-FET MX T/R
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Drain Source Voltage, Vds:30V; Continuous Drain Current, Id:25A; On Resistance, Rds(on):1.8mohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:DirectFET MX ;RoHS Compliant: Yes
A 30V Single N-Channel HEXFET Power MOSFET in a DirectFET MX package rated at 180 amperes optimized with low on resistance for applications such as active OR’ing. Shipped in Tape and Reel only. Part is not available in bulk, TR is implied in part number
Product Comparison
The three parts on the right have similar specifications to IRF6635TRPBF.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Transistor Element Material
    Operating Temperature
    Packaging
    Series
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Resistance
    Subcategory
    Voltage - Rated DC
    Technology
    Terminal Position
    Current Rating
    JESD-30 Code
    Number of Elements
    Configuration
    Power Dissipation-Max
    Operating Mode
    Power Dissipation
    Case Connection
    Turn On Delay Time
    FET Type
    Transistor Application
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Input Capacitance (Ciss) (Max) @ Vds
    Current - Continuous Drain (Id) @ 25°C
    Gate Charge (Qg) (Max) @ Vgs
    Rise Time
    Drive Voltage (Max Rds On,Min Rds On)
    Vgs (Max)
    Fall Time (Typ)
    Turn-Off Delay Time
    Continuous Drain Current (ID)
    Threshold Voltage
    Gate to Source Voltage (Vgs)
    Drain to Source Breakdown Voltage
    Avalanche Energy Rating (Eas)
    Nominal Vgs
    Height
    Length
    Width
    REACH SVHC
    Radiation Hardening
    RoHS Status
    Lead Free
    Surface Mount
    JESD-609 Code
    Terminal Finish
    Additional Feature
    HTS Code
    Terminal Form
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Qualification Status
    Drain to Source Voltage (Vdss)
    Drain Current-Max (Abs) (ID)
    Drain-source On Resistance-Max
    Pulsed Drain Current-Max (IDM)
    DS Breakdown Voltage-Min
    Supplier Device Package
    Weight
    Max Operating Temperature
    Min Operating Temperature
    Number of Channels
    Element Configuration
    Input Capacitance
    Drain to Source Resistance
    Rds On Max
    View Compare
  • IRF6635TRPBF
    IRF6635TRPBF
    13 Weeks
    Surface Mount
    Surface Mount
    DirectFET™ Isometric MX
    5
    SILICON
    -40°C~150°C TJ
    Tape & Reel (TR)
    HEXFET®
    2006
    Obsolete
    1 (Unlimited)
    3
    EAR99
    1.8MOhm
    FET General Purpose Power
    30V
    MOSFET (Metal Oxide)
    BOTTOM
    32A
    R-XBCC-N3
    1
    SINGLE WITH BUILT-IN DIODE
    2.8W Ta 89W Tc
    ENHANCEMENT MODE
    89W
    DRAIN
    21 ns
    N-Channel
    SWITCHING
    1.8m Ω @ 32A, 10V
    2.35V @ 250μA
    5970pF @ 15V
    32A Ta 180A Tc
    71nC @ 4.5V
    13ns
    4.5V 10V
    ±20V
    8.3 ns
    33 ns
    32mA
    1.8V
    20V
    30V
    200 mJ
    1.8 V
    506μm
    6.35mm
    5.05mm
    No SVHC
    No
    RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IRF6215S
    -
    -
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    -
    SILICON
    -55°C~175°C TJ
    Tube
    HEXFET®
    1998
    Obsolete
    1 (Unlimited)
    2
    EAR99
    -
    -
    -
    MOSFET (Metal Oxide)
    SINGLE
    -
    R-PSSO-G2
    1
    SINGLE WITH BUILT-IN DIODE
    3.8W Ta 110W Tc
    ENHANCEMENT MODE
    -
    DRAIN
    -
    P-Channel
    SWITCHING
    290m Ω @ 6.6A, 10V
    4V @ 250μA
    860pF @ 25V
    13A Tc
    66nC @ 10V
    -
    10V
    ±20V
    -
    -
    -
    -
    -
    -
    310 mJ
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    YES
    e0
    Tin/Lead (Sn/Pb)
    AVALANCHE RATED, HIGH RELIABILITY
    8541.29.00.95
    GULL WING
    225
    30
    Not Qualified
    150V
    13A
    0.29Ohm
    44A
    150V
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IRF6215STRR
    -
    -
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    -
    SILICON
    -55°C~175°C TJ
    Tape & Reel (TR)
    HEXFET®
    1998
    Obsolete
    1 (Unlimited)
    2
    EAR99
    -
    Other Transistors
    -
    MOSFET (Metal Oxide)
    SINGLE
    -
    R-PSSO-G2
    1
    SINGLE WITH BUILT-IN DIODE
    3.8W Ta 110W Tc
    ENHANCEMENT MODE
    -
    DRAIN
    -
    P-Channel
    SWITCHING
    290m Ω @ 6.6A, 10V
    4V @ 250μA
    860pF @ 25V
    13A Tc
    66nC @ 10V
    -
    10V
    ±20V
    -
    -
    -
    -
    -
    -
    310 mJ
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    YES
    e3
    Matte Tin (Sn) - with Nickel (Ni) barrier
    AVALANCHE RATED, HIGH RELIABILITY
    -
    GULL WING
    260
    30
    Not Qualified
    150V
    13A
    0.29Ohm
    44A
    150V
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IRF634NLPBF
    -
    Through Hole
    Through Hole
    TO-262-3 Long Leads, I2Pak, TO-262AA
    -
    -
    -55°C~175°C TJ
    Tube
    -
    2009
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    -
    -
    -
    3.8W Ta 88W Tc
    -
    -
    -
    8.4 ns
    N-Channel
    -
    435mOhm @ 4.8A, 10V
    4V @ 250μA
    620pF @ 25V
    8A Tc
    34nC @ 10V
    16ns
    10V
    ±20V
    15 ns
    28 ns
    8A
    -
    20V
    -
    -
    -
    9.65mm
    10.67mm
    4.83mm
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    250V
    -
    -
    -
    -
    I2PAK
    2.387001g
    175°C
    -55°C
    1
    Single
    620pF
    435mOhm
    435 mΩ
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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