Infineon Technologies IRF6635TRPBF
- Part Number:
- IRF6635TRPBF
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 2482965-IRF6635TRPBF
- Description:
- MOSFET N-CH 30V 32A DIRECTFET
- Datasheet:
- IRF6635(TR)PbF
Infineon Technologies IRF6635TRPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF6635TRPBF.
- Factory Lead Time13 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / CaseDirectFET™ Isometric MX
- Number of Pins5
- Transistor Element MaterialSILICON
- Operating Temperature-40°C~150°C TJ
- PackagingTape & Reel (TR)
- SeriesHEXFET®
- Published2006
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations3
- ECCN CodeEAR99
- Resistance1.8MOhm
- SubcategoryFET General Purpose Power
- Voltage - Rated DC30V
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionBOTTOM
- Current Rating32A
- JESD-30 CodeR-XBCC-N3
- Number of Elements1
- ConfigurationSINGLE WITH BUILT-IN DIODE
- Power Dissipation-Max2.8W Ta 89W Tc
- Operating ModeENHANCEMENT MODE
- Power Dissipation89W
- Case ConnectionDRAIN
- Turn On Delay Time21 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs1.8m Ω @ 32A, 10V
- Vgs(th) (Max) @ Id2.35V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds5970pF @ 15V
- Current - Continuous Drain (Id) @ 25°C32A Ta 180A Tc
- Gate Charge (Qg) (Max) @ Vgs71nC @ 4.5V
- Rise Time13ns
- Drive Voltage (Max Rds On,Min Rds On)4.5V 10V
- Vgs (Max)±20V
- Fall Time (Typ)8.3 ns
- Turn-Off Delay Time33 ns
- Continuous Drain Current (ID)32mA
- Threshold Voltage1.8V
- Gate to Source Voltage (Vgs)20V
- Drain to Source Breakdown Voltage30V
- Avalanche Energy Rating (Eas)200 mJ
- Nominal Vgs1.8 V
- Height506μm
- Length6.35mm
- Width5.05mm
- REACH SVHCNo SVHC
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
- Lead FreeLead Free
IRF6635TRPBF Overview
As a result of avalanche breakdown, energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating is 200 mJ.CI refers to the capacitance between two input terminals on an op amp with either input grounded, and this device's maximum input capacitance is 5970pF @ 15V.In this device, the drain current (ID) is equal to the continuous current transistor can conduct.This device has 30V drain-to-source breakdown voltage, where VDS corresponds to the ID at which a specified value of ID flows and VGS equals 30V.As a result of its turn-off delay time, which is 33 ns, the device has taken time to charge its input capacitance before drain current conduction begins.Input capacitance charge delays drain current conduction until the time it takes to charge input capacitance reaches 21 ns.Gate-source voltages (VGS) are voltages that fall across the gate-source terminal of FET transistors. VGS is sometimes 20VV.The threshold voltage is the point at which an electrical device activates any one of its operations, which for this transistor is 1.8V.In addition to reducing power consumption, this device uses drive voltage (4.5V 10V).
IRF6635TRPBF Features
the avalanche energy rating (Eas) is 200 mJ
a continuous drain current (ID) of 32mA
a drain-to-source breakdown voltage of 30V voltage
the turn-off delay time is 33 ns
a threshold voltage of 1.8V
IRF6635TRPBF Applications
There are a lot of Infineon Technologies
IRF6635TRPBF applications of single MOSFETs transistors.
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
Lighting, Server, Telecom and UPS.
As a result of avalanche breakdown, energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating is 200 mJ.CI refers to the capacitance between two input terminals on an op amp with either input grounded, and this device's maximum input capacitance is 5970pF @ 15V.In this device, the drain current (ID) is equal to the continuous current transistor can conduct.This device has 30V drain-to-source breakdown voltage, where VDS corresponds to the ID at which a specified value of ID flows and VGS equals 30V.As a result of its turn-off delay time, which is 33 ns, the device has taken time to charge its input capacitance before drain current conduction begins.Input capacitance charge delays drain current conduction until the time it takes to charge input capacitance reaches 21 ns.Gate-source voltages (VGS) are voltages that fall across the gate-source terminal of FET transistors. VGS is sometimes 20VV.The threshold voltage is the point at which an electrical device activates any one of its operations, which for this transistor is 1.8V.In addition to reducing power consumption, this device uses drive voltage (4.5V 10V).
IRF6635TRPBF Features
the avalanche energy rating (Eas) is 200 mJ
a continuous drain current (ID) of 32mA
a drain-to-source breakdown voltage of 30V voltage
the turn-off delay time is 33 ns
a threshold voltage of 1.8V
IRF6635TRPBF Applications
There are a lot of Infineon Technologies
IRF6635TRPBF applications of single MOSFETs transistors.
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
Lighting, Server, Telecom and UPS.
IRF6635TRPBF More Descriptions
MOSFET N-CH 30V 32A DIRECTFET / Trans MOSFET N-CH Si 30V 32A 7-Pin Direct-FET MX T/R
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Drain Source Voltage, Vds:30V; Continuous Drain Current, Id:25A; On Resistance, Rds(on):1.8mohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:DirectFET MX ;RoHS Compliant: Yes
A 30V Single N-Channel HEXFET Power MOSFET in a DirectFET MX package rated at 180 amperes optimized with low on resistance for applications such as active ORing. Shipped in Tape and Reel only. Part is not available in bulk, TR is implied in part number
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Drain Source Voltage, Vds:30V; Continuous Drain Current, Id:25A; On Resistance, Rds(on):1.8mohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:DirectFET MX ;RoHS Compliant: Yes
A 30V Single N-Channel HEXFET Power MOSFET in a DirectFET MX package rated at 180 amperes optimized with low on resistance for applications such as active ORing. Shipped in Tape and Reel only. Part is not available in bulk, TR is implied in part number
The three parts on the right have similar specifications to IRF6635TRPBF.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeResistanceSubcategoryVoltage - Rated DCTechnologyTerminal PositionCurrent RatingJESD-30 CodeNumber of ElementsConfigurationPower Dissipation-MaxOperating ModePower DissipationCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Threshold VoltageGate to Source Voltage (Vgs)Drain to Source Breakdown VoltageAvalanche Energy Rating (Eas)Nominal VgsHeightLengthWidthREACH SVHCRadiation HardeningRoHS StatusLead FreeSurface MountJESD-609 CodeTerminal FinishAdditional FeatureHTS CodeTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Qualification StatusDrain to Source Voltage (Vdss)Drain Current-Max (Abs) (ID)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)DS Breakdown Voltage-MinSupplier Device PackageWeightMax Operating TemperatureMin Operating TemperatureNumber of ChannelsElement ConfigurationInput CapacitanceDrain to Source ResistanceRds On MaxView Compare
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IRF6635TRPBF13 WeeksSurface MountSurface MountDirectFET™ Isometric MX5SILICON-40°C~150°C TJTape & Reel (TR)HEXFET®2006Obsolete1 (Unlimited)3EAR991.8MOhmFET General Purpose Power30VMOSFET (Metal Oxide)BOTTOM32AR-XBCC-N31SINGLE WITH BUILT-IN DIODE2.8W Ta 89W TcENHANCEMENT MODE89WDRAIN21 nsN-ChannelSWITCHING1.8m Ω @ 32A, 10V2.35V @ 250μA5970pF @ 15V32A Ta 180A Tc71nC @ 4.5V13ns4.5V 10V±20V8.3 ns33 ns32mA1.8V20V30V200 mJ1.8 V506μm6.35mm5.05mmNo SVHCNoRoHS CompliantLead Free------------------------
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--Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB-SILICON-55°C~175°C TJTubeHEXFET®1998Obsolete1 (Unlimited)2EAR99---MOSFET (Metal Oxide)SINGLE-R-PSSO-G21SINGLE WITH BUILT-IN DIODE3.8W Ta 110W TcENHANCEMENT MODE-DRAIN-P-ChannelSWITCHING290m Ω @ 6.6A, 10V4V @ 250μA860pF @ 25V13A Tc66nC @ 10V-10V±20V------310 mJ------Non-RoHS Compliant-YESe0Tin/Lead (Sn/Pb)AVALANCHE RATED, HIGH RELIABILITY8541.29.00.95GULL WING22530Not Qualified150V13A0.29Ohm44A150V---------
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--Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB-SILICON-55°C~175°C TJTape & Reel (TR)HEXFET®1998Obsolete1 (Unlimited)2EAR99-Other Transistors-MOSFET (Metal Oxide)SINGLE-R-PSSO-G21SINGLE WITH BUILT-IN DIODE3.8W Ta 110W TcENHANCEMENT MODE-DRAIN-P-ChannelSWITCHING290m Ω @ 6.6A, 10V4V @ 250μA860pF @ 25V13A Tc66nC @ 10V-10V±20V------310 mJ------Non-RoHS Compliant-YESe3Matte Tin (Sn) - with Nickel (Ni) barrierAVALANCHE RATED, HIGH RELIABILITY-GULL WING26030Not Qualified150V13A0.29Ohm44A150V---------
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-Through HoleThrough HoleTO-262-3 Long Leads, I2Pak, TO-262AA---55°C~175°C TJTube-2009Obsolete1 (Unlimited)-----MOSFET (Metal Oxide)-----3.8W Ta 88W Tc---8.4 nsN-Channel-435mOhm @ 4.8A, 10V4V @ 250μA620pF @ 25V8A Tc34nC @ 10V16ns10V±20V15 ns28 ns8A-20V---9.65mm10.67mm4.83mm--ROHS3 Compliant----------250V----I2PAK2.387001g175°C-55°C1Single620pF435mOhm435 mΩ
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