Diodes Incorporated DMN10H099SK3-13
- Part Number:
- DMN10H099SK3-13
- Manufacturer:
- Diodes Incorporated
- Ventron No:
- 2480715-DMN10H099SK3-13
- Description:
- MOSFET N-CH 100V 17A TO252
- Datasheet:
- DMN10H099SK3-13
Diodes Incorporated DMN10H099SK3-13 technical specifications, attributes, parameters and parts with similar specifications to Diodes Incorporated DMN10H099SK3-13.
- Factory Lead Time23 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / CaseTO-252-3, DPak (2 Leads Tab), SC-63
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~150°C TJ
- PackagingTape & Reel (TR)
- Published2014
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations2
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- Additional FeatureHIGH RELIABILITY
- Capacitance1.172nF
- TechnologyMOSFET (Metal Oxide)
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reach Compliance Codenot_compliant
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PSSO-G2
- Number of Elements1
- Number of Channels1
- Power Dissipation-Max34W Tc
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Case ConnectionDRAIN
- Turn On Delay Time5.4 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs80m Ω @ 3.3A, 10V
- Vgs(th) (Max) @ Id3V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds1172pF @ 50V
- Current - Continuous Drain (Id) @ 25°C17A Tc
- Gate Charge (Qg) (Max) @ Vgs25.2nC @ 10V
- Rise Time5.9ns
- Drain to Source Voltage (Vdss)100V
- Drive Voltage (Max Rds On,Min Rds On)6V 10V
- Vgs (Max)±20V
- Fall Time (Typ)7.3 ns
- Turn-Off Delay Time20 ns
- Continuous Drain Current (ID)17A
- Gate to Source Voltage (Vgs)20V
- Drain-source On Resistance-Max0.08Ohm
- Pulsed Drain Current-Max (IDM)20A
- Avalanche Energy Rating (Eas)28.5 mJ
- RoHS StatusROHS3 Compliant
DMN10H099SK3-13 Overview
The MOSFET's breakdown is called "avalanche break down", and the avalanche energy applied to transistor is rated as 28.5 mJ (Eas).An op amp's input capacitance is defined as the capacitance between both of its input terminals with either input grounded, and 1172pF @ 50V is its maximum input capacitance.The drain current is the maximum continuous current the device can conduct, and this device has 17A continuous drain current (ID).Input capacitance must be charged before drain current conduction can begin, so the turn-off delay time is 20 ns.Peak drain current is 20A, which is the maximum pulsed drain current.Before drain current conduction begins, the device's input capacitance must be charged, so the delay time is 5.4 ns.An FET transistor's gate-source voltage, VGS, indicates how much voltage is applied across the transistor's gate-source terminal and it can range from 20V to 1.For this transistor to work, a voltage 100V is required between drain and source (Vdss).Using drive voltage (6V 10V), this device contributes to a reduction in overall power consumption.
DMN10H099SK3-13 Features
the avalanche energy rating (Eas) is 28.5 mJ
a continuous drain current (ID) of 17A
the turn-off delay time is 20 ns
based on its rated peak drain current 20A.
a 100V drain to source voltage (Vdss)
DMN10H099SK3-13 Applications
There are a lot of Diodes Incorporated
DMN10H099SK3-13 applications of single MOSFETs transistors.
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
The MOSFET's breakdown is called "avalanche break down", and the avalanche energy applied to transistor is rated as 28.5 mJ (Eas).An op amp's input capacitance is defined as the capacitance between both of its input terminals with either input grounded, and 1172pF @ 50V is its maximum input capacitance.The drain current is the maximum continuous current the device can conduct, and this device has 17A continuous drain current (ID).Input capacitance must be charged before drain current conduction can begin, so the turn-off delay time is 20 ns.Peak drain current is 20A, which is the maximum pulsed drain current.Before drain current conduction begins, the device's input capacitance must be charged, so the delay time is 5.4 ns.An FET transistor's gate-source voltage, VGS, indicates how much voltage is applied across the transistor's gate-source terminal and it can range from 20V to 1.For this transistor to work, a voltage 100V is required between drain and source (Vdss).Using drive voltage (6V 10V), this device contributes to a reduction in overall power consumption.
DMN10H099SK3-13 Features
the avalanche energy rating (Eas) is 28.5 mJ
a continuous drain current (ID) of 17A
the turn-off delay time is 20 ns
based on its rated peak drain current 20A.
a 100V drain to source voltage (Vdss)
DMN10H099SK3-13 Applications
There are a lot of Diodes Incorporated
DMN10H099SK3-13 applications of single MOSFETs transistors.
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
DMN10H099SK3-13 More Descriptions
Mosfet, N-Ch, 100V, 17A, To-252 Rohs Compliant: Yes |Diodes Inc. DMN10H099SK3-13
Trans MOSFET N-CH 100V 17A 3-Pin(2 Tab) DPAK T/R
N-CHANNEL ENHANCEMENT MODE MOSFET, 100 V, RoHSDiodes Inc SCT
Power Field-Effect Transistor, 17A I(D), 100V, 0.08ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252
MOSFET BVDSS: 61V~100V TO252 T&R 2.5K
Trans MOSFET N-CH 100V 17A 3-Pin(2 Tab) DPAK T/R
N-CHANNEL ENHANCEMENT MODE MOSFET, 100 V, RoHSDiodes Inc SCT
Power Field-Effect Transistor, 17A I(D), 100V, 0.08ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252
MOSFET BVDSS: 61V~100V TO252 T&R 2.5K
The three parts on the right have similar specifications to DMN10H099SK3-13.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseTransistor Element MaterialOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureCapacitanceTechnologyTerminal FormPeak Reflow Temperature (Cel)Reach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeNumber of ElementsNumber of ChannelsPower Dissipation-MaxElement ConfigurationOperating ModeCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrain to Source Voltage (Vdss)Drive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Gate to Source Voltage (Vgs)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)Avalanche Energy Rating (Eas)RoHS StatusWeightTerminal PositionDrain to Source Breakdown VoltageLead FreeNumber of PinsPbfree CodeTerminationResistanceSubcategoryVoltage - Rated DCCurrent RatingPin CountPower DissipationThreshold VoltageDual Supply VoltageNominal VgsHeightLengthWidthREACH SVHCRadiation HardeningConfigurationDS Breakdown Voltage-MinView Compare
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DMN10H099SK3-1323 WeeksSurface MountSurface MountTO-252-3, DPak (2 Leads Tab), SC-63SILICON-55°C~150°C TJTape & Reel (TR)2014e3Active1 (Unlimited)2EAR99Matte Tin (Sn)HIGH RELIABILITY1.172nFMOSFET (Metal Oxide)GULL WINGNOT SPECIFIEDnot_compliantNOT SPECIFIEDR-PSSO-G21134W TcSingleENHANCEMENT MODEDRAIN5.4 nsN-ChannelSWITCHING80m Ω @ 3.3A, 10V3V @ 250μA1172pF @ 50V17A Tc25.2nC @ 10V5.9ns100V6V 10V±20V7.3 ns20 ns17A20V0.08Ohm20A28.5 mJROHS3 Compliant------------------------
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16 WeeksSurface MountSurface MountTO-236-3, SC-59, SOT-23-3SILICON-55°C~150°C TJTape & Reel (TR)2014e3Active1 (Unlimited)3EAR99Matte Tin (Sn)-2.426nFMOSFET (Metal Oxide)GULL WINGNOT SPECIFIED-NOT SPECIFIEDR-PDSO-G311680mW TaSingleENHANCEMENT MODE-7.6 nsN-ChannelSWITCHING10m Ω @ 9.7A, 4.5V800mV @ 250μA2426pF @ 10V9.3A Ta50.6nC @ 8V57.6ns-1.2V 2.5V±8V16.8 ns22.2 ns9.3A4.5V---ROHS3 Compliant7.994566mgDUAL12VLead Free-------------------
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19 WeeksSurface MountSurface MountTO-236-3, SC-59, SOT-23-3SILICON-55°C~150°C TJTape & Reel (TR)2011e3Active1 (Unlimited)3EAR99Matte Tin (Sn)HIGH RELIABILITY-MOSFET (Metal Oxide)GULL WING260-40-11500mW TaSingleENHANCEMENT MODE-10 nsN-ChannelSWITCHING240m Ω @ 1A, 10V3V @ 1mA150pF @ 10V1.1A Ta5.5nC @ 10V15ns-4.5V 10V±20V15 ns25 ns1.1A20V---ROHS3 Compliant7.994566mgDUAL30VLead Free3yesSMD/SMT240MOhmFET General Purpose Power30V1.1A3500mW3V30V3 V1.3mm3.1mm1.7mmNo SVHCNo--
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14 WeeksSurface MountSurface MountSOT-23-6 Thin, TSOT-23-6SILICON-55°C~150°C TJTape & Reel (TR)2015e3Active1 (Unlimited)6EAR99Matte Tin (Sn)--MOSFET (Metal Oxide)GULL WINGNOT SPECIFIED-NOT SPECIFIEDR-PDSO-G61-1.73W Ta-ENHANCEMENT MODE--N-ChannelSWITCHING10m Ω @ 9.7A, 4.5V800mV @ 250μA2588pF @ 10V10.7A Ta50.4nC @ 8V-12V1.2V 4.5V±8V--10.7A-0.01Ohm70A4.7 mJROHS3 Compliant-DUAL-------------------SINGLE WITH BUILT-IN DIODE12V
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