MX30UF2G16AC-XQI

Macronix MX30UF2G16AC-XQI

Part Number:
MX30UF2G16AC-XQI
Manufacturer:
Macronix
Ventron No:
7373498-MX30UF2G16AC-XQI
Description:
Memory IC 8mm mm
ECAD Model:
Datasheet:
MX30UF2G16AC-XQI

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Specifications
Macronix MX30UF2G16AC-XQI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF2G16AC-XQI.
  • Factory Lead Time
    8 Weeks
  • Surface Mount
    YES
  • Packaging
    Tray
  • Part Status
    Active
  • Number of Terminations
    48
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PBGA-B48
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    1.95V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    128MX16
  • Memory Width
    16
  • Memory Density
    2147483648 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    1.8V
  • Length
    8mm
  • Height Seated (Max)
    1mm
  • Width
    6mm
  • RoHS Status
    RoHS Compliant
Description
MX30UF2G16AC-XQI Overview
It is available in a case with a Tray shape. As you can see from the diagram, the chip is planted with 48 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 1.8V power supply. A programming voltage of 1.8V is needed to alter the state of certain nonvolatile memory arrays. It has a FLASH memory IC type. If the temperature is greater than 85°C, you should not use it. As far as the part is concerned, it should be used only at a temperature of -40°C, otherwise it can fail.

MX30UF2G16AC-XQI Features


MX30UF2G16AC-XQI Applications
There are a lot of Macronix
MX30UF2G16AC-XQI Memory applications.


telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
MX30UF2G16AC-XQI More Descriptions
NAND Flash Memory 2Gbit Capacity 128M x 16 Organization 1.8V Supply Voltage Surface Mount 48-Ball VFBGA Tray
IC FLASH 2GBIT PARALLEL 48VFBGA
Product Comparison
The three parts on the right have similar specifications to MX30UF2G16AC-XQI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Surface Mount
    Packaging
    Part Status
    Number of Terminations
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    JESD-609 Code
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    Published
    ECCN Code
    HTS Code
    Lead Free
    View Compare
  • MX30UF2G16AC-XQI
    MX30UF2G16AC-XQI
    8 Weeks
    YES
    Tray
    Active
    48
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    128MX16
    16
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    8mm
    1mm
    6mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30UF2G18AC-TI
    8 Weeks
    YES
    Tray
    Active
    48
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    e3
    3 (168 Hours)
    Matte Tin (Sn)
    -
    -
    -
    -
  • MX30UF4G18AB-XKI
    -
    YES
    Tray
    Not For New Designs
    63
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B63
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    11mm
    1mm
    9mm
    Non-RoHS Compliant
    e1
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    2014
    3A991.B.1.A
    8542.32.00.51
    Lead Free
  • MX30UF4G18AB-TI
    -
    YES
    Tray
    Not For New Designs
    48
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    e3
    3 (168 Hours)
    Matte Tin (Sn)
    -
    3A991.B.1.A
    8542.32.00.51
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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