MX30UF2G18AC-TI

Macronix MX30UF2G18AC-TI

Part Number:
MX30UF2G18AC-TI
Manufacturer:
Macronix
Ventron No:
7373526-MX30UF2G18AC-TI
Description:
Memory IC 18.4mm mm
ECAD Model:
Datasheet:
MX30UF2G18AC-TI

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Specifications
Macronix MX30UF2G18AC-TI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF2G18AC-TI.
  • Factory Lead Time
    8 Weeks
  • Surface Mount
    YES
  • Packaging
    Tray
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • Terminal Finish
    Matte Tin (Sn)
  • Technology
    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.5mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PDSO-G48
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    1.95V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    256MX8
  • Memory Width
    8
  • Memory Density
    2147483648 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    1.8V
  • Length
    18.4mm
  • Height Seated (Max)
    1.2mm
  • Width
    12mm
  • RoHS Status
    RoHS Compliant
Description
MX30UF2G18AC-TI Overview
There is a Tray case available. The chip has 48 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 1.8V of power. Nonvolatile memory arrays require 1.8V programming voltage to change their state. This ic memory chip contains a FLASH memory IC. The product should only be used at temperatures greater than 85°C. In order for the part to work, it must operate at a temperature of -40°C, otherwise it will not work

MX30UF2G18AC-TI Features


MX30UF2G18AC-TI Applications
There are a lot of Macronix
MX30UF2G18AC-TI Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MX30UF2G18AC-TI More Descriptions
NAND Flash Memory 2Gbit Capacity 256M x 8 Organization 1.8V Supply Voltage Surface Mount 48-Pin TSOP Tray
IC FLASH 2GBIT PARALLEL 48TSOP
Product Description Demo for Development.
Product Comparison
The three parts on the right have similar specifications to MX30UF2G18AC-TI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Surface Mount
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Published
    ECCN Code
    HTS Code
    Lead Free
    View Compare
  • MX30UF2G18AC-TI
    MX30UF2G18AC-TI
    8 Weeks
    YES
    Tray
    e3
    Active
    3 (168 Hours)
    48
    Matte Tin (Sn)
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    -
    -
    -
    -
  • MX30LF2G28AC-TI
    8 Weeks
    YES
    Tray
    -
    Active
    -
    48
    -
    CMOS
    DUAL
    GULL WING
    -
    1
    3.3V
    0.5mm
    -
    R-PDSO-G48
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    2.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    3V
    18.4mm
    1.2mm
    12mm
    -
    -
    -
    -
    -
  • MX30UF4G18AB-XKI
    -
    YES
    Tray
    e1
    Not For New Designs
    -
    63
    Tin/Silver/Copper (Sn/Ag/Cu)
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B63
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    11mm
    1mm
    9mm
    Non-RoHS Compliant
    2014
    3A991.B.1.A
    8542.32.00.51
    Lead Free
  • MX30UF4G18AB-TI
    -
    YES
    Tray
    e3
    Not For New Designs
    3 (168 Hours)
    48
    Matte Tin (Sn)
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    3A991.B.1.A
    8542.32.00.51
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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