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MX30UF4G18AB-TI

Macronix MX30UF4G18AB-TI

Part Number:
MX30UF4G18AB-TI
Manufacturer:
Macronix
Ventron No:
7372476-MX30UF4G18AB-TI
Description:
Memory IC 18.4mm mm
ECAD Model:
Datasheet:
MX30UF4G18AB-TI

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Specifications
Macronix MX30UF4G18AB-TI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF4G18AB-TI.
  • Surface Mount
    YES
  • Packaging
    Tray
  • JESD-609 Code
    e3
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    Matte Tin (Sn)
  • HTS Code
    8542.32.00.51
  • Technology
    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.5mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PDSO-G48
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    1.95V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    512MX8
  • Memory Width
    8
  • Memory Density
    4294967296 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    1.8V
  • Length
    18.4mm
  • Height Seated (Max)
    1.2mm
  • Width
    12mm
  • RoHS Status
    RoHS Compliant
Description
MX30UF4G18AB-TI Overview
There is a Tray case available. The chip has 48 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 1.8V of power. Nonvolatile memory arrays require 1.8V programming voltage to change their state. This ic memory chip contains a FLASH memory IC. The product should only be used at temperatures greater than 85°C. In order for the part to work, it must operate at a temperature of -40°C, otherwise it will not work

MX30UF4G18AB-TI Features


MX30UF4G18AB-TI Applications
There are a lot of Macronix
MX30UF4G18AB-TI Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MX30UF4G18AB-TI More Descriptions
Not For New Designs PARALLEL GULL WING FLASH ic memory 85C 1.7V 4294967296bit 12mm
IC FLASH 4GBIT PARALLEL 48TSOP
OEMs, CMs ONLY (NO BROKERS)
Product Comparison
The three parts on the right have similar specifications to MX30UF4G18AB-TI.
  • Image
    Part Number
    Manufacturer
    Surface Mount
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Mounting Type
    Package / Case
    Operating Temperature
    Series
    Voltage - Supply
    Memory Size
    Memory Type
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    Factory Lead Time
    View Compare
  • MX30UF4G18AB-TI
    MX30UF4G18AB-TI
    Macronix
    YES
    Tray
    e3
    Not For New Designs
    3 (168 Hours)
    48
    3A991.B.1.A
    Matte Tin (Sn)
    8542.32.00.51
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30UF4G18AC-TI
    MX30UF4G18AC-TI
    Macronix
    -
    Tray
    -
    Discontinued
    3 (168 Hours)
    -
    -
    -
    -
    FLASH - NAND (SLC)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1.8V
    -
    -
    -
    ROHS3 Compliant
    Surface Mount
    48-TFSOP (0.488, 12.40mm Width)
    -40°C~85°C TA
    MX30UF
    1.7V~1.95V
    4Gb 512M x 8
    Non-Volatile
    FLASH
    Parallel
    25ns
    -
    MX30UF4G18AB-TI vs MX30UF4G18AC-TI
  • MX30LF2G18SC-XKI
    MX30LF2G18SC-XKI
    Macronix
    -
    Tray
    -
    Active
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    8 Weeks
    MX30UF4G18AB-TI vs MX30LF2G18SC-XKI
  • MX30LF2G28AC-TI
    MX30LF2G28AC-TI
    Macronix
    YES
    Tray
    -
    Active
    -
    48
    -
    -
    -
    CMOS
    DUAL
    GULL WING
    -
    1
    3.3V
    0.5mm
    -
    R-PDSO-G48
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    2.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    3V
    18.4mm
    1.2mm
    12mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    8 Weeks
    MX30UF4G18AB-TI vs MX30LF2G28AC-TI
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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