MX30UF4G18AB-XKI

Macronix MX30UF4G18AB-XKI

Part Number:
MX30UF4G18AB-XKI
Manufacturer:
Macronix
Ventron No:
7372683-MX30UF4G18AB-XKI
Description:
Memory IC 11mm mm
ECAD Model:
Datasheet:
MX30UF4G18AB-XKI

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Specifications
Macronix MX30UF4G18AB-XKI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF4G18AB-XKI.
  • Surface Mount
    YES
  • Packaging
    Tray
  • Published
    2014
  • JESD-609 Code
    e1
  • Part Status
    Not For New Designs
  • Number of Terminations
    63
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.32.00.51
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PBGA-B63
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    1.95V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    512MX8
  • Memory Width
    8
  • Memory Density
    4294967296 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    1.8V
  • Length
    11mm
  • Height Seated (Max)
    1mm
  • Width
    9mm
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Lead Free
Description
MX30UF4G18AB-XKI Overview
The case comes in the Tray style. The chip contains 63 terminations. As many as 1 functions are supported for comprehensive working. An 1.8V supply is required for this ic memory chip to operate properly. 1.8V programming voltage is required to change the state of certain nonvolatile memory arrays. In this chip, there is a memory IC of type FLASH. Whenever the temperature exceeds 85°C, it should not be used. There is a requirement for the part to operate at a temperature of -40°C instead of anything else.

MX30UF4G18AB-XKI Features


MX30UF4G18AB-XKI Applications
There are a lot of Macronix
MX30UF4G18AB-XKI Memory applications.


personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
MX30UF4G18AB-XKI More Descriptions
NAND Flash Serial 1.8V 4G-bit 512M x 8 25ns 48-Pin TSOP-I
1.7V~1.95V 4Gbit VFBGA-63 NAND FLASH ROHS
4G NAND x8 4-ECC 1.7V-1.95V 63-ball BGA Ind Temp
IC FLASH 4GBIT PARALLEL 63VFBGA
Product Comparison
The three parts on the right have similar specifications to MX30UF4G18AB-XKI.
  • Image
    Part Number
    Manufacturer
    Surface Mount
    Packaging
    Published
    JESD-609 Code
    Part Status
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Lead Free
    Mounting Type
    Package / Case
    Operating Temperature
    Series
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Memory Size
    Memory Type
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    Factory Lead Time
    View Compare
  • MX30UF4G18AB-XKI
    MX30UF4G18AB-XKI
    YES
    Tray
    2014
    e1
    Not For New Designs
    63
    3A991.B.1.A
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.32.00.51
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B63
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    11mm
    1mm
    9mm
    Non-RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30UF4G18AC-TI
    -
    Tray
    -
    -
    Discontinued
    -
    -
    -
    -
    FLASH - NAND (SLC)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1.8V
    -
    -
    -
    ROHS3 Compliant
    -
    Surface Mount
    48-TFSOP (0.488, 12.40mm Width)
    -40°C~85°C TA
    MX30UF
    3 (168 Hours)
    1.7V~1.95V
    4Gb 512M x 8
    Non-Volatile
    FLASH
    Parallel
    25ns
    -
  • MX30UF2G18AC-TI
    YES
    Tray
    -
    e3
    Active
    48
    -
    Matte Tin (Sn)
    -
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    -
    -
    -
    -
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    8 Weeks
  • MX30UF2G16AC-XQI
    YES
    Tray
    -
    -
    Active
    48
    -
    -
    -
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    128MX16
    16
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    8mm
    1mm
    6mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    8 Weeks
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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