Macronix MX30UF4G18AB-XKI
- Part Number:
- MX30UF4G18AB-XKI
- Manufacturer:
- Macronix
- Ventron No:
- 7372683-MX30UF4G18AB-XKI
- Description:
- Memory IC 11mm mm
- Datasheet:
- MX30UF4G18AB-XKI
Macronix MX30UF4G18AB-XKI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF4G18AB-XKI.
- Surface MountYES
- PackagingTray
- Published2014
- JESD-609 Codee1
- Part StatusNot For New Designs
- Number of Terminations63
- ECCN Code3A991.B.1.A
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.32.00.51
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)40
- JESD-30 CodeR-PBGA-B63
- Operating Temperature (Max)85°C
- Operating Temperature (Min)-40°C
- Supply Voltage-Max (Vsup)1.95V
- Temperature GradeINDUSTRIAL
- Supply Voltage-Min (Vsup)1.7V
- Operating ModeASYNCHRONOUS
- Organization512MX8
- Memory Width8
- Memory Density4294967296 bit
- Parallel/SerialPARALLEL
- Memory IC TypeFLASH
- Programming Voltage1.8V
- Length11mm
- Height Seated (Max)1mm
- Width9mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeLead Free
MX30UF4G18AB-XKI Overview
The case comes in the Tray style. The chip contains 63 terminations. As many as 1 functions are supported for comprehensive working. An 1.8V supply is required for this ic memory chip to operate properly. 1.8V programming voltage is required to change the state of certain nonvolatile memory arrays. In this chip, there is a memory IC of type FLASH. Whenever the temperature exceeds 85°C, it should not be used. There is a requirement for the part to operate at a temperature of -40°C instead of anything else.
MX30UF4G18AB-XKI Features
MX30UF4G18AB-XKI Applications
There are a lot of Macronix
MX30UF4G18AB-XKI Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
The case comes in the Tray style. The chip contains 63 terminations. As many as 1 functions are supported for comprehensive working. An 1.8V supply is required for this ic memory chip to operate properly. 1.8V programming voltage is required to change the state of certain nonvolatile memory arrays. In this chip, there is a memory IC of type FLASH. Whenever the temperature exceeds 85°C, it should not be used. There is a requirement for the part to operate at a temperature of -40°C instead of anything else.
MX30UF4G18AB-XKI Features
MX30UF4G18AB-XKI Applications
There are a lot of Macronix
MX30UF4G18AB-XKI Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
MX30UF4G18AB-XKI More Descriptions
NAND Flash Serial 1.8V 4G-bit 512M x 8 25ns 48-Pin TSOP-I
1.7V~1.95V 4Gbit VFBGA-63 NAND FLASH ROHS
4G NAND x8 4-ECC 1.7V-1.95V 63-ball BGA Ind Temp
IC FLASH 4GBIT PARALLEL 63VFBGA
1.7V~1.95V 4Gbit VFBGA-63 NAND FLASH ROHS
4G NAND x8 4-ECC 1.7V-1.95V 63-ball BGA Ind Temp
IC FLASH 4GBIT PARALLEL 63VFBGA
The three parts on the right have similar specifications to MX30UF4G18AB-XKI.
-
ImagePart NumberManufacturerSurface MountPackagingPublishedJESD-609 CodePart StatusNumber of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeOperating Temperature (Max)Operating Temperature (Min)Supply Voltage-Max (Vsup)Temperature GradeSupply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityParallel/SerialMemory IC TypeProgramming VoltageLengthHeight Seated (Max)WidthRoHS StatusLead FreeMounting TypePackage / CaseOperating TemperatureSeriesMoisture Sensitivity Level (MSL)Voltage - SupplyMemory SizeMemory TypeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageFactory Lead TimeView Compare
-
MX30UF4G18AB-XKIYESTray2014e1Not For New Designs633A991.B.1.ATin/Silver/Copper (Sn/Ag/Cu)8542.32.00.51CMOSBOTTOMBALL26011.8V0.8mm40R-PBGA-B6385°C-40°C1.95VINDUSTRIAL1.7VASYNCHRONOUS512MX884294967296 bitPARALLELFLASH1.8V11mm1mm9mmNon-RoHS CompliantLead Free-------------
-
-Tray--Discontinued----FLASH - NAND (SLC)-------------------1.8V---ROHS3 Compliant-Surface Mount48-TFSOP (0.488, 12.40mm Width)-40°C~85°C TAMX30UF3 (168 Hours)1.7V~1.95V4Gb 512M x 8Non-VolatileFLASHParallel25ns-
-
YESTray-e3Active48-Matte Tin (Sn)-CMOSDUALGULL WING26011.8V0.5mm40R-PDSO-G4885°C-40°C1.95VINDUSTRIAL1.7VASYNCHRONOUS256MX882147483648 bitPARALLELFLASH1.8V18.4mm1.2mm12mmRoHS Compliant-----3 (168 Hours)------8 Weeks
-
YESTray--Active48---CMOSBOTTOMBALL26011.8V0.8mm40R-PBGA-B4885°C-40°C1.95VINDUSTRIAL1.7VASYNCHRONOUS128MX16162147483648 bitPARALLELFLASH1.8V8mm1mm6mmRoHS Compliant------------8 Weeks
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