Macronix MX30UF4G16AC-XKI
- Part Number:
- MX30UF4G16AC-XKI
- Manufacturer:
- Macronix
- Ventron No:
- 7372687-MX30UF4G16AC-XKI
- Description:
- MXSMIO™ Memory IC MXSMIO™ Series 11mm mm
- Datasheet:
- MX30UF4G16AC-XKI
Macronix MX30UF4G16AC-XKI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF4G16AC-XKI.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case63-VFBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- SeriesMXSMIO™
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations63
- TechnologyFLASH - NAND (SLC)
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- JESD-30 CodeR-PBGA-B63
- Supply Voltage-Max (Vsup)1.95V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size4Gb 256M x 16
- Memory TypeNon-Volatile
- Operating ModeASYNCHRONOUS
- Access Time25ns
- Memory FormatFLASH
- Memory InterfaceParallel
- Organization256MX16
- Memory Width16
- Write Cycle Time - Word, Page600μs, 25ns
- Memory Density4294967296 bit
- Programming Voltage1.8V
- Length11mm
- Height Seated (Max)1mm
- Width9mm
- RoHS StatusROHS3 Compliant
MX30UF4G16AC-XKI Overview
As far as memory types are concerned, Non-Volatile is considered to be its memory type. In addition, memory ics is available in a Tape & Reel (TR) case as well. In the case of 63-VFBGA, it is embedded within the case. A memory chip with a capacity of 4Gb 256M x 16 is used on this device. There is a mainstream memory format used by this device, which is called FLASH-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.7V~1.95V. As far as the mounting type is concerned, Surface Mount is recommended. On the chip, there are 63 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.8V. This part plays an important role in applications that target the MXSMIO™ series of memory devices. There is a need for a programming voltage of 1.8V in order to modify the state of some nonvolatile memory arrays.
MX30UF4G16AC-XKI Features
Package / Case: 63-VFBGA
MX30UF4G16AC-XKI Applications
There are a lot of Macronix
MX30UF4G16AC-XKI Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
As far as memory types are concerned, Non-Volatile is considered to be its memory type. In addition, memory ics is available in a Tape & Reel (TR) case as well. In the case of 63-VFBGA, it is embedded within the case. A memory chip with a capacity of 4Gb 256M x 16 is used on this device. There is a mainstream memory format used by this device, which is called FLASH-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.7V~1.95V. As far as the mounting type is concerned, Surface Mount is recommended. On the chip, there are 63 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.8V. This part plays an important role in applications that target the MXSMIO™ series of memory devices. There is a need for a programming voltage of 1.8V in order to modify the state of some nonvolatile memory arrays.
MX30UF4G16AC-XKI Features
Package / Case: 63-VFBGA
MX30UF4G16AC-XKI Applications
There are a lot of Macronix
MX30UF4G16AC-XKI Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
MX30UF4G16AC-XKI More Descriptions
Flash Memory 4G-bit 256Mx16 SLC NAND 1.8V 63-Pin VFBGA
IC FLASH 4GBIT PARALLEL 63VFBGA
IC MEM SLC NAND 4GB 63CSP
IC FLASH 4GBIT PARALLEL 63VFBGA
IC MEM SLC NAND 4GB 63CSP
The three parts on the right have similar specifications to MX30UF4G16AC-XKI.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeAccess TimeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageMemory DensityProgramming VoltageLengthHeight Seated (Max)WidthRoHS StatusJESD-609 CodeTerminal FinishTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Operating Temperature (Max)Operating Temperature (Min)Temperature GradeParallel/SerialMemory IC TypePublishedECCN CodeHTS CodeLead FreeView Compare
-
MX30UF4G16AC-XKI8 WeeksSurface Mount63-VFBGAYES-40°C~85°C TATape & Reel (TR)MXSMIO™Active3 (168 Hours)63FLASH - NAND (SLC)1.7V~1.95VBOTTOM11.8V0.8mmR-PBGA-B631.95V1.7V4Gb 256M x 16Non-VolatileASYNCHRONOUS25nsFLASHParallel256MX1616600μs, 25ns4294967296 bit1.8V11mm1mm9mmROHS3 Compliant---------------
-
8 Weeks----Tray-Active----------------------------------------
-
8 Weeks--YES-Tray-Active3 (168 Hours)48CMOS-DUAL11.8V0.5mmR-PDSO-G481.95V1.7V--ASYNCHRONOUS---256MX88-2147483648 bit1.8V18.4mm1.2mm12mmRoHS Compliante3Matte Tin (Sn)GULL WING2604085°C-40°CINDUSTRIALPARALLELFLASH----
-
---YES-Tray-Not For New Designs-63CMOS-BOTTOM11.8V0.8mmR-PBGA-B631.95V1.7V--ASYNCHRONOUS---512MX88-4294967296 bit1.8V11mm1mm9mmNon-RoHS Compliante1Tin/Silver/Copper (Sn/Ag/Cu)BALL2604085°C-40°CINDUSTRIALPARALLELFLASH20143A991.B.1.A8542.32.00.51Lead Free
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