MX30UF4G16AC-XKI

Macronix MX30UF4G16AC-XKI

Part Number:
MX30UF4G16AC-XKI
Manufacturer:
Macronix
Ventron No:
7372687-MX30UF4G16AC-XKI
Description:
MXSMIO™ Memory IC MXSMIO™ Series 11mm mm
ECAD Model:
Datasheet:
MX30UF4G16AC-XKI

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Specifications
Macronix MX30UF4G16AC-XKI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF4G16AC-XKI.
  • Factory Lead Time
    8 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    63-VFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Series
    MXSMIO™
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    63
  • Technology
    FLASH - NAND (SLC)
  • Voltage - Supply
    1.7V~1.95V
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.8mm
  • JESD-30 Code
    R-PBGA-B63
  • Supply Voltage-Max (Vsup)
    1.95V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Memory Size
    4Gb 256M x 16
  • Memory Type
    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Access Time
    25ns
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    256MX16
  • Memory Width
    16
  • Write Cycle Time - Word, Page
    600μs, 25ns
  • Memory Density
    4294967296 bit
  • Programming Voltage
    1.8V
  • Length
    11mm
  • Height Seated (Max)
    1mm
  • Width
    9mm
  • RoHS Status
    ROHS3 Compliant
Description
MX30UF4G16AC-XKI Overview
As far as memory types are concerned, Non-Volatile is considered to be its memory type. In addition, memory ics is available in a Tape & Reel (TR) case as well. In the case of 63-VFBGA, it is embedded within the case. A memory chip with a capacity of 4Gb 256M x 16 is used on this device. There is a mainstream memory format used by this device, which is called FLASH-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.7V~1.95V. As far as the mounting type is concerned, Surface Mount is recommended. On the chip, there are 63 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.8V. This part plays an important role in applications that target the MXSMIO™ series of memory devices. There is a need for a programming voltage of 1.8V in order to modify the state of some nonvolatile memory arrays.

MX30UF4G16AC-XKI Features
Package / Case: 63-VFBGA


MX30UF4G16AC-XKI Applications
There are a lot of Macronix
MX30UF4G16AC-XKI Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
MX30UF4G16AC-XKI More Descriptions
Flash Memory 4G-bit 256Mx16 SLC NAND 1.8V 63-Pin VFBGA
IC FLASH 4GBIT PARALLEL 63VFBGA
IC MEM SLC NAND 4GB 63CSP
Product Comparison
The three parts on the right have similar specifications to MX30UF4G16AC-XKI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Access Time
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Memory Density
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    JESD-609 Code
    Terminal Finish
    Terminal Form
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Operating Temperature (Max)
    Operating Temperature (Min)
    Temperature Grade
    Parallel/Serial
    Memory IC Type
    Published
    ECCN Code
    HTS Code
    Lead Free
    View Compare
  • MX30UF4G16AC-XKI
    MX30UF4G16AC-XKI
    8 Weeks
    Surface Mount
    63-VFBGA
    YES
    -40°C~85°C TA
    Tape & Reel (TR)
    MXSMIO™
    Active
    3 (168 Hours)
    63
    FLASH - NAND (SLC)
    1.7V~1.95V
    BOTTOM
    1
    1.8V
    0.8mm
    R-PBGA-B63
    1.95V
    1.7V
    4Gb 256M x 16
    Non-Volatile
    ASYNCHRONOUS
    25ns
    FLASH
    Parallel
    256MX16
    16
    600μs, 25ns
    4294967296 bit
    1.8V
    11mm
    1mm
    9mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30LF2G18SC-XKI
    8 Weeks
    -
    -
    -
    -
    Tray
    -
    Active
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30UF2G18AC-TI
    8 Weeks
    -
    -
    YES
    -
    Tray
    -
    Active
    3 (168 Hours)
    48
    CMOS
    -
    DUAL
    1
    1.8V
    0.5mm
    R-PDSO-G48
    1.95V
    1.7V
    -
    -
    ASYNCHRONOUS
    -
    -
    -
    256MX8
    8
    -
    2147483648 bit
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    e3
    Matte Tin (Sn)
    GULL WING
    260
    40
    85°C
    -40°C
    INDUSTRIAL
    PARALLEL
    FLASH
    -
    -
    -
    -
  • MX30UF4G18AB-XKI
    -
    -
    -
    YES
    -
    Tray
    -
    Not For New Designs
    -
    63
    CMOS
    -
    BOTTOM
    1
    1.8V
    0.8mm
    R-PBGA-B63
    1.95V
    1.7V
    -
    -
    ASYNCHRONOUS
    -
    -
    -
    512MX8
    8
    -
    4294967296 bit
    1.8V
    11mm
    1mm
    9mm
    Non-RoHS Compliant
    e1
    Tin/Silver/Copper (Sn/Ag/Cu)
    BALL
    260
    40
    85°C
    -40°C
    INDUSTRIAL
    PARALLEL
    FLASH
    2014
    3A991.B.1.A
    8542.32.00.51
    Lead Free
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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