MX30UF1G18AC-TI

Macronix MX30UF1G18AC-TI

Part Number:
MX30UF1G18AC-TI
Manufacturer:
Macronix
Ventron No:
7371803-MX30UF1G18AC-TI
Description:
Memory IC 18.4mm mm
ECAD Model:
Datasheet:
MX30UF1G18AC-TI

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Macronix MX30UF1G18AC-TI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF1G18AC-TI.
  • Factory Lead Time
    8 Weeks
  • Surface Mount
    YES
  • Packaging
    Tray
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • Terminal Finish
    Matte Tin (Sn)
  • Technology
    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.5mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PDSO-G48
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    1.95V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    128MX8
  • Memory Width
    8
  • Memory Density
    1073741824 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    1.8V
  • Length
    18.4mm
  • Height Seated (Max)
    1.2mm
  • Width
    12mm
  • RoHS Status
    Non-RoHS Compliant
Description
MX30UF1G18AC-TI Overview
You can get memory ics in a Tray case. There are 48 terminations on the chip. There are 1 functions supported by this part as part of the comprehensive working process. The memory device is designed to be supplied with an 1.8V volt power supply in order to operate properly. The programming voltage required for certain nonvolatile memory arrays is 1.8V. FLASH is the memory IC type of this chip. If the temperature is higher than 85°C, it should only be used. As a result, the part must operate at an operating temperature of -40°C, otherwise it will not work.

MX30UF1G18AC-TI Features


MX30UF1G18AC-TI Applications
There are a lot of Macronix
MX30UF1G18AC-TI Memory applications.


multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
MX30UF1G18AC-TI More Descriptions
Active PARALLEL GULL WING FLASH ic memory 85C 1.7V 1073741824bit 12mm
1.7V~1.95V 1Gbit TFSOP-48 NAND FLASH ROHS
IC FLASH 1GBIT PARALLEL 48TSOP
Product Description Demo for Development.
Product Comparison
The three parts on the right have similar specifications to MX30UF1G18AC-TI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Surface Mount
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Mounting Type
    Package / Case
    Operating Temperature
    Series
    Voltage - Supply
    Memory Size
    Memory Type
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    View Compare
  • MX30UF1G18AC-TI
    MX30UF1G18AC-TI
    8 Weeks
    YES
    Tray
    e3
    Active
    3 (168 Hours)
    48
    Matte Tin (Sn)
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    128MX8
    8
    1073741824 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30UF4G18AC-TI
    -
    -
    Tray
    -
    Discontinued
    3 (168 Hours)
    -
    -
    FLASH - NAND (SLC)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1.8V
    -
    -
    -
    ROHS3 Compliant
    Surface Mount
    48-TFSOP (0.488, 12.40mm Width)
    -40°C~85°C TA
    MX30UF
    1.7V~1.95V
    4Gb 512M x 8
    Non-Volatile
    FLASH
    Parallel
    25ns
  • MX30UF2G18AC-TI
    8 Weeks
    YES
    Tray
    e3
    Active
    3 (168 Hours)
    48
    Matte Tin (Sn)
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30LF2G28AC-TI
    8 Weeks
    YES
    Tray
    -
    Active
    -
    48
    -
    CMOS
    DUAL
    GULL WING
    -
    1
    3.3V
    0.5mm
    -
    R-PDSO-G48
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    2.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    3V
    18.4mm
    1.2mm
    12mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 15 September 2023

    Comparing LM741CN and UA741CN Operational Amplifiers

    The two op amps, LM741CN and UA741CN, have similar functional and performance characteristics. They both feature single op amps and similar supply voltages and pinouts. However, they have...
  • 18 September 2023

    TL074CN Symbol, Features and Package

    Ⅰ. Overview of TL074CNⅡ. 3D Model and symbol of TL074CNⅢ. Footprint of TL074CNⅣ. Technical parametersⅤ. Features of TL074CNⅥ. Application of TL074CNⅦ. Package of TL074CNⅧ. How to optimize the...
  • 18 September 2023

    STM32F103C6T6 Microcontroller:Features, Package and Application

    Ⅰ. What is STM32F103C6T6?Ⅱ. 3D Model and pins of STM32F103C6T6Ⅲ. Technical parametersⅣ. Features of STM32F103C6T6Ⅴ. Package of STM32F103C6T6Ⅵ. Application of STM32F103C6T6Ⅶ. Components of the STM32F103C6T6 minimum system boardⅧ....
  • 19 September 2023

    Comparison Between 2N3055 vs TIP3055

    Ⅰ. Overview of 2N3055Ⅱ. Overview of TIP3055Ⅲ. Pin diagram comparisonⅣ. Technical parametersⅤ. Comparison of current amplification factorsⅥ. Package comparisonⅦ. Symbol of 2N3055 and TIP3055Ⅷ. Application scenarios comparisonⅨ. Can...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.