Xilinx Inc. XCZU4EG-1FBVB900E
- Part Number:
- XCZU4EG-1FBVB900E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669293-XCZU4EG-1FBVB900E
- Description:
- IC FPGA 204 I/O 900FCBGA
- Datasheet:
- XCZU4EG-1FBVB900E
Xilinx Inc. XCZU4EG-1FBVB900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EG-1FBVB900E.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 192K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The packaging for this product is a tray and its part status is currently active. It has a moisture sensitivity level of 4, meaning it can withstand 72 hours of exposure to moisture. The HTS code for this product is 8542.31.00.01. It has a total of 204 input/output connections and a RAM size of 256KB. The core processor is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, as well as Dual ARM®Cortex™-R5 with CoreSight™ and an ARM Mali™-400 MP2. Some of its peripherals include DMA and WDT, and it also has connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This product falls under the architecture category of MCU and FPGA.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EG-1FBVB900E System On Chip (SoC) applications.
DC-input BLDC motor drive
Central alarm system
Industrial robot
Keyboard
Sensor network-on-chip (sNoC)
Central alarm system
Multiprocessor system-on-chips (MPSoCs)
Efficient hardware for inference of neural networks
POS Terminals
Sports
The packaging for this product is a tray and its part status is currently active. It has a moisture sensitivity level of 4, meaning it can withstand 72 hours of exposure to moisture. The HTS code for this product is 8542.31.00.01. It has a total of 204 input/output connections and a RAM size of 256KB. The core processor is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, as well as Dual ARM®Cortex™-R5 with CoreSight™ and an ARM Mali™-400 MP2. Some of its peripherals include DMA and WDT, and it also has connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This product falls under the architecture category of MCU and FPGA.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EG-1FBVB900E System On Chip (SoC) applications.
DC-input BLDC motor drive
Central alarm system
Industrial robot
Keyboard
Sensor network-on-chip (sNoC)
Central alarm system
Multiprocessor system-on-chips (MPSoCs)
Efficient hardware for inference of neural networks
POS Terminals
Sports
XCZU4EG-1FBVB900E More Descriptions
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 192K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC 7BIT BINARY COUNTER 14-TSSOP
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 192K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC 7BIT BINARY COUNTER 14-TSSOP
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU4EG-1FBVB900E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU4EG-1FBVB900E11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 192K Logic CellsROHS3 Compliant------------
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11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
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11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant-----------
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