Vishay Siliconix SIS406DN-T1-GE3
- Part Number:
- SIS406DN-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Ventron No:
- 2481426-SIS406DN-T1-GE3
- Description:
- MOSFET N-CH 30V 9A 1212-8 PPAK
- Datasheet:
- SIS406DN-T1-GE3
Vishay Siliconix SIS406DN-T1-GE3 technical specifications, attributes, parameters and parts with similar specifications to Vishay Siliconix SIS406DN-T1-GE3.
- Factory Lead Time14 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / CasePowerPAK® 1212-8
- Number of Pins8
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~150°C TJ
- PackagingTape & Reel (TR)
- SeriesTrenchFET®
- Published2013
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations5
- ECCN CodeEAR99
- Terminal FinishMATTE TIN
- SubcategoryFET General Purpose Power
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionDUAL
- Terminal FormC BEND
- Peak Reflow Temperature (Cel)260
- Time@Peak Reflow Temperature-Max (s)40
- Pin Count8
- JESD-30 CodeS-XDSO-C5
- Number of Elements1
- Number of Channels1
- Power Dissipation-Max1.5W Ta
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Power Dissipation1.5W
- Case ConnectionDRAIN
- Turn On Delay Time20 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs11m Ω @ 12A, 10V
- Vgs(th) (Max) @ Id3V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds1100pF @ 15V
- Current - Continuous Drain (Id) @ 25°C9A Ta
- Gate Charge (Qg) (Max) @ Vgs28nC @ 10V
- Rise Time12ns
- Drive Voltage (Max Rds On,Min Rds On)4.5V 10V
- Vgs (Max)±25V
- Fall Time (Typ)12 ns
- Turn-Off Delay Time25 ns
- Continuous Drain Current (ID)9A
- Gate to Source Voltage (Vgs)25V
- Drain Current-Max (Abs) (ID)9A
- Drain to Source Breakdown Voltage30V
- Pulsed Drain Current-Max (IDM)50A
- Avalanche Energy Rating (Eas)20 mJ
- Height1.04mm
- Length3.05mm
- Width3.05mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
SIS406DN-T1-GE3 Overview
The MOSFET's breakdown is called "avalanche break down", and the avalanche energy applied to transistor is rated as 20 mJ (Eas).An op amp's input capacitance is defined as the capacitance between both of its input terminals with either input grounded, and 1100pF @ 15V is its maximum input capacitance.The drain current is the maximum continuous current the device can conduct, and this device has 9A continuous drain current (ID).A drainage-to-source breakdown voltage corresponds to the voltage at which a specified value of ID flows, where VGS is 30V, and this device has a drainage-to-source breakdown voltage of 30VV.Drain current refers to the maximum continuous current a device can conduct, and it is 9A.Input capacitance must be charged before drain current conduction can begin, so the turn-off delay time is 25 ns.Peak drain current is 50A, which is the maximum pulsed drain current.Before drain current conduction begins, the device's input capacitance must be charged, so the delay time is 20 ns.An FET transistor's gate-source voltage, VGS, indicates how much voltage is applied across the transistor's gate-source terminal and it can range from 25V to 1.Using drive voltage (4.5V 10V), this device contributes to a reduction in overall power consumption.
SIS406DN-T1-GE3 Features
the avalanche energy rating (Eas) is 20 mJ
a continuous drain current (ID) of 9A
a drain-to-source breakdown voltage of 30V voltage
the turn-off delay time is 25 ns
based on its rated peak drain current 50A.
SIS406DN-T1-GE3 Applications
There are a lot of Vishay Siliconix
SIS406DN-T1-GE3 applications of single MOSFETs transistors.
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
The MOSFET's breakdown is called "avalanche break down", and the avalanche energy applied to transistor is rated as 20 mJ (Eas).An op amp's input capacitance is defined as the capacitance between both of its input terminals with either input grounded, and 1100pF @ 15V is its maximum input capacitance.The drain current is the maximum continuous current the device can conduct, and this device has 9A continuous drain current (ID).A drainage-to-source breakdown voltage corresponds to the voltage at which a specified value of ID flows, where VGS is 30V, and this device has a drainage-to-source breakdown voltage of 30VV.Drain current refers to the maximum continuous current a device can conduct, and it is 9A.Input capacitance must be charged before drain current conduction can begin, so the turn-off delay time is 25 ns.Peak drain current is 50A, which is the maximum pulsed drain current.Before drain current conduction begins, the device's input capacitance must be charged, so the delay time is 20 ns.An FET transistor's gate-source voltage, VGS, indicates how much voltage is applied across the transistor's gate-source terminal and it can range from 25V to 1.Using drive voltage (4.5V 10V), this device contributes to a reduction in overall power consumption.
SIS406DN-T1-GE3 Features
the avalanche energy rating (Eas) is 20 mJ
a continuous drain current (ID) of 9A
a drain-to-source breakdown voltage of 30V voltage
the turn-off delay time is 25 ns
based on its rated peak drain current 50A.
SIS406DN-T1-GE3 Applications
There are a lot of Vishay Siliconix
SIS406DN-T1-GE3 applications of single MOSFETs transistors.
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
SIS406DN-T1-GE3 More Descriptions
Trans MOSFET N-CH 30V 9A 8-Pin PowerPAK 1212 EP T/R
MOSFET 30V 14A 3.7W 11mohm @ 10V
French Electronic Distributor since 1988
MOSFET 30V 14A 3.7W 11mohm @ 10V
French Electronic Distributor since 1988
The three parts on the right have similar specifications to SIS406DN-T1-GE3.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Pin CountJESD-30 CodeNumber of ElementsNumber of ChannelsPower Dissipation-MaxElement ConfigurationOperating ModePower DissipationCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Gate to Source Voltage (Vgs)Drain Current-Max (Abs) (ID)Drain to Source Breakdown VoltagePulsed Drain Current-Max (IDM)Avalanche Energy Rating (Eas)HeightLengthWidthRadiation HardeningRoHS StatusThreshold VoltageREACH SVHCResistanceConfigurationDrain to Source Voltage (Vdss)DS Breakdown Voltage-MinLead FreeView Compare
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SIS406DN-T1-GE314 WeeksSurface MountSurface MountPowerPAK® 1212-88SILICON-55°C~150°C TJTape & Reel (TR)TrenchFET®2013e3yesActive1 (Unlimited)5EAR99MATTE TINFET General Purpose PowerMOSFET (Metal Oxide)DUALC BEND260408S-XDSO-C5111.5W TaSingleENHANCEMENT MODE1.5WDRAIN20 nsN-ChannelSWITCHING11m Ω @ 12A, 10V3V @ 250μA1100pF @ 15V9A Ta28nC @ 10V12ns4.5V 10V±25V12 ns25 ns9A25V9A30V50A20 mJ1.04mm3.05mm3.05mmNoROHS3 Compliant--------
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15 WeeksSurface MountSurface MountPowerPAK® 1212-88SILICON-55°C~150°C TJTape & Reel (TR)TrenchFET®2016e3yesObsolete1 (Unlimited)5EAR99MATTE TINFET General Purpose PowerMOSFET (Metal Oxide)DUALC BEND260408S-PDSO-C5113.8W Ta 52W TcSingleENHANCEMENT MODE3.8WDRAIN20 nsN-ChannelSWITCHING3.25m Ω @ 20A, 10V2.2V @ 250μA1700pF @ 6V35A Tc41nC @ 10V12ns4.5V 10V±20V10 ns25 ns35A20V-12V-45 mJ---NoROHS3 Compliant1.2VUnknown-----
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13 WeeksSurface MountSurface MountPowerPAK® 1212-88SILICON-55°C~150°C TJTape & Reel (TR)TrenchFET®2016e3yesObsolete1 (Unlimited)5EAR99MATTE TINFET General Purpose PowersMOSFET (Metal Oxide)DUALC BEND260408S-XDSO-C5113.5W Ta 27.7W Tc-ENHANCEMENT MODE3.5WDRAIN15 nsN-ChannelSWITCHING10.5m Ω @ 10A, 10V2.3V @ 250μA855pF @ 10V16A Tc22nC @ 10V12ns4.5V 10V±20V10 ns15 ns16A20V--32A-1.04mm3.05mm3.05mmNoROHS3 Compliant--4.5mOhmSINGLE WITH BUILT-IN DIODE25V25VLead Free
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15 WeeksSurface MountSurface MountPowerPAK® 1212-88SILICON-55°C~150°C TJTape & Reel (TR)TrenchFET®2011e3yesObsolete1 (Unlimited)5EAR99MATTE TINFET General Purpose PowerMOSFET (Metal Oxide)DUALC BEND260408S-PDSO-C5113.4W Ta 31W TcSingleENHANCEMENT MODE3.4WDRAIN7 nsN-ChannelSWITCHING16m Ω @ 10A, 4.5V1.5V @ 250μA795pF @ 15V20A Tc33nC @ 10V13ns2.5V 4.5V±12V8 ns21 ns20A12V--50A5 mJ---NoROHS3 Compliant600mVUnknown--30V30VLead Free
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