SI8824EDB-T2-E1

Vishay Siliconix SI8824EDB-T2-E1

Part Number:
SI8824EDB-T2-E1
Manufacturer:
Vishay Siliconix
Ventron No:
2478982-SI8824EDB-T2-E1
Description:
MOSFET N-CH 20V 2.1A MICROFOOT
ECAD Model:
Datasheet:
SI8824EDB-T2-E1

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Specifications
Vishay Siliconix SI8824EDB-T2-E1 technical specifications, attributes, parameters and parts with similar specifications to Vishay Siliconix SI8824EDB-T2-E1.
  • Factory Lead Time
    44 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    4-XFBGA
  • Number of Pins
    4
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~150°C TJ
  • Packaging
    Tape & Reel (TR)
  • Series
    TrenchFET®
  • Published
    2017
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    4
  • ECCN Code
    EAR99
  • Resistance
    60mOhm
  • Technology
    MOSFET (Metal Oxide)
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of Elements
    1
  • Configuration
    SINGLE WITH BUILT-IN DIODE
  • Power Dissipation-Max
    500mW Ta
  • Operating Mode
    ENHANCEMENT MODE
  • FET Type
    N-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    75m Ω @ 1A, 4.5V
  • Vgs(th) (Max) @ Id
    800mV @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    400pF @ 10V
  • Gate Charge (Qg) (Max) @ Vgs
    6nC @ 4.5V
  • Drain to Source Voltage (Vdss)
    20V
  • Drive Voltage (Max Rds On,Min Rds On)
    1.2V 4.5V
  • Vgs (Max)
    ±5V
  • Continuous Drain Current (ID)
    2.9A
  • Threshold Voltage
    800mV
  • DS Breakdown Voltage-Min
    20V
  • REACH SVHC
    Unknown
  • RoHS Status
    ROHS3 Compliant
Description
SI8824EDB-T2-E1 Overview
Input capacitance, CI, is defined as the capacitance between two input terminals of an op amp with one input grounded, and the input capacitance of this device is 400pF @ 10V.This device has a continuous drain current (ID) of [2.9A], which is its maximum continuous current.Electrical devices have threshold voltages at which their operations become active, and this transistor has a threshold voltage of 800mV.In order to maintain normal operation, it is recommended to keep the DS breakdown voltage above 20V.In order to operate this transistor, a voltage of 20V is needed from the drain to the source (Vdss).Its overall power consumption can be reduced by using drive voltage (1.2V 4.5V).

SI8824EDB-T2-E1 Features
a continuous drain current (ID) of 2.9A
a threshold voltage of 800mV
a 20V drain to source voltage (Vdss)


SI8824EDB-T2-E1 Applications
There are a lot of Vishay Siliconix
SI8824EDB-T2-E1 applications of single MOSFETs transistors.


Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
SI8824EDB-T2-E1 More Descriptions
Mosfet, N-Ch, 20V, 2.9A, Micro Foot Rohs Compliant: Yes |Vishay SI8824EDB-T2-E1
20V 2.1A 500mW 75m´Î@4.5V1A 800mV@250Ã×A N Channel XFBGA-4 MOSFETs ROHS
Trans MOSFET N-CH 20V 2.9A 4-Pin Micro Foot T/R
Small Signal Field-Effect Transistor, 20V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET
MOSFET N-CH 20V 2.1A MICROFOOT
Product Comparison
The three parts on the right have similar specifications to SI8824EDB-T2-E1.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Transistor Element Material
    Operating Temperature
    Packaging
    Series
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Resistance
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Number of Elements
    Configuration
    Power Dissipation-Max
    Operating Mode
    FET Type
    Transistor Application
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Input Capacitance (Ciss) (Max) @ Vds
    Gate Charge (Qg) (Max) @ Vgs
    Drain to Source Voltage (Vdss)
    Drive Voltage (Max Rds On,Min Rds On)
    Vgs (Max)
    Continuous Drain Current (ID)
    Threshold Voltage
    DS Breakdown Voltage-Min
    REACH SVHC
    RoHS Status
    Pbfree Code
    Terminal Finish
    Element Configuration
    Rise Time
    Fall Time (Typ)
    Turn-Off Delay Time
    Gate to Source Voltage (Vgs)
    Drain-source On Resistance-Max
    Radiation Hardening
    Lead Free
    Subcategory
    Pin Count
    Number of Channels
    Power Dissipation
    Contact Plating
    JESD-609 Code
    Turn On Delay Time
    Drain to Source Breakdown Voltage
    Nominal Vgs
    View Compare
  • SI8824EDB-T2-E1
    SI8824EDB-T2-E1
    44 Weeks
    Surface Mount
    Surface Mount
    4-XFBGA
    4
    SILICON
    -55°C~150°C TJ
    Tape & Reel (TR)
    TrenchFET®
    2017
    Active
    1 (Unlimited)
    4
    EAR99
    60mOhm
    MOSFET (Metal Oxide)
    BOTTOM
    BALL
    NOT SPECIFIED
    NOT SPECIFIED
    1
    SINGLE WITH BUILT-IN DIODE
    500mW Ta
    ENHANCEMENT MODE
    N-Channel
    SWITCHING
    75m Ω @ 1A, 4.5V
    800mV @ 250μA
    400pF @ 10V
    6nC @ 4.5V
    20V
    1.2V 4.5V
    ±5V
    2.9A
    800mV
    20V
    Unknown
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • SI8821EDB-T2-E1
    30 Weeks
    Surface Mount
    Surface Mount
    4-XFBGA, CSPBGA
    4
    SILICON
    -55°C~150°C TJ
    Cut Tape (CT)
    TrenchFET®
    2013
    Active
    1 (Unlimited)
    4
    EAR99
    -
    MOSFET (Metal Oxide)
    BOTTOM
    BALL
    260
    30
    1
    -
    500mW Ta
    ENHANCEMENT MODE
    P-Channel
    SWITCHING
    135m Ω @ 1A, 4.5V
    1.3V @ 250μA
    440pF @ 15V
    17nC @ 10V
    30V
    2.5V 4.5V
    ±12V
    -2.3A
    -600mV
    30V
    Unknown
    ROHS3 Compliant
    yes
    Pure Matte Tin (Sn)
    Single
    20ns
    15 ns
    40 ns
    12V
    0.15Ohm
    No
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • SI8809EDB-T2-E1
    15 Weeks
    Surface Mount
    Surface Mount
    4-XFBGA
    4
    SILICON
    -55°C~150°C TJ
    Tape & Reel (TR)
    TrenchFET®
    2017
    Obsolete
    1 (Unlimited)
    4
    EAR99
    -
    MOSFET (Metal Oxide)
    BOTTOM
    BALL
    260
    30
    1
    -
    500mW Ta
    ENHANCEMENT MODE
    P-Channel
    SWITCHING
    90m Ω @ 1.5A, 4.5V
    900mV @ 250μA
    -
    15nC @ 8V
    20V
    1.8V 4.5V
    ±8V
    -2.6A
    -
    20V
    -
    ROHS3 Compliant
    -
    Pure Matte Tin (Sn)
    Single
    -
    -
    -
    8V
    -
    No
    Lead Free
    Other Transistors
    4
    1
    500mW
    -
    -
    -
    -
    -
  • SI8802DB-T2-E1
    30 Weeks
    Surface Mount
    Surface Mount
    4-XFBGA
    4
    SILICON
    -55°C~150°C TJ
    Digi-Reel®
    TrenchFET®
    2015
    Active
    1 (Unlimited)
    4
    EAR99
    54mOhm
    MOSFET (Metal Oxide)
    BOTTOM
    BALL
    -
    -
    1
    -
    500mW Ta
    ENHANCEMENT MODE
    N-Channel
    SWITCHING
    54m Ω @ 1A, 4.5V
    700mV @ 250μA
    -
    6.5nC @ 4.5V
    -
    1.2V 4.5V
    ±5V
    3.5A
    -
    -
    Unknown
    ROHS3 Compliant
    -
    -
    Single
    15ns
    7 ns
    22 ns
    5V
    -
    No
    Lead Free
    FET General Purpose Power
    4
    1
    500mW
    Tin
    e3
    5 ns
    8V
    350 mV
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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