Microsemi Corporation M2S150TS-FCSG536I
- Part Number:
- M2S150TS-FCSG536I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3669324-M2S150TS-FCSG536I
- Description:
- IC FPGA SOC 150K LUTS
- Datasheet:
- M2S150TS-FCSG536I
Microsemi Corporation M2S150TS-FCSG536I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150TS-FCSG536I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case536-LFBGA, CSPBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations536
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B536
- Supply Voltage-Max (Vsup)1.26V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O293
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 150K Logic Modules
- Flash Size512KB
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 536-LFBGA, CSPBGA by its manufacturer for this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series SmartFusion?2.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 293.A power supply with a 1.2V rating is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.A system on a chip benefits from having 536 terminations.A 512KB flash can be seen on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S150TS-FCSG536I System On Chip (SoC) applications.
Cyber security for critical applications in the aerospace
Functional safety for critical applications in the aerospace
ARM
Networked sensors
Level
POS Terminals
Sports
Flow Sensors
Networked Media Encode/Decode
USB hard disk enclosure
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 536-LFBGA, CSPBGA by its manufacturer for this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series SmartFusion?2.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 293.A power supply with a 1.2V rating is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.A system on a chip benefits from having 536 terminations.A 512KB flash can be seen on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S150TS-FCSG536I System On Chip (SoC) applications.
Cyber security for critical applications in the aerospace
Functional safety for critical applications in the aerospace
ARM
Networked sensors
Level
POS Terminals
Sports
Flow Sensors
Networked Media Encode/Decode
USB hard disk enclosure
M2S150TS-FCSG536I More Descriptions
M2S150Ts-Fcsg536I 536 Lfbga 16X16X1.45Mm Tray Rohs Compliant: Yes |Microchip M2S150TS-FCSG536I
SoC 32-Bit ARM Cortex-M3 RISC 166MHz Single Core 536-Pin FCBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 536BGA
SoC 32-Bit ARM Cortex-M3 RISC 166MHz Single Core 536-Pin FCBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 536BGA
The three parts on the right have similar specifications to M2S150TS-FCSG536I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureProgrammable Logic TypePrimary AttributesFlash SizeRoHS StatusSubcategoryTechnologyNumber of OutputsQualification StatusPower SuppliesNumber of InputsNumber of Logic CellsTerminal PitchReach Compliance CodeFrequencyBase Part NumberInterfaceCore ArchitectureHeight Seated (Max)LengthWidthView Compare
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M2S150TS-FCSG536I10 WeeksIN PRODUCTION (Last Updated: 1 month ago)536-LFBGA, CSPBGAYES-40°C~100°C TJTray2015SmartFusion®2e3yesActive3 (168 Hours)536MATTE TIN8542.39.00.01BOTTOMBALLNOT SPECIFIED1.2VNOT SPECIFIEDS-PBGA-B5361.26V1.14V293166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 150K Logic Modules512KBRoHS Compliant-----------------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)536-LFBGA, CSPBGAYES-40°C~100°C TJTray2015SmartFusion®2e0-Active3 (168 Hours)536Tin/Lead (Sn/Pb)8542.39.00.01BOTTOMBALLNOT SPECIFIED1.2VNOT SPECIFIEDS-PBGA-B5361.26V1.14V293166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 150K Logic Modules512KBRoHS CompliantField Programmable Gate ArraysCMOS293Not Qualified1.2V293146124---------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)1152-BBGA, FCBGAYES-40°C~100°C TJTray2009SmartFusion®2e0-Active3 (168 Hours)-Tin/Lead (Sn/Pb)8542.39.00.01BOTTOMBALLNOT SPECIFIED1.2VNOT SPECIFIEDS-PBGA-B11521.26V1.14V574-64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 150K Logic Modules512KBNon-RoHS CompliantField Programmable Gate ArraysCMOS574Not Qualified1.2V5741461241mmnot_compliant166MHzM2S150TCAN, Ethernet, I2C, SPI, UART, USART, USBARM2.9mm35mm35mm
-
--1152-BBGA, FCBGAYES0°C~85°C TJTray2009SmartFusion®2--Obsolete3 (168 Hours)---BOTTOMBALLNOT SPECIFIED1.2VNOT SPECIFIEDS-PBGA-B11521.26V1.14V574-64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 100K Logic Modules512KBRoHS CompliantField Programmable Gate ArraysCMOS574Not Qualified1.2V574995121mm-166MHzM2S100CAN, Ethernet, I2C, SPI, UART, USART, USBARM2.9mm35mm35mm
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