M2S150TS-FCSG536I

Microsemi Corporation M2S150TS-FCSG536I

Part Number:
M2S150TS-FCSG536I
Manufacturer:
Microsemi Corporation
Ventron No:
3669324-M2S150TS-FCSG536I
Description:
IC FPGA SOC 150K LUTS
ECAD Model:
Datasheet:
M2S150TS-FCSG536I

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Microsemi Corporation M2S150TS-FCSG536I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150TS-FCSG536I.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Package / Case
    536-LFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    536
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.39.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B536
  • Supply Voltage-Max (Vsup)
    1.26V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    293
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 150K Logic Modules
  • Flash Size
    512KB
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 536-LFBGA, CSPBGA by its manufacturer for this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series SmartFusion?2.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 293.A power supply with a 1.2V rating is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.A system on a chip benefits from having 536 terminations.A 512KB flash can be seen on it.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S150TS-FCSG536I System On Chip (SoC) applications.

Cyber security for critical applications in the aerospace
Functional safety for critical applications in the aerospace
ARM
Networked sensors
Level
POS Terminals
Sports
Flow Sensors
Networked Media Encode/Decode
USB hard disk enclosure
M2S150TS-FCSG536I More Descriptions
M2S150Ts-Fcsg536I 536 Lfbga 16X16X1.45Mm Tray Rohs Compliant: Yes |Microchip M2S150TS-FCSG536I
SoC 32-Bit ARM Cortex-M3 RISC 166MHz Single Core 536-Pin FCBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 536BGA
Product Comparison
The three parts on the right have similar specifications to M2S150TS-FCSG536I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Programmable Logic Type
    Primary Attributes
    Flash Size
    RoHS Status
    Subcategory
    Technology
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of Inputs
    Number of Logic Cells
    Terminal Pitch
    Reach Compliance Code
    Frequency
    Base Part Number
    Interface
    Core Architecture
    Height Seated (Max)
    Length
    Width
    View Compare
  • M2S150TS-FCSG536I
    M2S150TS-FCSG536I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    536-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    yes
    Active
    3 (168 Hours)
    536
    MATTE TIN
    8542.39.00.01
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    NOT SPECIFIED
    S-PBGA-B536
    1.26V
    1.14V
    293
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    512KB
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S150T-FCSG536I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    536-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    -
    Active
    3 (168 Hours)
    536
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    NOT SPECIFIED
    S-PBGA-B536
    1.26V
    1.14V
    293
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    512KB
    RoHS Compliant
    Field Programmable Gate Arrays
    CMOS
    293
    Not Qualified
    1.2V
    293
    146124
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S150T-1FC1152I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    e0
    -
    Active
    3 (168 Hours)
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    NOT SPECIFIED
    S-PBGA-B1152
    1.26V
    1.14V
    574
    -
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    512KB
    Non-RoHS Compliant
    Field Programmable Gate Arrays
    CMOS
    574
    Not Qualified
    1.2V
    574
    146124
    1mm
    not_compliant
    166MHz
    M2S150T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
    2.9mm
    35mm
    35mm
  • M2S100-1FCG1152
    -
    -
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    NOT SPECIFIED
    S-PBGA-B1152
    1.26V
    1.14V
    574
    -
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 100K Logic Modules
    512KB
    RoHS Compliant
    Field Programmable Gate Arrays
    CMOS
    574
    Not Qualified
    1.2V
    574
    99512
    1mm
    -
    166MHz
    M2S100
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
    2.9mm
    35mm
    35mm
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.