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M2S150TS-1FCS536

Microsemi Corporation M2S150TS-1FCS536

Part Number:
M2S150TS-1FCS536
Manufacturer:
Microsemi Corporation
Ventron No:
3669321-M2S150TS-1FCS536
Description:
IC FPGA SOC 150K LUTS
ECAD Model:
Datasheet:
M2S150TS-1FCS536

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Specifications
Microsemi Corporation M2S150TS-1FCS536 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150TS-1FCS536.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Package / Case
    536-LFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    536
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.39.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B536
  • Supply Voltage-Max (Vsup)
    1.26V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    293
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 150K Logic Modules
  • Flash Size
    512KB
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The product in question is currently in the IN PRODUCTION lifecycle status, with the last update being 1 month ago. It is housed in a 536-LFBGA or CSPBGA package/case and is packaged in a tray. The product has 536 terminations and the terminal position is located at the bottom. It is important to note that this product is not compliant with the Reach Compliance Code. The reflow temperature-max (s) is not specified and the JESD-30 Code is S-PBGA-B536. This product also boasts a RAM size of 64KB and is powered by an ARM® Cortex®-M3 core processor.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S150TS-1FCS536 System On Chip (SoC) applications.

DC-input BLDC motor drive
Personal Computers
Efficient hardware for training of neural networks
Automotive gateway
Multiprocessor system-on-chips (MPSoCs)
Remote control
Networked sensors
Networked Media Encode/Decode
Special Issue Editors
Fitness
M2S150TS-1FCS536 More Descriptions
M2S150Ts-1Fcs536 536 Lfbga 16X16X1.45Mm Tray Rohs Compliant: Yes |Microchip M2S150TS-1FCS536
FPGA SmartFusion2 146124 Cells 166MHz 65nm Technology 1.2V 536-Pin FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 536BGA
Product Comparison
The three parts on the right have similar specifications to M2S150TS-1FCS536.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reach Compliance Code
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Programmable Logic Type
    Primary Attributes
    Flash Size
    RoHS Status
    Subcategory
    Technology
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of Inputs
    Number of Logic Cells
    Terminal Pitch
    Frequency
    Base Part Number
    Interface
    Core Architecture
    Height Seated (Max)
    Length
    Width
    View Compare
  • M2S150TS-1FCS536
    M2S150TS-1FCS536
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    536-LFBGA, CSPBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    no
    Active
    3 (168 Hours)
    536
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    not_compliant
    NOT SPECIFIED
    S-PBGA-B536
    1.26V
    1.14V
    293
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    512KB
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S150T-FCSG536I
    M2S150T-FCSG536I
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    536-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    -
    Active
    3 (168 Hours)
    536
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    -
    NOT SPECIFIED
    S-PBGA-B536
    1.26V
    1.14V
    293
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    512KB
    RoHS Compliant
    Field Programmable Gate Arrays
    CMOS
    293
    Not Qualified
    1.2V
    293
    146124
    -
    -
    -
    -
    -
    -
    -
    -
    M2S150TS-1FCS536 vs M2S150T-FCSG536I
  • M2S150T-1FC1152I
    M2S150T-1FC1152I
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    e0
    -
    Active
    3 (168 Hours)
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    not_compliant
    NOT SPECIFIED
    S-PBGA-B1152
    1.26V
    1.14V
    574
    -
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    512KB
    Non-RoHS Compliant
    Field Programmable Gate Arrays
    CMOS
    574
    Not Qualified
    1.2V
    574
    146124
    1mm
    166MHz
    M2S150T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
    2.9mm
    35mm
    35mm
    M2S150TS-1FCS536 vs M2S150T-1FC1152I
  • M2S150TS-1FCG1152
    M2S150TS-1FCG1152
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    -
    Active
    3 (168 Hours)
    -
    MATTE TIN
    8542.39.00.01
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    -
    NOT SPECIFIED
    S-PBGA-B1152
    1.26V
    1.14V
    574
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    512KB
    RoHS Compliant
    Field Programmable Gate Arrays
    CMOS
    574
    Not Qualified
    1.2V
    574
    146124
    1mm
    -
    -
    -
    -
    2.9mm
    35mm
    35mm
    M2S150TS-1FCS536 vs M2S150TS-1FCG1152
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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