M2S150-FCG1152I

Microsemi Corporation M2S150-FCG1152I

Part Number:
M2S150-FCG1152I
Manufacturer:
Microsemi Corporation
Ventron No:
3669315-M2S150-FCG1152I
Description:
IC FPGA SOC 150K LUTS 1152FCBGA
ECAD Model:
Datasheet:
M2S150-FCG1152I

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Specifications
Microsemi Corporation M2S150-FCG1152I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150-FCG1152I.
  • Factory Lead Time
    12 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Package / Case
    1152-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B1152
  • Number of Outputs
    574
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    574
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    574
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 150K Logic Modules
  • Number of Logic Cells
    146124
  • Flash Size
    512KB
  • Height Seated (Max)
    2.9mm
  • Length
    35mm
  • Width
    35mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Surface Mount technology has been widely adopted by the electronics industry since its introduction in 2015. This method of mounting electronic components directly onto the surface of a printed circuit board has greatly improved the efficiency and reliability of electronic devices. The JESD-609 Code, also known as e3, certifies that the components used in this process meet the highest standards for environmental sustainability. The HTS Code 8542.39.00.01 further classifies these components as integrated circuits, specifically CMOS technology. The terminal form for these components is BALL, with 574 outputs and inputs each, making it ideal for complex circuit designs. With a speed of 166MHz and powered by the ARM® Cortex®-M3 core processor, this technology is at the forefront of modern electronics.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S150-FCG1152I System On Chip (SoC) applications.

sequence controllers
Medical Pressure
High-end PLC
Avionics
Keyboard
ARM processors
Industrial robot
RISC-V
ARM Cortex M4 microcontroller
Efficient hardware for training of neural networks
M2S150-FCG1152I More Descriptions
M2S150-Fcg1152I 1152 Bga 35X35X2.90Mm Tray Rohs Compliant: Yes |Microchip M2S150-FCG1152I
FPGA SmartFusion2 146124 Cells 166MHz 65nm Technology 1.2V 1152-Pin FBGA
Field Programmable Gate Array, 146124-Cell, CMOS, PBGA1152
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 1152BGA
IC FPGA SOC 150K LUTS 1152FCBGA
Product Comparison
The three parts on the right have similar specifications to M2S150-FCG1152I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Frequency
    Base Part Number
    Interface
    Core Architecture
    Reach Compliance Code
    View Compare
  • M2S150-FCG1152I
    M2S150-FCG1152I
    12 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    1152-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    2.9mm
    35mm
    35mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
  • M2S100-1FCG1152
    -
    -
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    -
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 100K Logic Modules
    99512
    512KB
    2.9mm
    35mm
    35mm
    RoHS Compliant
    166MHz
    M2S100
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
    -
  • M2S150TS-FC1152I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    2.9mm
    35mm
    35mm
    Non-RoHS Compliant
    -
    -
    -
    -
    not_compliant
  • M2S150TS-1FCG1152
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B1152
    574
    Not Qualified
    1.26V
    1.2V
    1.14V
    574
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    574
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 150K Logic Modules
    146124
    512KB
    2.9mm
    35mm
    35mm
    RoHS Compliant
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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