Microsemi Corporation M2S150-FCG1152I
- Part Number:
- M2S150-FCG1152I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3669315-M2S150-FCG1152I
- Description:
- IC FPGA SOC 150K LUTS 1152FCBGA
- Datasheet:
- M2S150-FCG1152I
Microsemi Corporation M2S150-FCG1152I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S150-FCG1152I.
- Factory Lead Time12 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case1152-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B1152
- Number of Outputs574
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O574
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs574
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 150K Logic Modules
- Number of Logic Cells146124
- Flash Size512KB
- Height Seated (Max)2.9mm
- Length35mm
- Width35mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Surface Mount technology has been widely adopted by the electronics industry since its introduction in 2015. This method of mounting electronic components directly onto the surface of a printed circuit board has greatly improved the efficiency and reliability of electronic devices. The JESD-609 Code, also known as e3, certifies that the components used in this process meet the highest standards for environmental sustainability. The HTS Code 8542.39.00.01 further classifies these components as integrated circuits, specifically CMOS technology. The terminal form for these components is BALL, with 574 outputs and inputs each, making it ideal for complex circuit designs. With a speed of 166MHz and powered by the ARM® Cortex®-M3 core processor, this technology is at the forefront of modern electronics.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S150-FCG1152I System On Chip (SoC) applications.
sequence controllers
Medical Pressure
High-end PLC
Avionics
Keyboard
ARM processors
Industrial robot
RISC-V
ARM Cortex M4 microcontroller
Efficient hardware for training of neural networks
The Surface Mount technology has been widely adopted by the electronics industry since its introduction in 2015. This method of mounting electronic components directly onto the surface of a printed circuit board has greatly improved the efficiency and reliability of electronic devices. The JESD-609 Code, also known as e3, certifies that the components used in this process meet the highest standards for environmental sustainability. The HTS Code 8542.39.00.01 further classifies these components as integrated circuits, specifically CMOS technology. The terminal form for these components is BALL, with 574 outputs and inputs each, making it ideal for complex circuit designs. With a speed of 166MHz and powered by the ARM® Cortex®-M3 core processor, this technology is at the forefront of modern electronics.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S150-FCG1152I System On Chip (SoC) applications.
sequence controllers
Medical Pressure
High-end PLC
Avionics
Keyboard
ARM processors
Industrial robot
RISC-V
ARM Cortex M4 microcontroller
Efficient hardware for training of neural networks
M2S150-FCG1152I More Descriptions
M2S150-Fcg1152I 1152 Bga 35X35X2.90Mm Tray Rohs Compliant: Yes |Microchip M2S150-FCG1152I
FPGA SmartFusion2 146124 Cells 166MHz 65nm Technology 1.2V 1152-Pin FBGA
Field Programmable Gate Array, 146124-Cell, CMOS, PBGA1152
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 1152BGA
IC FPGA SOC 150K LUTS 1152FCBGA
FPGA SmartFusion2 146124 Cells 166MHz 65nm Technology 1.2V 1152-Pin FBGA
Field Programmable Gate Array, 146124-Cell, CMOS, PBGA1152
SmartFusion2 SoC FPGA, ARM Cortex-M3, 146KLEs
IC SOC CORTEX-M3 166MHZ 1152BGA
IC FPGA SOC 150K LUTS 1152FCBGA
The three parts on the right have similar specifications to M2S150-FCG1152I.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Terminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusFrequencyBase Part NumberInterfaceCore ArchitectureReach Compliance CodeView Compare
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M2S150-FCG1152I12 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)1152-BBGA, FCBGAYES-40°C~100°C TJTray2015SmartFusion®2e3Active3 (168 Hours)MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B1152574Not Qualified1.26V1.2V1.14V574166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA574FIELD PROGRAMMABLE GATE ARRAYFPGA - 150K Logic Modules146124512KB2.9mm35mm35mmRoHS Compliant------
-
--1152-BBGA, FCBGAYES0°C~85°C TJTray2009SmartFusion®2-Obsolete3 (168 Hours)--Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B1152574Not Qualified1.26V1.2V1.14V574-64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA574FIELD PROGRAMMABLE GATE ARRAYFPGA - 100K Logic Modules99512512KB2.9mm35mm35mmRoHS Compliant166MHzM2S100CAN, Ethernet, I2C, SPI, UART, USART, USBARM-
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)1152-BBGA, FCBGAYES-40°C~100°C TJTray-SmartFusion®2e0Active3 (168 Hours)Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B1152574Not Qualified1.26V1.2V1.14V574166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA574FIELD PROGRAMMABLE GATE ARRAYFPGA - 150K Logic Modules146124512KB2.9mm35mm35mmNon-RoHS Compliant----not_compliant
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)1152-BBGA, FCBGAYES0°C~85°C TJTray2015SmartFusion®2e3Active3 (168 Hours)MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B1152574Not Qualified1.26V1.2V1.14V574166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA574FIELD PROGRAMMABLE GATE ARRAYFPGA - 150K Logic Modules146124512KB2.9mm35mm35mmRoHS Compliant-----
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