M2S010-VFG256I

Microsemi Corporation M2S010-VFG256I

Part Number:
M2S010-VFG256I
Manufacturer:
Microsemi Corporation
Ventron No:
3828042-M2S010-VFG256I
Description:
IC FPGA SOC 10K LUTS
ECAD Model:
Datasheet:
M2S010-VFG256I

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Specifications
Microsemi Corporation M2S010-VFG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S010-VFG256I.
  • Factory Lead Time
    8 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Mount
    Surface Mount
  • Package / Case
    256-LFBGA
  • Number of Pins
    256
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • Terminal Finish
    MATTE TIN
  • Additional Feature
    LG-MIN, WD-MIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of Outputs
    138
  • Qualification Status
    Not Qualified
  • Power Supplies
    1.2V
  • Max Supply Voltage
    1.26V
  • Min Supply Voltage
    1.14V
  • Number of I/O
    138
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 10K Logic Modules
  • Number of Logic Cells
    12084
  • Flash Size
    256KB
  • Height Seated (Max)
    1.56mm
  • Length
    14mm
  • Width
    14mm
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
This component is manufactured by Microsemi Corporation and falls under the category of Embedded - System On Chip (SoC) chips. It is classified under the JESD-609 Code as e3 and is currently in an Active status. The HTS Code for this part is 8542.39.00.01 and it requires a supply voltage of 1.2V. The maximum reflow temperature is not specified for this chip. It has 138 I/O ports and a RAM size of 64KB. The flash size is 256KB and the maximum seated height is 1.56mm. The chip has a width of 14mm.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation
M2S010-VFG256I System On Chip (SoC) applications.

Measurement testers
Apple smart watch
Central alarm system
Published Paper
DC-input BLDC motor drive
Temperature Sensors
Efficient hardware for inference of neural networks
Functional safety for critical applications in the automotive
ARM
Efficient hardware for training of neural networks
M2S010-VFG256I More Descriptions
FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
M2S010-Vfg256I 256 Lfbga 14X14X1.56Mm Tray Rohs Compliant: Yes |Microchip M2S010-VFG256I
M2S Series 400 kb RAM 138 I/O SmartFusion2 SoC FPGA - VFBGA-256
Field Programmable Gate Array, 12084-Cell, CMOS, PBGA256
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 256FBGA
IC SOC CORTEX-M4 180MHZ 100LQFP
Product Comparison
The three parts on the right have similar specifications to M2S010-VFG256I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Mount
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Number of Outputs
    Qualification Status
    Power Supplies
    Max Supply Voltage
    Min Supply Voltage
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Lead Free
    Surface Mount
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of Inputs
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S010-VFG256I
    M2S010-VFG256I
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    Surface Mount
    256-LFBGA
    256
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    256
    MATTE TIN
    LG-MIN, WD-MIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    0.8mm
    NOT SPECIFIED
    138
    Not Qualified
    1.2V
    1.26V
    1.14V
    138
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    12084
    256KB
    1.56mm
    14mm
    14mm
    RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S050T-FGG896I
    8 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    -
    896-BGA
    -
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    896
    MATTE TIN
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    377
    Not Qualified
    1.2V
    -
    -
    377
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    RoHS Compliant
    -
    YES
    S-PBGA-B896
    1.26V
    1.14V
    377
    -
    -
    -
    -
    -
    -
    -
  • M2S090S-1FGG484I
    -
    -
    -
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FPGA - 90K Logic Modules
    -
    512KB
    -
    -
    -
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S090S
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
  • M2S025-1FG484
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    -
    484-BGA
    -
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    484-FPBGA (23x23)
    85°C
    0°C
    166MHz
    M2S025
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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