M2S050T-FGG896I

Microsemi Corporation M2S050T-FGG896I

Part Number:
M2S050T-FGG896I
Manufacturer:
Microsemi Corporation
Ventron No:
4544314-M2S050T-FGG896I
Description:
IC FPGA SOC 50K LUTS
ECAD Model:
Datasheet:
M2S050T-FGG896I

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Specifications
Microsemi Corporation M2S050T-FGG896I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050T-FGG896I.
  • Factory Lead Time
    8 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 2 weeks ago)
  • Package / Case
    896-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    896
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B896
  • Number of Outputs
    377
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    377
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    377
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 50K Logic Modules
  • Number of Logic Cells
    56340
  • Flash Size
    256KB
  • Height Seated (Max)
    2.44mm
  • Length
    31mm
  • Width
    31mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.It has been assigned a package 896-BGA by its manufacturer for this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 50K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 377 inputs and outputs.It is advised to utilize a 1.2V power supply.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.system on a chip benefits from 896 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.There are 377 outputs available on this SoC.This system on chip SoC requires 1.2V power supply at all.There are 377 inputs available on the SoC chip.Logic system on chips consist of 56340 logic cells.A 256KB flash can be seen on it.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
M2S050T-FGG896I System On Chip (SoC) applications.

Level
Apple smart watch
Measurement testers
Embedded systems
Flow Sensors
Healthcare
Optical drive
Robotics
Communication network-on-Chip (cNoC)
Transmitters
M2S050T-FGG896I More Descriptions
M2S050T-Fgg896I 896 Pbga 31X31X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S050T-FGG896I
FPGA SmartFusion2 56340 Cells 166MHz 65nm Technology 1.2V 896-Pin FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 896FBGA
Product Comparison
The three parts on the right have similar specifications to M2S050T-FGG896I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Published
    Pbfree Code
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S050T-FGG896I
    M2S050T-FGG896I
    8 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    896-BGA
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    896
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B896
    377
    Not Qualified
    1.26V
    1.2V
    1.14V
    377
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    377
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S010-TQG144I
    8 Weeks
    IN PRODUCTION (Last Updated: 2 days ago)
    144-LQFP
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    144
    MATTE TIN
    8542.39.00.01
    -
    -
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    NOT SPECIFIED
    S-PQFP-G144
    -
    -
    1.26V
    -
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    -
    256KB
    1.6mm
    20mm
    20mm
    RoHS Compliant
    2015
    yes
    -
    -
    -
    -
    -
    -
    -
  • M2S025-1FG484
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    0°C~85°C TJ
    Tray
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    2009
    -
    484-FPBGA (23x23)
    85°C
    0°C
    166MHz
    M2S025
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
  • M2S025T-1FGG484I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    RoHS Compliant
    2009
    -
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S025T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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