Microsemi Corporation M2S050T-FGG896I
- Part Number:
- M2S050T-FGG896I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 4544314-M2S050T-FGG896I
- Description:
- IC FPGA SOC 50K LUTS
- Datasheet:
- M2S050T-FGG896I
Microsemi Corporation M2S050T-FGG896I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050T-FGG896I.
- Factory Lead Time8 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 2 weeks ago)
- Package / Case896-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations896
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B896
- Number of Outputs377
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O377
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs377
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 50K Logic Modules
- Number of Logic Cells56340
- Flash Size256KB
- Height Seated (Max)2.44mm
- Length31mm
- Width31mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.It has been assigned a package 896-BGA by its manufacturer for this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 50K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 377 inputs and outputs.It is advised to utilize a 1.2V power supply.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.system on a chip benefits from 896 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.There are 377 outputs available on this SoC.This system on chip SoC requires 1.2V power supply at all.There are 377 inputs available on the SoC chip.Logic system on chips consist of 56340 logic cells.A 256KB flash can be seen on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050T-FGG896I System On Chip (SoC) applications.
Level
Apple smart watch
Measurement testers
Embedded systems
Flow Sensors
Healthcare
Optical drive
Robotics
Communication network-on-Chip (cNoC)
Transmitters
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.It has been assigned a package 896-BGA by its manufacturer for this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 50K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 377 inputs and outputs.It is advised to utilize a 1.2V power supply.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.system on a chip benefits from 896 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.There are 377 outputs available on this SoC.This system on chip SoC requires 1.2V power supply at all.There are 377 inputs available on the SoC chip.Logic system on chips consist of 56340 logic cells.A 256KB flash can be seen on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050T-FGG896I System On Chip (SoC) applications.
Level
Apple smart watch
Measurement testers
Embedded systems
Flow Sensors
Healthcare
Optical drive
Robotics
Communication network-on-Chip (cNoC)
Transmitters
M2S050T-FGG896I More Descriptions
M2S050T-Fgg896I 896 Pbga 31X31X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S050T-FGG896I
FPGA SmartFusion2 56340 Cells 166MHz 65nm Technology 1.2V 896-Pin FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 896FBGA
FPGA SmartFusion2 56340 Cells 166MHz 65nm Technology 1.2V 896-Pin FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 896FBGA
The three parts on the right have similar specifications to M2S050T-FGG896I.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPublishedPbfree CodeSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
-
M2S050T-FGG896I8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTraySmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant----------
-
8 WeeksIN PRODUCTION (Last Updated: 2 days ago)144-LQFPYES-40°C~100°C TJTraySmartFusion®2e3Active3 (168 Hours)144MATTE TIN8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G144--1.26V-1.14V84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS Compliant2015yes-------
-
8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-0°C~85°C TJTraySmartFusion®2-Active3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---Non-RoHS Compliant2009-484-FPBGA (23x23)85°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USBARM
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTraySmartFusion®2-Active3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---RoHS Compliant2009-484-FPBGA (23x23)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
02 February 2024
TL431AIDBZR Shunt Regulator Replacements, Working Principle, Typical Characteristics, Performance and Function
Ⅰ. Description of TL431AIDBZRⅡ. How does TL431AIDBZR work?Ⅲ. Typical characteristics of TL431AIDBZRⅣ. Performance of TL431AIDBZRⅤ. Specifications of TL431AIDBZRⅥ. How to adjust the output voltage of TL431AIDBZR?Ⅶ. Absolute maximum... -
02 February 2024
BQ7694003DBTR: Technical Parameters, Applications, Layout Guidelines and More
Ⅰ. Overview of BQ7694003DBTRⅡ. Technical parameters of BQ7694003DBTRⅢ. Functional block diagram of BQ7694003DBTRⅣ. Where is BQ7694003DBTR used?Ⅴ. BQ7694003DBTR layout guidelinesⅥ. How does BQ7694003DBTR achieve the balance and protection... -
18 February 2024
L6599DTR Technical Parameters, Working Principle, Characteristics and L6599DTR vs L6599D
Ⅰ. Introduction to L6599DTRⅡ. Technical parameters of L6599DTRⅢ. Working principle of L6599DTRⅣ. Block diagram of L6599DTRⅤ. What are the characteristics of L6599DTR?Ⅵ. How does the output current protection... -
18 February 2024
LNK364PN Manufacturer, Package, Applications and Specifications
Ⅰ. What is LNK364PN?Ⅱ. Manufacturer of LNK364PNⅢ. Package of LNK364PNⅣ. How to measure the quality of LNK364PN?Ⅴ. Pins and functions of LNK364PNⅥ. Applications of LNK364PNⅦ. Specifications of LNK364PNⅧ....
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.