Microsemi Corporation M2S025T-1FGG484I
- Part Number:
- M2S025T-1FGG484I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 4544260-M2S025T-1FGG484I
- Description:
- IC FPGA SOC 25K LUTS 484FBGA
Microsemi Corporation M2S025T-1FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S025T-1FGG484I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case484-BGA
- Supplier Device Package484-FPBGA (23x23)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Frequency166MHz
- Base Part NumberM2S025T
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O267
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Primary AttributesFPGA - 25K Logic Modules
- Flash Size256KB
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.With 64KB RAM implemented, this SoC chip provides reliable operation.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series number of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.This SoC security combines FPGA - 25K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 267 I/Os.It has a 256KB flash.A search for M2S025T will result in system on chips that have similar specs and purposes.At 166MHz, the wireless SoC works.In terms of core architecture, the SoC meaning relies on ARM.In order for the SoC computing to start, -40°C is just about right.There is a design maximum operating temperature of 100°C for this SoC system on chip.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S025T-1FGG484I System On Chip (SoC) applications.
ARM
Special Issue Editors
Smart appliances
Functional safety for critical applications in the automotive
Communication network-on-Chip (cNoC)
Cyber security for critical applications in the aerospace
Central inverter
Smart appliances
Industrial transport
ARM support modules
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.With 64KB RAM implemented, this SoC chip provides reliable operation.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series number of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.This SoC security combines FPGA - 25K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 267 I/Os.It has a 256KB flash.A search for M2S025T will result in system on chips that have similar specs and purposes.At 166MHz, the wireless SoC works.In terms of core architecture, the SoC meaning relies on ARM.In order for the SoC computing to start, -40°C is just about right.There is a design maximum operating temperature of 100°C for this SoC system on chip.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S025T-1FGG484I System On Chip (SoC) applications.
ARM
Special Issue Editors
Smart appliances
Functional safety for critical applications in the automotive
Communication network-on-Chip (cNoC)
Cyber security for critical applications in the aerospace
Central inverter
Smart appliances
Industrial transport
ARM support modules
M2S025T-1FGG484I More Descriptions
FPGA SmartFusion2 27696 Cells 166MHz 65nm Technology 1.2V 484-Pin FBGA
M2S025T-1Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S025T-1FGG484I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
M2S025T-1Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S025T-1FGG484I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to M2S025T-1FGG484I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitecturePrimary AttributesFlash SizeRoHS StatusSurface MountJESD-609 CodePbfree CodeNumber of TerminationsTerminal FinishHTS CodeTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable Logic TypeHeight Seated (Max)LengthWidthView Compare
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M2S025T-1FGG484I10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA484-FPBGA (23x23)-40°C~100°C TJTray2009SmartFusion®2Active3 (168 Hours)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USB267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 25K Logic Modules256KBRoHS Compliant--------------------
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8 WeeksIN PRODUCTION (Last Updated: 2 days ago)144-LQFP--40°C~100°C TJTray2015SmartFusion®2Active3 (168 Hours)-----84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 10K Logic Modules256KBRoHS CompliantYESe3yes144MATTE TIN8542.39.00.01QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G1441.26V1.14VFIELD PROGRAMMABLE GATE ARRAY1.6mm20mm20mm
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--484-BGA484-FPBGA (23x23)-40°C~100°C TJTray-SmartFusion®2Obsolete3 (168 Hours)100°C-40°C166MHzM2S090SCAN, Ethernet, I2C, SPI, UART, USART, USB267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 90K Logic Modules512KBRoHS Compliant-------------------
-
8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA484-FPBGA (23x23)0°C~85°C TJTray2009SmartFusion®2Active3 (168 Hours)85°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USB267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 25K Logic Modules256KBNon-RoHS Compliant-------------------
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