IRFU5305

Infineon Technologies IRFU5305

Part Number:
IRFU5305
Manufacturer:
Infineon Technologies
Ventron No:
3586858-IRFU5305
Description:
MOSFET P-CH 55V 31A I-PAK
ECAD Model:
Datasheet:
IRFR/U5305

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Specifications
Infineon Technologies IRFU5305 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRFU5305.
  • Mounting Type
    Through Hole
  • Package / Case
    TO-251-3 Short Leads, IPak, TO-251AA
  • Surface Mount
    NO
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~175°C TJ
  • Packaging
    Tube
  • Series
    HEXFET®
  • Published
    2000
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    3
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Additional Feature
    HIGH RELIABILITY
  • Technology
    MOSFET (Metal Oxide)
  • Terminal Position
    SINGLE
  • Peak Reflow Temperature (Cel)
    245
  • Time@Peak Reflow Temperature-Max (s)
    30
  • JESD-30 Code
    R-PSIP-T3
  • Qualification Status
    Not Qualified
  • Number of Elements
    1
  • Configuration
    SINGLE WITH BUILT-IN DIODE
  • Power Dissipation-Max
    110W Tc
  • Operating Mode
    ENHANCEMENT MODE
  • Case Connection
    DRAIN
  • FET Type
    P-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    65m Ω @ 16A, 10V
  • Vgs(th) (Max) @ Id
    4V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    1200pF @ 25V
  • Current - Continuous Drain (Id) @ 25°C
    31A Tc
  • Gate Charge (Qg) (Max) @ Vgs
    63nC @ 10V
  • Drain to Source Voltage (Vdss)
    55V
  • Drive Voltage (Max Rds On,Min Rds On)
    10V
  • Vgs (Max)
    ±20V
  • Drain Current-Max (Abs) (ID)
    31A
  • Drain-source On Resistance-Max
    0.065Ohm
  • Pulsed Drain Current-Max (IDM)
    110A
  • DS Breakdown Voltage-Min
    55V
  • Avalanche Energy Rating (Eas)
    280 mJ
  • RoHS Status
    Non-RoHS Compliant
Description
IRFU5305 Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET? Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications. Surface mounting with vapor phase, infrared, or wave soldering processes is possible with the D-Pak. For through-hole mounting applications, the straight lead version (IRFU series) is used. In normal surface mount applications, power dissipation levels of up to 1.5 watts are conceivable.

IRFU5305 Features
Ultra-Low On-Resistance
Surface Mount (IRFR5305)
Straight Lead (IRFU5305)
Advanced Process Technology
Fast Switching
Fully Avalanche Rated

IRFU5305 Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
Product Comparison
The three parts on the right have similar specifications to IRFU5305.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Transistor Element Material
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    Technology
    Terminal Position
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Qualification Status
    Number of Elements
    Configuration
    Power Dissipation-Max
    Operating Mode
    Case Connection
    FET Type
    Transistor Application
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Input Capacitance (Ciss) (Max) @ Vds
    Current - Continuous Drain (Id) @ 25°C
    Gate Charge (Qg) (Max) @ Vgs
    Drain to Source Voltage (Vdss)
    Drive Voltage (Max Rds On,Min Rds On)
    Vgs (Max)
    Drain Current-Max (Abs) (ID)
    Drain-source On Resistance-Max
    Pulsed Drain Current-Max (IDM)
    DS Breakdown Voltage-Min
    Avalanche Energy Rating (Eas)
    RoHS Status
    Mount
    Number of Pins
    Supplier Device Package
    Termination
    Max Operating Temperature
    Min Operating Temperature
    Power Dissipation
    Turn On Delay Time
    Rise Time
    Fall Time (Typ)
    Turn-Off Delay Time
    Reverse Recovery Time
    Continuous Drain Current (ID)
    Threshold Voltage
    Gate to Source Voltage (Vgs)
    Drain to Source Breakdown Voltage
    Dual Supply Voltage
    Input Capacitance
    Recovery Time
    Drain to Source Resistance
    Rds On Max
    Nominal Vgs
    Height
    Length
    Width
    REACH SVHC
    Radiation Hardening
    Resistance
    Voltage - Rated DC
    Current Rating
    Lead Free
    Subcategory
    View Compare
  • IRFU5305
    IRFU5305
    Through Hole
    TO-251-3 Short Leads, IPak, TO-251AA
    NO
    SILICON
    -55°C~175°C TJ
    Tube
    HEXFET®
    2000
    e0
    Obsolete
    1 (Unlimited)
    3
    EAR99
    Tin/Lead (Sn/Pb)
    HIGH RELIABILITY
    MOSFET (Metal Oxide)
    SINGLE
    245
    30
    R-PSIP-T3
    Not Qualified
    1
    SINGLE WITH BUILT-IN DIODE
    110W Tc
    ENHANCEMENT MODE
    DRAIN
    P-Channel
    SWITCHING
    65m Ω @ 16A, 10V
    4V @ 250μA
    1200pF @ 25V
    31A Tc
    63nC @ 10V
    55V
    10V
    ±20V
    31A
    0.065Ohm
    110A
    55V
    280 mJ
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IRFU2307ZPBF
    Through Hole
    TO-251-3 Short Leads, IPak, TO-251AA
    -
    -
    -55°C~175°C TJ
    Tube
    HEXFET®
    2004
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    -
    -
    -
    1
    -
    110W Tc
    -
    -
    N-Channel
    -
    16mOhm @ 32A, 10V
    4V @ 100μA
    2190pF @ 25V
    42A Tc
    75nC @ 10V
    75V
    10V
    ±20V
    -
    -
    -
    -
    -
    RoHS Compliant
    Through Hole
    3
    IPAK (TO-251)
    Through Hole
    175°C
    -55°C
    110W
    16 ns
    65ns
    29 ns
    44 ns
    31 ns
    53A
    4V
    20V
    75V
    75V
    2.19nF
    47 ns
    16mOhm
    16 mΩ
    4 V
    6.22mm
    6.7056mm
    2.3876mm
    No SVHC
    No
    -
    -
    -
    -
    -
  • IRFU3704PBF
    Through Hole
    TO-251-3 Short Leads, IPak, TO-251AA
    -
    -
    -55°C~175°C TJ
    Tube
    HEXFET®
    2004
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    -
    -
    -
    1
    -
    90W Tc
    -
    -
    N-Channel
    -
    9.5mOhm @ 15A, 10V
    3V @ 250μA
    1996pF @ 10V
    75A Tc
    19nC @ 4.5V
    20V
    10V
    ±20V
    -
    -
    -
    -
    -
    RoHS Compliant
    Through Hole
    4
    IPAK (TO-251)
    -
    175°C
    -55°C
    90W
    98 ns
    98ns
    -
    5 ns
    -
    62A
    3V
    20V
    20V
    20V
    1.996nF
    -
    14mOhm
    9.5 mΩ
    3 V
    -
    -
    -
    No SVHC
    -
    9.5Ohm
    20V
    62A
    Lead Free
    -
  • IRFU3709
    Through Hole
    TO-251-3 Short Leads, IPak, TO-251AA
    NO
    SILICON
    -55°C~150°C TJ
    Tube
    HEXFET®
    2001
    e3
    Obsolete
    1 (Unlimited)
    3
    EAR99
    MATTE TIN OVER NICKEL
    -
    MOSFET (Metal Oxide)
    SINGLE
    260
    30
    R-PSIP-T3
    Not Qualified
    1
    SINGLE WITH BUILT-IN DIODE
    120W Tc
    ENHANCEMENT MODE
    DRAIN
    N-Channel
    -
    9m Ω @ 15A, 10V
    3V @ 250μA
    2672pF @ 16V
    90A Tc
    41nC @ 4.5V
    30V
    4.5V 10V
    ±20V
    86A
    0.0065Ohm
    340A
    30V
    100 mJ
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    FET General Purpose Power
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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