Infineon Technologies IRFHM8326TRPBF
- Part Number:
- IRFHM8326TRPBF
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 2482516-IRFHM8326TRPBF
- Description:
- MOSFET N-CH 30V 25A PQFN
- Datasheet:
- IRFHM8326TRPBF
Infineon Technologies IRFHM8326TRPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRFHM8326TRPBF.
- Factory Lead Time12 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case8-PowerTDFN
- Number of Pins8
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~150°C TJ
- PackagingCut Tape (CT)
- SeriesHEXFET®
- Published2013
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations5
- ECCN CodeEAR99
- SubcategoryFET General Purpose Power
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionDUAL
- Terminal FormFLAT
- JESD-30 CodeS-PDSO-F5
- Number of Elements1
- ConfigurationSINGLE WITH BUILT-IN DIODE
- Power Dissipation-Max2.8W Ta 37W Tc
- Operating ModeENHANCEMENT MODE
- Power Dissipation2.8W
- Case ConnectionDRAIN
- Turn On Delay Time12 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs4.7m Ω @ 20A, 10V
- Vgs(th) (Max) @ Id2.2V @ 50μA
- Input Capacitance (Ciss) (Max) @ Vds2496pF @ 10V
- Current - Continuous Drain (Id) @ 25°C19A Ta
- Gate Charge (Qg) (Max) @ Vgs39nC @ 10V
- Rise Time35ns
- Drive Voltage (Max Rds On,Min Rds On)4.5V 10V
- Vgs (Max)±20V
- Fall Time (Typ)12 ns
- Turn-Off Delay Time18 ns
- Continuous Drain Current (ID)19A
- Threshold Voltage1.7V
- Gate to Source Voltage (Vgs)20V
- Drain Current-Max (Abs) (ID)70A
- Drain-source On Resistance-Max0.0067Ohm
- Drain to Source Breakdown Voltage30V
- REACH SVHCNo SVHC
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
Description
The IRFHM8326TRPBF is a HEXFET? Power MOSFET. A special kind of metal-oxide-semiconductor field-effect transistor (MOSFET) made to handle high power levels is known as a power MOSFET. High switching speed and good efficiency at low voltages are its key benefits over other power semiconductor devices like insulated-gate bipolar transistors (IGBT) or thyristors. It has an easy-to-drive gate that it shares with the IGBT. They occasionally have low gain to the point that a larger gate voltage is required than the control voltage.
Features
Continuous drain current (ID)
Safe operating area (SOA)
Gate charge (QG)
Threshold Voltage (VGS(th))
Blocking voltage (BVDSS)
Maximum single pulse avalanche energy (EAS)
On-resistance (RDS(ON))
Maximum junction temperature (TJ(max))
Applications
Charge and Discharge Switch for Notebook PC Battery Application
System/Load Switch
Synchronous MOSFET for Buck Converters
Automotive applications
Small motor control
The IRFHM8326TRPBF is a HEXFET? Power MOSFET. A special kind of metal-oxide-semiconductor field-effect transistor (MOSFET) made to handle high power levels is known as a power MOSFET. High switching speed and good efficiency at low voltages are its key benefits over other power semiconductor devices like insulated-gate bipolar transistors (IGBT) or thyristors. It has an easy-to-drive gate that it shares with the IGBT. They occasionally have low gain to the point that a larger gate voltage is required than the control voltage.
Features
Continuous drain current (ID)
Safe operating area (SOA)
Gate charge (QG)
Threshold Voltage (VGS(th))
Blocking voltage (BVDSS)
Maximum single pulse avalanche energy (EAS)
On-resistance (RDS(ON))
Maximum junction temperature (TJ(max))
Applications
Charge and Discharge Switch for Notebook PC Battery Application
System/Load Switch
Synchronous MOSFET for Buck Converters
Automotive applications
Small motor control
IRFHM8326TRPBF More Descriptions
30V Single N-Channel HEXFET Power MOSFET in a 3.3mm X 3.3mm PQFN package, PQFN 3.3X3.3 8L, RoHSInfineon SCT
Single N-Channel 30 V 4.7 mOhm 39 nC HEXFET® Power Mosfet - PQFN 3.3 x 3.3 mm
Trans MOSFET N-CH 30V 19A 8-Pin PQFN T/R - Tape and Reel
Benefits: RoHS Compliant; Low Thermal Resistance to PCB (less than 3.4C/W); Low Profile (less than 1.05 mm); Industry-Standard Pinout; Compatible with Existing Surface Mount Techniques; Qualified Industrial; Qualified MSL1 | Target Applications: Battery Protection; Isolated Primary Side MOSFETs; Isolated Secondary Side SyncRec MOSFETs; Load Switch High Side; Load Switch Low Side; Point of Load ControlFET
Single N-Channel 30 V 4.7 mOhm 39 nC HEXFET® Power Mosfet - PQFN 3.3 x 3.3 mm
Trans MOSFET N-CH 30V 19A 8-Pin PQFN T/R - Tape and Reel
Benefits: RoHS Compliant; Low Thermal Resistance to PCB (less than 3.4C/W); Low Profile (less than 1.05 mm); Industry-Standard Pinout; Compatible with Existing Surface Mount Techniques; Qualified Industrial; Qualified MSL1 | Target Applications: Battery Protection; Isolated Primary Side MOSFETs; Isolated Secondary Side SyncRec MOSFETs; Load Switch High Side; Load Switch Low Side; Point of Load ControlFET
The three parts on the right have similar specifications to IRFHM8326TRPBF.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeSubcategoryTechnologyTerminal PositionTerminal FormJESD-30 CodeNumber of ElementsConfigurationPower Dissipation-MaxOperating ModePower DissipationCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Threshold VoltageGate to Source Voltage (Vgs)Drain Current-Max (Abs) (ID)Drain-source On Resistance-MaxDrain to Source Breakdown VoltageREACH SVHCRadiation HardeningRoHS StatusLead FreeSupplier Device PackageMax Operating TemperatureMin Operating TemperatureMax Power DissipationDrain to Source Voltage (Vdss)Input CapacitanceRecovery TimeDrain to Source ResistanceRds On MaxNominal VgsHeightLengthWidthElement ConfigurationResistanceView Compare
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IRFHM8326TRPBF12 WeeksSurface MountSurface Mount8-PowerTDFN8SILICON-55°C~150°C TJCut Tape (CT)HEXFET®2013Active1 (Unlimited)5EAR99FET General Purpose PowerMOSFET (Metal Oxide)DUALFLATS-PDSO-F51SINGLE WITH BUILT-IN DIODE2.8W Ta 37W TcENHANCEMENT MODE2.8WDRAIN12 nsN-ChannelSWITCHING4.7m Ω @ 20A, 10V2.2V @ 50μA2496pF @ 10V19A Ta39nC @ 10V35ns4.5V 10V±20V12 ns18 ns19A1.7V20V70A0.0067Ohm30VNo SVHCNoROHS3 CompliantLead Free----------------
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-Surface MountSurface Mount8-PowerVDFN8--Cut Tape (CT)HEXFET®2013Obsolete1 (Unlimited)---MOSFET (Metal Oxide)---1---250W-23 nsN-Channel-1.4mOhm @ 50A, 10V2.35V @ 150μA6115pF @ 13V40A Ta 100A Tc83nC @ 10V72ns--24 ns23 ns100A1.8V20V--25VNo SVHCNoRoHS Compliant-8-PQFN (5x6)150°C-55°C3.6W25V706pF41 ns2.2mOhm1.4 mΩ1.8 V838.2μm5.9944mm5mm--
-
-Surface MountSurface Mount8-PowerVDFN8--Cut Tape (CT)HEXFET®2010Obsolete1 (Unlimited)---MOSFET (Metal Oxide)---1---100W-6.4 nsN-Channel-6.7mOhm @ 50A, 10V4V @ 100μA2490pF @ 25V16A Ta 89A Tc60nC @ 10V11ns--8.2 ns22 ns89A4V20V--60VNo SVHCNoRoHS Compliant-8-PQFN (5x6)150°C-55°C3.6W60V2.49nF39 ns6.7mOhm6.7 mΩ4 V838.2μm5.9944mm5mmSingle-
-
-Surface MountSurface Mount8-VQFN Exposed Pad8--Cut Tape (CT)HEXFET®2011Obsolete1 (Unlimited)---MOSFET (Metal Oxide)---1---3.6W-8.4 nsN-Channel-4.3mOhm @ 50A, 10V4V @ 100μA2460pF @ 25V22A Ta 100A Tc65nC @ 10V14ns--8.3 ns18 ns22A4V20V--40VNo SVHCNoRoHS CompliantLead FreePQFN (5x6)150°C-55°C3.6W40V2.46nF45 ns4.3mOhm4.3 mΩ4 V900μm6mm5mmSingle4.3MOhm
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