Infineon Technologies IRF6609TRPBF
- Part Number:
- IRF6609TRPBF
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 2492968-IRF6609TRPBF
- Description:
- MOSFET N-CH 20V 31A DIRECTFET
- Datasheet:
- IRF6609TRPBF
Infineon Technologies IRF6609TRPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF6609TRPBF.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / CaseDirectFET™ Isometric MT
- Number of Pins5
- Transistor Element MaterialSILICON
- Operating Temperature-40°C~150°C TJ
- PackagingTape & Reel (TR)
- SeriesHEXFET®
- Published2006
- JESD-609 Codee1
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations3
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeatureLOW CONDUCTION LOSS
- Voltage - Rated DC20V
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Current Rating31A
- Time@Peak Reflow Temperature-Max (s)30
- JESD-30 CodeR-XBCC-N3
- Number of Elements1
- ConfigurationSINGLE WITH BUILT-IN DIODE
- Power Dissipation-Max1.8W Ta 89W Tc
- Operating ModeENHANCEMENT MODE
- Power Dissipation89W
- Case ConnectionDRAIN
- Turn On Delay Time24 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs2m Ω @ 31A, 10V
- Vgs(th) (Max) @ Id2.45V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds6290pF @ 10V
- Current - Continuous Drain (Id) @ 25°C31A Ta 150A Tc
- Gate Charge (Qg) (Max) @ Vgs69nC @ 4.5V
- Rise Time95ns
- Drive Voltage (Max Rds On,Min Rds On)4.5V 10V
- Vgs (Max)±20V
- Fall Time (Typ)9.8 ns
- Turn-Off Delay Time26 ns
- Continuous Drain Current (ID)150mA
- Gate to Source Voltage (Vgs)20V
- Drain-source On Resistance-Max0.002Ohm
- Drain to Source Breakdown Voltage20V
- Avalanche Energy Rating (Eas)240 mJ
- Height506μm
- Length6.35mm
- Width5.05mm
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
- Lead FreeLead Free
IRF6609TRPBF Overview
This type of breakdown is known as "avalanche breakdown", and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 240 mJ.The maximum input capacitance of this device is 6290pF @ 10V, because the input capacitance of an op amp is defined as the difference between the input terminals with one input grounded.Continuous drain current (ID) is the maximum continuous current (ID) the device can conduct, and it is 150mA.When VGS=20V, and ID flows to VDS at 20VVDS, the drain-source breakdown voltage is 20V in this device.Before drain current conduction can begin, the device's turn-off delay time must be charged up to full capacitance. This value is 26 ns.During device turn-on, the input capacitance must be charged for a period of time before drain current conduction can begin, so its delay time is 24 ns seconds.Single MOSFETs transistor is the voltage across the gate-source terminal of a transistor that determines the gate-source voltage, VGS.Using drive voltage (4.5V 10V), this device helps reduce its power consumption.
IRF6609TRPBF Features
the avalanche energy rating (Eas) is 240 mJ
a continuous drain current (ID) of 150mA
a drain-to-source breakdown voltage of 20V voltage
the turn-off delay time is 26 ns
IRF6609TRPBF Applications
There are a lot of Infineon Technologies
IRF6609TRPBF applications of single MOSFETs transistors.
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
This type of breakdown is known as "avalanche breakdown", and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 240 mJ.The maximum input capacitance of this device is 6290pF @ 10V, because the input capacitance of an op amp is defined as the difference between the input terminals with one input grounded.Continuous drain current (ID) is the maximum continuous current (ID) the device can conduct, and it is 150mA.When VGS=20V, and ID flows to VDS at 20VVDS, the drain-source breakdown voltage is 20V in this device.Before drain current conduction can begin, the device's turn-off delay time must be charged up to full capacitance. This value is 26 ns.During device turn-on, the input capacitance must be charged for a period of time before drain current conduction can begin, so its delay time is 24 ns seconds.Single MOSFETs transistor is the voltage across the gate-source terminal of a transistor that determines the gate-source voltage, VGS.Using drive voltage (4.5V 10V), this device helps reduce its power consumption.
IRF6609TRPBF Features
the avalanche energy rating (Eas) is 240 mJ
a continuous drain current (ID) of 150mA
a drain-to-source breakdown voltage of 20V voltage
the turn-off delay time is 26 ns
IRF6609TRPBF Applications
There are a lot of Infineon Technologies
IRF6609TRPBF applications of single MOSFETs transistors.
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
IRF6609TRPBF More Descriptions
Single N-Channel 20 V 2.6 mOhm 69 nC HEXFET® Power Mosfet - DirectFET®
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Drain Source Voltage, Vds:20V; Continuous Drain Current, Id:25A; On Resistance, Rds(on):2mohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:DirectFET MT ;RoHS Compliant: Yes
A 20V N-channel HEXFET Power MOSFET with 20 volt gate in the DirectFET MT package rated at 150 amperes optimized with low on resistance for applications such as active ORing. Shipped in Tape and Reel only. Part is not available in bulk, TR is implied in
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Drain Source Voltage, Vds:20V; Continuous Drain Current, Id:25A; On Resistance, Rds(on):2mohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:DirectFET MT ;RoHS Compliant: Yes
A 20V N-channel HEXFET Power MOSFET with 20 volt gate in the DirectFET MT package rated at 150 amperes optimized with low on resistance for applications such as active ORing. Shipped in Tape and Reel only. Part is not available in bulk, TR is implied in
The three parts on the right have similar specifications to IRF6609TRPBF.
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ImagePart NumberManufacturerMountMounting TypePackage / CaseNumber of PinsTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureVoltage - Rated DCTechnologyTerminal PositionPeak Reflow Temperature (Cel)Current RatingTime@Peak Reflow Temperature-Max (s)JESD-30 CodeNumber of ElementsConfigurationPower Dissipation-MaxOperating ModePower DissipationCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Gate to Source Voltage (Vgs)Drain-source On Resistance-MaxDrain to Source Breakdown VoltageAvalanche Energy Rating (Eas)HeightLengthWidthRadiation HardeningRoHS StatusLead FreeDrain to Source Voltage (Vdss)Supplier Device PackageInput CapacitanceRds On MaxView Compare
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IRF6609TRPBFSurface MountSurface MountDirectFET™ Isometric MT5SILICON-40°C~150°C TJTape & Reel (TR)HEXFET®2006e1Obsolete1 (Unlimited)3EAR99Tin/Silver/Copper (Sn/Ag/Cu)LOW CONDUCTION LOSS20VMOSFET (Metal Oxide)BOTTOM26031A30R-XBCC-N31SINGLE WITH BUILT-IN DIODE1.8W Ta 89W TcENHANCEMENT MODE89WDRAIN24 nsN-ChannelSWITCHING2m Ω @ 31A, 10V2.45V @ 250μA6290pF @ 10V31A Ta 150A Tc69nC @ 4.5V95ns4.5V 10V±20V9.8 ns26 ns150mA20V0.002Ohm20V240 mJ506μm6.35mm5.05mmNoRoHS CompliantLead Free-----
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-Through HoleTO-262-3 Long Leads, I2Pak, TO-262AA---TubeHEXFET®1998-Obsolete1 (Unlimited)-----MOSFET (Metal Oxide)-------3.8W Ta 110W Tc----P-Channel-290m Ω @ 6.6A, 10V4V @ 250μA860pF @ 25V13A Tc66nC @ 10V-10V±20V-----------Non-RoHS Compliant-150V---
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Through HoleThrough HoleTO-262-3 Long Leads, I2Pak, TO-262AA3--55°C~150°C TJTube-2016-Obsolete1 (Unlimited)-----MOSFET (Metal Oxide)-------3.1W Ta 130W Tc----N-Channel-180mOhm @ 11A, 10V4V @ 250μA1300pF @ 25V18A Tc70nC @ 10V-10V±20V--18A--------Non-RoHS Compliant-200VI2PAK1.3nF180 mΩ
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Surface MountSurface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB---55°C~150°C TJTape & Reel (TR)-2016-Obsolete1 (Unlimited)-----MOSFET (Metal Oxide)-------3.1W Ta 74W Tc----N-Channel-450mOhm @ 5.1A, 10V4V @ 250μA770pF @ 25V8.1A Tc41nC @ 10V-10V±20V--8.1A--------Non-RoHS Compliant-250VD2PAK770pF450 mΩ
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