Infineon Technologies IRF630NS
- Part Number:
- IRF630NS
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 3071584-IRF630NS
- Description:
- MOSFET N-CH 200V 9.3A D2PAK
- Datasheet:
- IRF630N(S,L)
Infineon Technologies IRF630NS technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF630NS.
- Mounting TypeSurface Mount
- Package / CaseTO-263-3, D2Pak (2 Leads Tab), TO-263AB
- Surface MountYES
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~175°C TJ
- PackagingTube
- SeriesHEXFET®
- Published2004
- JESD-609 Codee0
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations2
- ECCN CodeEAR99
- Terminal FinishTin/Lead (Sn/Pb)
- Additional FeatureAVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionSINGLE
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)225
- Time@Peak Reflow Temperature-Max (s)30
- JESD-30 CodeR-PSSO-G2
- Qualification StatusNot Qualified
- Number of Elements1
- ConfigurationSINGLE WITH BUILT-IN DIODE
- Power Dissipation-Max82W Tc
- Operating ModeENHANCEMENT MODE
- Case ConnectionDRAIN
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs300m Ω @ 5.4A, 10V
- Vgs(th) (Max) @ Id4V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds575pF @ 25V
- Current - Continuous Drain (Id) @ 25°C9.3A Tc
- Gate Charge (Qg) (Max) @ Vgs35nC @ 10V
- Drain to Source Voltage (Vdss)200V
- Drive Voltage (Max Rds On,Min Rds On)10V
- Vgs (Max)±20V
- Drain Current-Max (Abs) (ID)9.3A
- Drain-source On Resistance-Max0.3Ohm
- Pulsed Drain Current-Max (IDM)37A
- DS Breakdown Voltage-Min200V
- Avalanche Energy Rating (Eas)94 mJ
- RoHS StatusNon-RoHS Compliant
IRF630NS Description
The IRF630NSPBF is a HEXFET? fifth generation single N-channel Power MOSFET utilizing advanced processing techniques to achieve extremely low ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design provides an extremely efficient and reliable operation. The surface-mount power package is capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible ON resistance in any existing surface-mount package. The Infineon IRF630NSPBF is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2W in a typical surface-mount application.
IRF630NS Features
Advanced process technology
Dynamic dV/dt rating
Fully avalanche rating
Ease of paralleling
Simple drive requirements
IRF630NS Applications
DC motor drive
High-efficiency synchronous rectification in SMPS
Uninterruptible power supply
High-speed power switching
Hard switched and high-frequency circuits
The IRF630NSPBF is a HEXFET? fifth generation single N-channel Power MOSFET utilizing advanced processing techniques to achieve extremely low ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design provides an extremely efficient and reliable operation. The surface-mount power package is capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible ON resistance in any existing surface-mount package. The Infineon IRF630NSPBF is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2W in a typical surface-mount application.
IRF630NS Features
Advanced process technology
Dynamic dV/dt rating
Fully avalanche rating
Ease of paralleling
Simple drive requirements
IRF630NS Applications
DC motor drive
High-efficiency synchronous rectification in SMPS
Uninterruptible power supply
High-speed power switching
Hard switched and high-frequency circuits
The three parts on the right have similar specifications to IRF630NS.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)JESD-30 CodeQualification StatusNumber of ElementsConfigurationPower Dissipation-MaxOperating ModeCase ConnectionFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsDrain to Source Voltage (Vdss)Drive Voltage (Max Rds On,Min Rds On)Vgs (Max)Drain Current-Max (Abs) (ID)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)DS Breakdown Voltage-MinAvalanche Energy Rating (Eas)RoHS StatusSupplier Device PackageMountContinuous Drain Current (ID)Input CapacitanceRds On MaxWeightMax Operating TemperatureMin Operating TemperatureNumber of ChannelsElement ConfigurationTurn On Delay TimeRise TimeFall Time (Typ)Turn-Off Delay TimeGate to Source Voltage (Vgs)Drain to Source ResistanceHeightLengthWidthView Compare
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IRF630NSSurface MountTO-263-3, D2Pak (2 Leads Tab), TO-263ABYESSILICON-55°C~175°C TJTubeHEXFET®2004e0Obsolete1 (Unlimited)2EAR99Tin/Lead (Sn/Pb)AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCEMOSFET (Metal Oxide)SINGLEGULL WING22530R-PSSO-G2Not Qualified1SINGLE WITH BUILT-IN DIODE82W TcENHANCEMENT MODEDRAINN-ChannelSWITCHING300m Ω @ 5.4A, 10V4V @ 250μA575pF @ 25V9.3A Tc35nC @ 10V200V10V±20V9.3A0.3Ohm37A200V94 mJNon-RoHS Compliant--------------------
-
Through HoleTO-262-3 Long Leads, I2Pak, TO-262AA---55°C~175°C TJTubeHEXFET®2004-Obsolete1 (Unlimited)----MOSFET (Metal Oxide)--------82W Tc--N-Channel-300mOhm @ 5.4A, 10V4V @ 250μA575pF @ 25V9.3A Tc35nC @ 10V200V10V±20V-----Non-RoHS CompliantTO-262------------------
-
Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB---55°C~150°C TJTape & Reel (TR)-2016-Obsolete1 (Unlimited)----MOSFET (Metal Oxide)--------3.1W Ta 74W Tc--N-Channel-450mOhm @ 5.1A, 10V4V @ 250μA770pF @ 25V8.1A Tc41nC @ 10V250V10V±20V-----Non-RoHS CompliantD2PAKSurface Mount8.1A770pF450 mΩ--------------
-
Through HoleTO-262-3 Long Leads, I2Pak, TO-262AA---55°C~175°C TJTube-2009-Obsolete1 (Unlimited)----MOSFET (Metal Oxide)--------3.8W Ta 88W Tc--N-Channel-435mOhm @ 4.8A, 10V4V @ 250μA620pF @ 25V8A Tc34nC @ 10V250V10V±20V-----ROHS3 CompliantI2PAKThrough Hole8A620pF435 mΩ2.387001g175°C-55°C1Single8.4 ns16ns15 ns28 ns20V435mOhm9.65mm10.67mm4.83mm
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