IRF6217TRPBF

Infineon Technologies IRF6217TRPBF

Part Number:
IRF6217TRPBF
Manufacturer:
Infineon Technologies
Ventron No:
3070337-IRF6217TRPBF
Description:
MOSFET P-CH 150V 0.7A 8-SOIC
ECAD Model:
Datasheet:
IRF6217TRPBF

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Specifications
Infineon Technologies IRF6217TRPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF6217TRPBF.
  • Factory Lead Time
    14 Weeks
  • Contact Plating
    Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154, 3.90mm Width)
  • Number of Pins
    8
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~150°C TJ
  • Packaging
    Tape & Reel (TR)
  • Series
    HEXFET®
  • Published
    2002
  • JESD-609 Code
    e3
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Technology
    MOSFET (Metal Oxide)
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Number of Elements
    1
  • Power Dissipation-Max
    2.5W Ta
  • Element Configuration
    Single
  • Operating Mode
    ENHANCEMENT MODE
  • Power Dissipation
    2.5W
  • Turn On Delay Time
    12 ns
  • FET Type
    P-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    2.4 Ω @ 420mA, 10V
  • Vgs(th) (Max) @ Id
    5V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    150pF @ 25V
  • Current - Continuous Drain (Id) @ 25°C
    700mA Ta
  • Gate Charge (Qg) (Max) @ Vgs
    9nC @ 10V
  • Rise Time
    7.2ns
  • Drain to Source Voltage (Vdss)
    150V
  • Drive Voltage (Max Rds On,Min Rds On)
    10V
  • Vgs (Max)
    ±20V
  • Fall Time (Typ)
    16 ns
  • Turn-Off Delay Time
    14 ns
  • Continuous Drain Current (ID)
    -700mA
  • Threshold Voltage
    -5V
  • Gate to Source Voltage (Vgs)
    20V
  • Drain Current-Max (Abs) (ID)
    0.7A
  • Drain to Source Breakdown Voltage
    -150V
  • Nominal Vgs
    20 V
  • Height
    1.4986mm
  • Length
    4.9784mm
  • Width
    3.9878mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
Description
The IRF6217TRPBF is a HEXFET? Power MOSFET. Due to its low gate drive power, quick switching speed, simple advanced paralleling capability, wide bandwidth, robustness, easy drive, simple biasing, ease of application, and ease of maintenance, the power MOSFET is the most widely used power semiconductor device in the world.

Features
Fully Characterized Capacitance Including Effective COSS to Simplify Design
Fully Characterized Avalanche Voltage and Current 
Low Gate to Drain Charge to Reduce Switching Losses
On-resistance (RDS(ON))
Maximum junction temperature (TJ(max))

Applications
Reset Switch for Active Clamp Reset DC to DC converters
Lead-Free
Small motor control
Solar inverters
Automotive applications
IRF6217TRPBF More Descriptions
Single P-Channel 150 V 2.4 Ohm 9 nC HEXFET® Power Mosfet - SOIC-8
IRF6217TRPBF,MOSFET, P-CHANNEL , -150V, -0.7A, 2400 MOHM, 6
Benefits: RoHS Compliant; Low RDS(on); Industry-leading quality; Dynamic dv/dt Rating; Fast Switching; Fully Avalanche Rated; 175C Operating Temperature; P-Channel MOSFET
MOSFET Transistor; Transistor Polarity:P; MOSFET Transistor; Transistor Polarity:P Channel; Continuous Drain Current Id:-700mA; Drain Source Voltage Vds:-150V; On Resistance Rds(on):2.4ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:20V; Power Dissipation Pd:2.5W
Product Comparison
The three parts on the right have similar specifications to IRF6217TRPBF.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Transistor Element Material
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Number of Elements
    Power Dissipation-Max
    Element Configuration
    Operating Mode
    Power Dissipation
    Turn On Delay Time
    FET Type
    Transistor Application
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Input Capacitance (Ciss) (Max) @ Vds
    Current - Continuous Drain (Id) @ 25°C
    Gate Charge (Qg) (Max) @ Vgs
    Rise Time
    Drain to Source Voltage (Vdss)
    Drive Voltage (Max Rds On,Min Rds On)
    Vgs (Max)
    Fall Time (Typ)
    Turn-Off Delay Time
    Continuous Drain Current (ID)
    Threshold Voltage
    Gate to Source Voltage (Vgs)
    Drain Current-Max (Abs) (ID)
    Drain to Source Breakdown Voltage
    Nominal Vgs
    Height
    Length
    Width
    REACH SVHC
    Radiation Hardening
    RoHS Status
    Lead Free
    Supplier Device Package
    Input Capacitance
    Rds On Max
    Weight
    Max Operating Temperature
    Min Operating Temperature
    Number of Channels
    Drain to Source Resistance
    View Compare
  • IRF6217TRPBF
    IRF6217TRPBF
    14 Weeks
    Tin
    Surface Mount
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    8
    SILICON
    -55°C~150°C TJ
    Tape & Reel (TR)
    HEXFET®
    2002
    e3
    Not For New Designs
    1 (Unlimited)
    8
    EAR99
    MOSFET (Metal Oxide)
    DUAL
    GULL WING
    260
    30
    1
    2.5W Ta
    Single
    ENHANCEMENT MODE
    2.5W
    12 ns
    P-Channel
    SWITCHING
    2.4 Ω @ 420mA, 10V
    5V @ 250μA
    150pF @ 25V
    700mA Ta
    9nC @ 10V
    7.2ns
    150V
    10V
    ±20V
    16 ns
    14 ns
    -700mA
    -5V
    20V
    0.7A
    -150V
    20 V
    1.4986mm
    4.9784mm
    3.9878mm
    No SVHC
    No
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IRF630NL
    -
    -
    -
    Through Hole
    TO-262-3 Long Leads, I2Pak, TO-262AA
    -
    -
    -55°C~175°C TJ
    Tube
    HEXFET®
    2004
    -
    Obsolete
    1 (Unlimited)
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    -
    -
    -
    82W Tc
    -
    -
    -
    -
    N-Channel
    -
    300mOhm @ 5.4A, 10V
    4V @ 250μA
    575pF @ 25V
    9.3A Tc
    35nC @ 10V
    -
    200V
    10V
    ±20V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    TO-262
    -
    -
    -
    -
    -
    -
    -
  • IRF640L
    -
    -
    Through Hole
    Through Hole
    TO-262-3 Long Leads, I2Pak, TO-262AA
    3
    -
    -55°C~150°C TJ
    Tube
    -
    2016
    -
    Obsolete
    1 (Unlimited)
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    -
    -
    -
    3.1W Ta 130W Tc
    -
    -
    -
    -
    N-Channel
    -
    180mOhm @ 11A, 10V
    4V @ 250μA
    1300pF @ 25V
    18A Tc
    70nC @ 10V
    -
    200V
    10V
    ±20V
    -
    -
    18A
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    I2PAK
    1.3nF
    180 mΩ
    -
    -
    -
    -
    -
  • IRF634NLPBF
    -
    -
    Through Hole
    Through Hole
    TO-262-3 Long Leads, I2Pak, TO-262AA
    -
    -
    -55°C~175°C TJ
    Tube
    -
    2009
    -
    Obsolete
    1 (Unlimited)
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    -
    -
    -
    3.8W Ta 88W Tc
    Single
    -
    -
    8.4 ns
    N-Channel
    -
    435mOhm @ 4.8A, 10V
    4V @ 250μA
    620pF @ 25V
    8A Tc
    34nC @ 10V
    16ns
    250V
    10V
    ±20V
    15 ns
    28 ns
    8A
    -
    20V
    -
    -
    -
    9.65mm
    10.67mm
    4.83mm
    -
    -
    ROHS3 Compliant
    -
    I2PAK
    620pF
    435 mΩ
    2.387001g
    175°C
    -55°C
    1
    435mOhm
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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