Macronix MX30UF2GE8AB-XKI
- Part Number:
- MX30UF2GE8AB-XKI
- Manufacturer:
- Macronix
- Ventron No:
- 7372460-MX30UF2GE8AB-XKI
- Description:
- Memory IC 11mm mm
- Datasheet:
- MX30UF2GE8AB-XKI
Macronix MX30UF2GE8AB-XKI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF2GE8AB-XKI.
- Factory Lead Time8 Weeks
- Surface MountYES
- PackagingTray
- Part StatusActive
- Number of Terminations63
- ECCN Code3A991.B.1.A
- HTS Code8542.32.00.51
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)40
- JESD-30 CodeR-PBGA-B63
- Operating Temperature (Max)85°C
- Operating Temperature (Min)-40°C
- Supply Voltage-Max (Vsup)1.95V
- Temperature GradeINDUSTRIAL
- Supply Voltage-Min (Vsup)1.7V
- Operating ModeASYNCHRONOUS
- Organization256MX8
- Memory Width8
- Memory Density2147483648 bit
- Parallel/SerialPARALLEL
- Memory IC TypeFLASH
- Programming Voltage1.8V
- Length11mm
- Height Seated (Max)1mm
- Width9mm
- RoHS StatusRoHS Compliant
MX30UF2GE8AB-XKI Overview
In addition, memory ics is available in a Tray case as well. On the chip, there are 63 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.8V. There is a need for a programming voltage of 1.8V in order to modify the state of some nonvolatile memory arrays. This chip has the memory IC type FLASH. Only use it above 85°C. The part is designed to operate at a temperature of -40°C, in any other case, it would malfunction. It's a NAND TYPE device.
MX30UF2GE8AB-XKI Features
MX30UF2GE8AB-XKI Applications
There are a lot of Macronix
MX30UF2GE8AB-XKI Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
In addition, memory ics is available in a Tray case as well. On the chip, there are 63 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.8V. There is a need for a programming voltage of 1.8V in order to modify the state of some nonvolatile memory arrays. This chip has the memory IC type FLASH. Only use it above 85°C. The part is designed to operate at a temperature of -40°C, in any other case, it would malfunction. It's a NAND TYPE device.
MX30UF2GE8AB-XKI Features
MX30UF2GE8AB-XKI Applications
There are a lot of Macronix
MX30UF2GE8AB-XKI Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
MX30UF2GE8AB-XKI More Descriptions
SLC NAND Flash Parallel 1.8V 2Gbit 256M x 8bit 63-Pin VFBGA
IC FLASH 2GBIT PARALLEL 63VFBGA
IC FLASH 2GBIT PARALLEL 63VFBGA
The three parts on the right have similar specifications to MX30UF2GE8AB-XKI.
-
ImagePart NumberManufacturerFactory Lead TimeSurface MountPackagingPart StatusNumber of TerminationsECCN CodeHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeOperating Temperature (Max)Operating Temperature (Min)Supply Voltage-Max (Vsup)Temperature GradeSupply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityParallel/SerialMemory IC TypeProgramming VoltageLengthHeight Seated (Max)WidthRoHS StatusMounting TypePackage / CaseOperating TemperatureSeriesMoisture Sensitivity Level (MSL)Voltage - SupplyMemory SizeMemory TypeAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageJESD-609 CodeTerminal FinishView Compare
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MX30UF2GE8AB-XKI8 WeeksYESTrayActive633A991.B.1.A8542.32.00.51CMOSBOTTOMBALL26011.8V0.8mm40R-PBGA-B6385°C-40°C1.95VINDUSTRIAL1.7VASYNCHRONOUS256MX882147483648 bitPARALLELFLASH1.8V11mm1mm9mmRoHS Compliant---------------
-
8 WeeksYESTape & Reel (TR)Active63--FLASH - NAND (SLC)BOTTOM--11.8V0.8mm-R-PBGA-B63--1.95V-1.7VASYNCHRONOUS256MX16164294967296 bit--1.8V11mm1mm9mmROHS3 CompliantSurface Mount63-VFBGA-40°C~85°C TAMXSMIO™3 (168 Hours)1.7V~1.95V4Gb 256M x 16Non-Volatile25nsFLASHParallel600μs, 25ns--
-
8 WeeksYESTrayActive48--CMOSDUALGULL WING26013V0.5mm40R-PDSO-G4885°C-40°C3.6VINDUSTRIAL2.7VASYNCHRONOUS512MX884294967296 bitPARALLELFLASH2.7V18.4mm1.2mm12mmRoHS Compliant----3 (168 Hours)-------e3MATTE TIN
-
-YESTrayNot For New Designs483A991.B.1.A8542.32.00.51CMOSDUALGULL WING26011.8V0.5mm40R-PDSO-G4885°C-40°C1.95VINDUSTRIAL1.7VASYNCHRONOUS512MX884294967296 bitPARALLELFLASH1.8V18.4mm1.2mm12mmRoHS Compliant----3 (168 Hours)-------e3Matte Tin (Sn)
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