MX30UF2GE8AB-XKI

Macronix MX30UF2GE8AB-XKI

Part Number:
MX30UF2GE8AB-XKI
Manufacturer:
Macronix
Ventron No:
7372460-MX30UF2GE8AB-XKI
Description:
Memory IC 11mm mm
ECAD Model:
Datasheet:
MX30UF2GE8AB-XKI

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Specifications
Macronix MX30UF2GE8AB-XKI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF2GE8AB-XKI.
  • Factory Lead Time
    8 Weeks
  • Surface Mount
    YES
  • Packaging
    Tray
  • Part Status
    Active
  • Number of Terminations
    63
  • ECCN Code
    3A991.B.1.A
  • HTS Code
    8542.32.00.51
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PBGA-B63
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    1.95V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    256MX8
  • Memory Width
    8
  • Memory Density
    2147483648 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    1.8V
  • Length
    11mm
  • Height Seated (Max)
    1mm
  • Width
    9mm
  • RoHS Status
    RoHS Compliant
Description
MX30UF2GE8AB-XKI Overview
In addition, memory ics is available in a Tray case as well. On the chip, there are 63 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.8V. There is a need for a programming voltage of 1.8V in order to modify the state of some nonvolatile memory arrays. This chip has the memory IC type FLASH. Only use it above 85°C. The part is designed to operate at a temperature of -40°C, in any other case, it would malfunction. It's a NAND TYPE device.

MX30UF2GE8AB-XKI Features


MX30UF2GE8AB-XKI Applications
There are a lot of Macronix
MX30UF2GE8AB-XKI Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
MX30UF2GE8AB-XKI More Descriptions
SLC NAND Flash Parallel 1.8V 2Gbit 256M x 8bit 63-Pin VFBGA
IC FLASH 2GBIT PARALLEL 63VFBGA
Product Comparison
The three parts on the right have similar specifications to MX30UF2GE8AB-XKI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Surface Mount
    Packaging
    Part Status
    Number of Terminations
    ECCN Code
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Mounting Type
    Package / Case
    Operating Temperature
    Series
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Memory Size
    Memory Type
    Access Time
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    JESD-609 Code
    Terminal Finish
    View Compare
  • MX30UF2GE8AB-XKI
    MX30UF2GE8AB-XKI
    8 Weeks
    YES
    Tray
    Active
    63
    3A991.B.1.A
    8542.32.00.51
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B63
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    11mm
    1mm
    9mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30UF4G16AC-XKI
    8 Weeks
    YES
    Tape & Reel (TR)
    Active
    63
    -
    -
    FLASH - NAND (SLC)
    BOTTOM
    -
    -
    1
    1.8V
    0.8mm
    -
    R-PBGA-B63
    -
    -
    1.95V
    -
    1.7V
    ASYNCHRONOUS
    256MX16
    16
    4294967296 bit
    -
    -
    1.8V
    11mm
    1mm
    9mm
    ROHS3 Compliant
    Surface Mount
    63-VFBGA
    -40°C~85°C TA
    MXSMIO™
    3 (168 Hours)
    1.7V~1.95V
    4Gb 256M x 16
    Non-Volatile
    25ns
    FLASH
    Parallel
    600μs, 25ns
    -
    -
  • MX30LF4GE8AB-TI
    8 Weeks
    YES
    Tray
    Active
    48
    -
    -
    CMOS
    DUAL
    GULL WING
    260
    1
    3V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    2.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    2.7V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    -
    -
    -
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    e3
    MATTE TIN
  • MX30UF4G18AB-TI
    -
    YES
    Tray
    Not For New Designs
    48
    3A991.B.1.A
    8542.32.00.51
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    -
    -
    -
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    e3
    Matte Tin (Sn)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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