Macronix MX30LF1GE8AB-XKI
- Part Number:
- MX30LF1GE8AB-XKI
- Manufacturer:
- Macronix
- Ventron No:
- 7372031-MX30LF1GE8AB-XKI
- Description:
- Memory IC 11mm mm
- Datasheet:
- MX30LF1GE8AB-XKI
Macronix MX30LF1GE8AB-XKI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30LF1GE8AB-XKI.
- Factory Lead Time8 Weeks
- Surface MountYES
- PackagingTray
- Published2015
- Part StatusActive
- Number of Terminations63
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)40
- JESD-30 CodeR-PBGA-B63
- Operating Temperature (Max)85°C
- Operating Temperature (Min)-40°C
- Supply Voltage-Max (Vsup)3.6V
- Temperature GradeINDUSTRIAL
- Supply Voltage-Min (Vsup)2.7V
- Operating ModeASYNCHRONOUS
- Organization128MX8
- Memory Width8
- Memory Density1073741824 bit
- Parallel/SerialPARALLEL
- Memory IC TypeFLASH
- Programming Voltage2.7V
- Length11mm
- Height Seated (Max)1mm
- Width9mm
- RoHS StatusRoHS Compliant
MX30LF1GE8AB-XKI Overview
In addition, memory ics is available in a Tray case as well. On the chip, there are 63 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 3V. There is a need for a programming voltage of 2.7V in order to modify the state of some nonvolatile memory arrays. This chip has the memory IC type FLASH. Only use it above 85°C. The part is designed to operate at a temperature of -40°C, in any other case, it would malfunction. It's a NAND TYPE device.
MX30LF1GE8AB-XKI Features
MX30LF1GE8AB-XKI Applications
There are a lot of Macronix
MX30LF1GE8AB-XKI Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
In addition, memory ics is available in a Tray case as well. On the chip, there are 63 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 3V. There is a need for a programming voltage of 2.7V in order to modify the state of some nonvolatile memory arrays. This chip has the memory IC type FLASH. Only use it above 85°C. The part is designed to operate at a temperature of -40°C, in any other case, it would malfunction. It's a NAND TYPE device.
MX30LF1GE8AB-XKI Features
MX30LF1GE8AB-XKI Applications
There are a lot of Macronix
MX30LF1GE8AB-XKI Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
MX30LF1GE8AB-XKI More Descriptions
SLC NAND Flash Parallel 3.3V 1Gbit 128M x 8bit 63-Pin VFBGA
NAND TYPE Active PARALLEL BALL ic memory 85C 2.7V 1073741824bit 9mm
1Gb SLC NAND 3CC-FREE 3V 9x11mm and 0.8mm Ball Pitch BGA (-40C to 85C)
IC FLASH 1GBIT PARALLEL 63VFBGA
NAND TYPE Active PARALLEL BALL ic memory 85C 2.7V 1073741824bit 9mm
1Gb SLC NAND 3CC-FREE 3V 9x11mm and 0.8mm Ball Pitch BGA (-40C to 85C)
IC FLASH 1GBIT PARALLEL 63VFBGA
The three parts on the right have similar specifications to MX30LF1GE8AB-XKI.
-
ImagePart NumberManufacturerFactory Lead TimeSurface MountPackagingPublishedPart StatusNumber of TerminationsTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeOperating Temperature (Max)Operating Temperature (Min)Supply Voltage-Max (Vsup)Temperature GradeSupply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityParallel/SerialMemory IC TypeProgramming VoltageLengthHeight Seated (Max)WidthRoHS StatusJESD-609 CodeMoisture Sensitivity Level (MSL)Terminal FinishECCN CodeHTS CodeView Compare
-
MX30LF1GE8AB-XKI8 WeeksYESTray2015Active63CMOSBOTTOMBALL26013V0.8mm40R-PBGA-B6385°C-40°C3.6VINDUSTRIAL2.7VASYNCHRONOUS128MX881073741824 bitPARALLELFLASH2.7V11mm1mm9mmRoHS Compliant------
-
8 WeeksYESTray-Active48CMOSDUALGULL WING26011.8V0.5mm40R-PDSO-G4885°C-40°C1.95VINDUSTRIAL1.7VASYNCHRONOUS256MX882147483648 bitPARALLELFLASH1.8V18.4mm1.2mm12mmRoHS Compliante33 (168 Hours)Matte Tin (Sn)--
-
8 WeeksYESTray-Active48CMOSBOTTOMBALL26011.8V0.8mm40R-PBGA-B4885°C-40°C1.95VINDUSTRIAL1.7VASYNCHRONOUS128MX16162147483648 bitPARALLELFLASH1.8V8mm1mm6mmRoHS Compliant-----
-
-YESTray-Not For New Designs48CMOSDUALGULL WING26011.8V0.5mm40R-PDSO-G4885°C-40°C1.95VINDUSTRIAL1.7VASYNCHRONOUS512MX884294967296 bitPARALLELFLASH1.8V18.4mm1.2mm12mmRoHS Compliante33 (168 Hours)Matte Tin (Sn)3A991.B.1.A8542.32.00.51
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