MX30LF1GE8AB-XKI

Macronix MX30LF1GE8AB-XKI

Part Number:
MX30LF1GE8AB-XKI
Manufacturer:
Macronix
Ventron No:
7372031-MX30LF1GE8AB-XKI
Description:
Memory IC 11mm mm
ECAD Model:
Datasheet:
MX30LF1GE8AB-XKI

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Specifications
Macronix MX30LF1GE8AB-XKI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30LF1GE8AB-XKI.
  • Factory Lead Time
    8 Weeks
  • Surface Mount
    YES
  • Packaging
    Tray
  • Published
    2015
  • Part Status
    Active
  • Number of Terminations
    63
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PBGA-B63
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    3.6V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    128MX8
  • Memory Width
    8
  • Memory Density
    1073741824 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    2.7V
  • Length
    11mm
  • Height Seated (Max)
    1mm
  • Width
    9mm
  • RoHS Status
    RoHS Compliant
Description
MX30LF1GE8AB-XKI Overview
In addition, memory ics is available in a Tray case as well. On the chip, there are 63 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 3V. There is a need for a programming voltage of 2.7V in order to modify the state of some nonvolatile memory arrays. This chip has the memory IC type FLASH. Only use it above 85°C. The part is designed to operate at a temperature of -40°C, in any other case, it would malfunction. It's a NAND TYPE device.

MX30LF1GE8AB-XKI Features


MX30LF1GE8AB-XKI Applications
There are a lot of Macronix
MX30LF1GE8AB-XKI Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
MX30LF1GE8AB-XKI More Descriptions
SLC NAND Flash Parallel 3.3V 1Gbit 128M x 8bit 63-Pin VFBGA
NAND TYPE Active PARALLEL BALL ic memory 85C 2.7V 1073741824bit 9mm
1Gb SLC NAND 3CC-FREE 3V 9x11mm and 0.8mm Ball Pitch BGA (-40C to 85C)
IC FLASH 1GBIT PARALLEL 63VFBGA
Product Comparison
The three parts on the right have similar specifications to MX30LF1GE8AB-XKI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Surface Mount
    Packaging
    Published
    Part Status
    Number of Terminations
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    JESD-609 Code
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    ECCN Code
    HTS Code
    View Compare
  • MX30LF1GE8AB-XKI
    MX30LF1GE8AB-XKI
    8 Weeks
    YES
    Tray
    2015
    Active
    63
    CMOS
    BOTTOM
    BALL
    260
    1
    3V
    0.8mm
    40
    R-PBGA-B63
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    2.7V
    ASYNCHRONOUS
    128MX8
    8
    1073741824 bit
    PARALLEL
    FLASH
    2.7V
    11mm
    1mm
    9mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
  • MX30UF2G18AC-TI
    8 Weeks
    YES
    Tray
    -
    Active
    48
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    e3
    3 (168 Hours)
    Matte Tin (Sn)
    -
    -
  • MX30UF2G16AC-XQI
    8 Weeks
    YES
    Tray
    -
    Active
    48
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    128MX16
    16
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    8mm
    1mm
    6mm
    RoHS Compliant
    -
    -
    -
    -
    -
  • MX30UF4G18AB-TI
    -
    YES
    Tray
    -
    Not For New Designs
    48
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    e3
    3 (168 Hours)
    Matte Tin (Sn)
    3A991.B.1.A
    8542.32.00.51
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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