XCZU9EG-2FFVB1156I

Xilinx Inc. XCZU9EG-2FFVB1156I

Part Number:
XCZU9EG-2FFVB1156I
Manufacturer:
Xilinx Inc.
Ventron No:
3669071-XCZU9EG-2FFVB1156I
Description:
IC FPGA 328 I/O 1156FCBGA
ECAD Model:
Datasheet:
XCZU9EG-2FFVB1156I

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Specifications
Xilinx Inc. XCZU9EG-2FFVB1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU9EG-2FFVB1156I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    Zynq® UltraScale ™ MPSoC EG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    328
  • Speed
    533MHz, 600MHz, 1.3GHz
  • RAM Size
    256KB
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The Embedded - System On Chip (SoC) chip manufactured by Xilinx Inc. falls into the Embedded - System On Chip (SoC) category. It has a speed of 533MHz, 600MHz, and 1.3GHz and an operating temperature range of -40°C to 100°C TJ. The chip is packaged in a tray and is currently active. It has a Moisture Sensitivity Level (MSL) of 4 (72 Hours) and an HTS Code of 8542.31.00.01. The Reflow Temperature-Max (s) is not specified. The chip's core processor is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2. Its peripherals include DMA and WDT, while its connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, and UART/USART.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU9EG-2FFVB1156I System On Chip (SoC) applications.

Vending machines
Samsung galaxy gear
Digital Signal Processing
Networked Media Encode/Decode
Industrial
USB hard disk enclosure
Vending machines
AC drive control module
Apple smart watch
Smartphones
XCZU9EG-2FFVB1156I More Descriptions
FPGA Zynq UltraScale Family 599550 Cells 20nm Technology 0.85V 1156-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 600K, B1156, RoHSXilinx SCT
IC, XILINX FPGA Zynq UltraScale MPSoC 1156 PINS, 1mm PITCH
Microprocessor Circuit, CMOS, PBGA1156
MPSOC, ARM CORTEX-A53/R5, FCBGA-1156
Product Description Demo for Development.
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-1156; Product Range:Zynq Family Ultrascale Series Fpgas; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:1156Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU9EG-2FFVB1156I
Product Comparison
The three parts on the right have similar specifications to XCZU9EG-2FFVB1156I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Published
    View Compare
  • XCZU9EG-2FFVB1156I
    XCZU9EG-2FFVB1156I
    11 Weeks
    1156-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    328
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    -
    -
  • XCZU7EV-1FBVB900E
    11 Weeks
    900-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    2016
  • XCZU19EG-1FFVD1760E
    11 Weeks
    1760-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    308
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
    2016
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    2016
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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