Xilinx Inc. XCZU7CG-2FBVB900E

Name: XCZU7CG-2FBVB900E
Brand: Xilinx Inc.
SKU: 3668963-XCZU7CG-2FBVB900E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU7CG-2FBVB900E

Manufacturer:: Xilinx Inc.

Ventron No:: 3668963-XCZU7CG-2FBVB900E

Description:: IC FPGA 204 I/O 900FCBGA

ECAD Model:

Datasheet:: XCZU7CG-2FBVB900E

Specifications

Xilinx Inc. XCZU7CG-2FBVB900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU7CG-2FBVB900E.

Factory Lead Time
11 Weeks
Package / Case
900-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC CG
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
204
Speed
533MHz, 1.3GHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 504K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The product being offered has a wide operating temperature range of 0°C to 100°C, making it suitable for use in various environments. It is packaged in a tray for easy handling and storage. The part status is active, indicating that it is currently in production and available for purchase. With a moisture sensitivity level of 4 (72 hours), it can withstand moderate levels of moisture exposure. The reflow temperature-max is not specified, allowing for flexibility in the manufacturing process. It has a RAM size of 256KB and is equipped with a dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and dual ARM® Cortex™-R5 with CoreSight™ processors. The product offers connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Its architecture includes both MCU and FPGA components. Additionally, it is ROHS3 compliant, ensuring its compliance with environmental regulations.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU7CG-2FBVB900E System On Chip (SoC) applications.

Level
Transmitters
Functional safety for critical applications in the automotive
RISC-V
Networked sensors
Temperature Sensors
Video Imaging
High-end PLC
PC peripherals
USB hard disk enclosure

XCZU7CG-2FBVB900E More Descriptions

FPGA Zynq UltraScale 504000 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 504K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU7CG-2FBVB900E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU7CG-2FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

yes

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-
XCZU2EG-L1SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

-40°C~100°C TJ

Tray

-

Zynq® UltraScale ™ MPSoC EG

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

180

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

YES

625

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B625

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU7CG-2FBVB900E vs XCZU2EG-L1SFVA625I
XCZU19EG-1FFVD1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

308

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU7CG-2FBVB900E vs XCZU19EG-1FFVD1760E
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

464

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU7CG-2FBVB900E vs XCZU7EV-2FFVF1517I