Xilinx Inc. XCZU6EG-1FFVC900I
- Part Number:
- XCZU6EG-1FFVC900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3668939-XCZU6EG-1FFVC900I
- Description:
- IC FPGA 204 I/O 900FCBGA
- ECAD Model:
-
- Datasheet:
- XCZU6EG-1FFVC900I
Xilinx Inc. XCZU6EG-1FFVC900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU6EG-1FFVC900I.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 469K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Xilinx Inc. is the brand of this part. It is an Embedded - System On Chip (SoC) chip, belonging to the Embedded - System On Chip (SoC) category. The package / case is 900-BBGA, FCBGA. It was published in 2016 and is currently active. The HTS Code is 8542.31.00.01. The peak reflow temperature (Cel) is not specified. It has 204 I/Os. The core processor is Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2. The connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG. The architecture of this chip is MCU, FPGA. Its primary attributes are Zynq® UltraScale ™ FPGA and 469K Logic Cells.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU6EG-1FFVC900I System On Chip (SoC) applications.
Keyboard
Central inverter
Embedded systems
Mobile computing
POS Terminals
Functional safety for critical applications in the aerospace
Central alarm system
Level
Medical
Industrial robot
Xilinx Inc. is the brand of this part. It is an Embedded - System On Chip (SoC) chip, belonging to the Embedded - System On Chip (SoC) category. The package / case is 900-BBGA, FCBGA. It was published in 2016 and is currently active. The HTS Code is 8542.31.00.01. The peak reflow temperature (Cel) is not specified. It has 204 I/Os. The core processor is Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2. The connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG. The architecture of this chip is MCU, FPGA. Its primary attributes are Zynq® UltraScale ™ FPGA and 469K Logic Cells.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU6EG-1FFVC900I System On Chip (SoC) applications.
Keyboard
Central inverter
Embedded systems
Mobile computing
POS Terminals
Functional safety for critical applications in the aerospace
Central alarm system
Level
Medical
Industrial robot
XCZU6EG-1FFVC900I More Descriptions
FPGA Zynq UltraScale Family 469446 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 469K, C900, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 469K, C900, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU6EG-1FFVC900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeView Compare
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XCZU6EG-1FFVC900I11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 469K Logic CellsROHS3 Compliant-- -
11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED360533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliantyes
-
11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant-
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11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-
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