Xilinx Inc. XCZU6CG-L2FFVC900E
- Part Number:
- XCZU6CG-L2FFVC900E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3828058-XCZU6CG-L2FFVC900E
- Description:
- IC FPGA 204 I/O 900FCBGA
- ECAD Model:
-
- Datasheet:
- XCZU6CG-L2FFVC900E
Xilinx Inc. XCZU6CG-L2FFVC900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU6CG-L2FFVC900E.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- Additional FeatureALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- HTS Code8542.31.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.72V
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PBGA-B900
- Supply Voltage-Max (Vsup)0.742V
- Supply Voltage-Min (Vsup)0.698V
- Number of I/O204
- Speed533MHz, 1.3GHz
- RAM Size256KB
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 469K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Xilinx Inc. is the brand of this part. It is an Embedded - System On Chip (SoC) chip, which falls under the Embedded - System On Chip (SoC) category. The package/case is 900-BBGA, FCBGA and it is surface mountable. The operating temperature range is 0°C to 100°C TJ and the part status is active. The terminal form is BALL and the JESD-30 code is R-PBGA-B900. It has 204 I/Os and operates at speeds of 533MHz and 1.3GHz. The core processor consists of Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™. The architecture of this chip is MCU and FPGA.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU6CG-L2FFVC900E System On Chip (SoC) applications.
ARM processors
Temperature Sensors
Video Imaging
Digital Media
Functional safety for critical applications in the aerospace
Mobile computing
Temperature
Mouse
System-on-chip (SoC)
PC peripherals
Xilinx Inc. is the brand of this part. It is an Embedded - System On Chip (SoC) chip, which falls under the Embedded - System On Chip (SoC) category. The package/case is 900-BBGA, FCBGA and it is surface mountable. The operating temperature range is 0°C to 100°C TJ and the part status is active. The terminal form is BALL and the JESD-30 code is R-PBGA-B900. It has 204 I/Os and operates at speeds of 533MHz and 1.3GHz. The core processor consists of Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™. The architecture of this chip is MCU and FPGA.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU6CG-L2FFVC900E System On Chip (SoC) applications.
ARM processors
Temperature Sensors
Video Imaging
Digital Media
Functional safety for critical applications in the aerospace
Mobile computing
Temperature
Mouse
System-on-chip (SoC)
PC peripherals
XCZU6CG-L2FFVC900E More Descriptions
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 469K, C900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1156
FPGA - Field Programmable Gate Array
Microprocessor Circuit, CMOS, PBGA1156
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU6CG-L2FFVC900E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeuPs/uCs/Peripheral ICs TypeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeView Compare
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XCZU6CG-L2FFVC900E11 Weeks900-BBGA, FCBGAYES0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B9000.742V0.698V204533MHz, 1.3GHz256KBMICROPROCESSOR CIRCUITDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 469K Logic CellsROHS3 Compliant-- -
11 Weeks1156-BBGA, FCBGA-0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)--8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED---328533MHz, 1.3GHz256KB-Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes
-
11 Weeks900-BBGA, FCBGAYES-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B9000.742V0.698V204500MHz, 600MHz, 1.2GHz256KBMICROPROCESSOR CIRCUITQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-
-
11 Weeks1517-BBGA, FCBGA--40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)--8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED---464533MHz, 600MHz, 1.3GHz256KB-Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-
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